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GB0710285D0 - Efficient micro-machining apparatus and method for employing multiple laser beams - Google Patents

Efficient micro-machining apparatus and method for employing multiple laser beams

Info

Publication number
GB0710285D0
GB0710285D0 GBGB0710285.8A GB0710285A GB0710285D0 GB 0710285 D0 GB0710285 D0 GB 0710285D0 GB 0710285 A GB0710285 A GB 0710285A GB 0710285 D0 GB0710285 D0 GB 0710285D0
Authority
GB
United Kingdom
Prior art keywords
laser beams
machining apparatus
multiple laser
employing multiple
efficient micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0710285.8A
Other versions
GB2434560A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/000,330 external-priority patent/US20060114948A1/en
Priority claimed from US11/000,333 external-priority patent/US20050224469A1/en
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of GB0710285D0 publication Critical patent/GB0710285D0/en
Publication of GB2434560A publication Critical patent/GB2434560A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/08—Construction or shape of optical resonators or components thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
GB0710285A 2004-11-29 2007-05-30 Efficient micro-machining apparatus and method for employing multiple laser beams Withdrawn GB2434560A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/000,330 US20060114948A1 (en) 2004-11-29 2004-11-29 Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
US11/000,333 US20050224469A1 (en) 2003-06-30 2004-11-29 Efficient micro-machining apparatus and method employing multiple laser beams
PCT/US2005/043112 WO2006062766A2 (en) 2004-11-29 2005-11-29 Efficient micro-machining apparatus and method employing multiple laser beams

Publications (2)

Publication Number Publication Date
GB0710285D0 true GB0710285D0 (en) 2007-07-11
GB2434560A GB2434560A (en) 2007-08-01

Family

ID=36578399

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0710285A Withdrawn GB2434560A (en) 2004-11-29 2007-05-30 Efficient micro-machining apparatus and method for employing multiple laser beams

Country Status (4)

Country Link
KR (1) KR20070085548A (en)
DE (1) DE112005003088T5 (en)
GB (1) GB2434560A (en)
WO (1) WO2006062766A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9029731B2 (en) 2007-01-26 2015-05-12 Electro Scientific Industries, Inc. Methods and systems for laser processing continuously moving sheet material
JP5257924B2 (en) * 2008-04-22 2013-08-07 独立行政法人理化学研究所 Pulse laser generator and pulse laser generation method
DE102010044128A1 (en) 2010-11-18 2012-05-24 Bundesdruckerei Gmbh Laser apparatus and method for processing objects with a controllable in the pulse energy laser
KR102214508B1 (en) 2014-04-28 2021-02-09 삼성전자 주식회사 Method for fabricating of stacked semiconductor package
MX2017016364A (en) * 2015-06-19 2018-04-11 Ipg Photonics Corp Laser welding head with dual movable mirrors providing beam movement.
JP7190808B2 (en) * 2017-11-08 2022-12-16 住友重機械工業株式会社 LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
CN110216382A (en) * 2019-07-05 2019-09-10 北京莱泽光电技术有限公司 Drilling equipment and boring method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4295741A (en) * 1979-08-30 1981-10-20 United Technologies Corporation Two-wavelength phase control system
US5748317A (en) * 1997-01-21 1998-05-05 Brown University Research Foundation Apparatus and method for characterizing thin film and interfaces using an optical heat generator and detector
JP3335868B2 (en) * 1997-03-19 2002-10-21 株式会社東芝 Exposure equipment with optical position measuring device

Also Published As

Publication number Publication date
KR20070085548A (en) 2007-08-27
DE112005003088T5 (en) 2007-10-18
GB2434560A (en) 2007-08-01
WO2006062766A3 (en) 2006-10-12
WO2006062766A2 (en) 2006-06-15

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)