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GB0222175D0 - Early entry - Google Patents

Early entry

Info

Publication number
GB0222175D0
GB0222175D0 GBGB0222175.2A GB0222175A GB0222175D0 GB 0222175 D0 GB0222175 D0 GB 0222175D0 GB 0222175 A GB0222175 A GB 0222175A GB 0222175 D0 GB0222175 D0 GB 0222175D0
Authority
GB
United Kingdom
Prior art keywords
diaphragm
cavities
inter
wafer
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0222175.2A
Other versions
GB2402263A (en
GB2402263A8 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam IPEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/541,753 external-priority patent/US6447379B1/en
Application filed by Speedfam IPEC Corp filed Critical Speedfam IPEC Corp
Publication of GB0222175D0 publication Critical patent/GB0222175D0/en
Publication of GB2402263A publication Critical patent/GB2402263A/en
Publication of GB2402263A8 publication Critical patent/GB2402263A8/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The present invention delineates a carrier for an apparatus (10) which polishes a surface of a semiconductor wafer (56, 124). In a preferred embodiment, the carrier includes a rigid plate (34) connected to one or more diaphragms (40, 42) of soft, flexible material that provide pressurizable cavities (50, 52) having respective surfaces for contacting the back surface of the wafer. A plurality of conduits (28a, 28c) are used to selectively pressurize the diaphragm cavities. The carrier head may also include an inter-diaphragm cavity (54) formed between a portion of one diaphragm, a portion of another diaphragm, and the semiconductor wafer. The inter-diaphragm cavity is provided with its own conduit (28b) by which a source of pressurized fluid and a source of vacuum are selectively connected to the inter-diaphragm cavity. During operation, pressure and/or vacuum may be applied through one or more cavities to chuck (90) a wafer, and to pressurize (96) the cavities during polishing.
GB0222175A 2000-03-31 2001-03-27 Carrier including a multi-volume diaphragm for polishing a semiconductot wafer and a method therefor Withdrawn GB2402263A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/541,753 US6447379B1 (en) 2000-03-31 2000-03-31 Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor
PCT/US2001/007685 WO2004017386A2 (en) 2000-03-31 2001-03-27 Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor

Publications (3)

Publication Number Publication Date
GB0222175D0 true GB0222175D0 (en) 2002-10-30
GB2402263A GB2402263A (en) 2004-12-01
GB2402263A8 GB2402263A8 (en) 2004-12-21

Family

ID=33435307

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0222175A Withdrawn GB2402263A (en) 2000-03-31 2001-03-27 Carrier including a multi-volume diaphragm for polishing a semiconductot wafer and a method therefor

Country Status (3)

Country Link
JP (1) JP2005520357A (en)
AU (1) AU2001298108A1 (en)
GB (1) GB2402263A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11945073B2 (en) * 2019-08-22 2024-04-02 Applied Materials, Inc. Dual membrane carrier head for chemical mechanical polishing

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3158934B2 (en) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 Wafer polishing equipment
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
DE69813374T2 (en) * 1997-05-28 2003-10-23 Tokyo Seimitsu Co. Ltd., Mitaka Semiconductor wafer polishing device with holder ring
JPH11226865A (en) * 1997-12-11 1999-08-24 Speedfam Co Ltd Carrier and cmp device

Also Published As

Publication number Publication date
GB2402263A (en) 2004-12-01
JP2005520357A (en) 2005-07-07
GB2402263A8 (en) 2004-12-21
AU2001298108A1 (en) 2004-03-03

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)