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GB0220792D0 - RF module - Google Patents

RF module

Info

Publication number
GB0220792D0
GB0220792D0 GBGB0220792.6A GB0220792A GB0220792D0 GB 0220792 D0 GB0220792 D0 GB 0220792D0 GB 0220792 A GB0220792 A GB 0220792A GB 0220792 D0 GB0220792 D0 GB 0220792D0
Authority
GB
United Kingdom
Prior art keywords
substrate
module
band
memory
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0220792.6A
Other versions
GB2376806A (en
GB2376806B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000184046A external-priority patent/JP3582460B2/en
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of GB0220792D0 publication Critical patent/GB0220792D0/en
Publication of GB2376806A publication Critical patent/GB2376806A/en
Application granted granted Critical
Publication of GB2376806B publication Critical patent/GB2376806B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0025—Modular arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/06—Receivers
    • H04B1/16—Circuits
    • H04B1/26—Circuits for superheterodyne receivers
    • H04B1/28—Circuits for superheterodyne receivers the receiver comprising at least one semiconductor device having three or more electrodes
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    • H01L2223/6688—Mixed frequency adaptations, i.e. for operation at different frequencies
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Transceivers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

An RF module (10) comprises a multi-layered substrate (12) having first and second side surfaces; a base-band IC (14) and a memory IC (16) mounted on the first side surface and an RF-IC (26) mounted on the second side surface. An RF passive component (36) is formed internally of the substrate (12), and a wiring pattern (32) is incorporated in the substrate (12), the wiring pattern interconnecting the base-band IC (14) and the memory IC (16). A shielding ground electrode pattern (38) is formed internally of the substrate (12), interposed between the first and second surfaces. An antenna may also be included in the substrate. The module provides a compact unit for use in communication devices such as a mobile phone.
GB0220792A 2000-06-20 2001-06-06 RF module Expired - Lifetime GB2376806B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000184046A JP3582460B2 (en) 2000-06-20 2000-06-20 High frequency module
GB0113761A GB2365629B (en) 2000-06-20 2001-06-06 Rf module

Publications (3)

Publication Number Publication Date
GB0220792D0 true GB0220792D0 (en) 2002-10-16
GB2376806A GB2376806A (en) 2002-12-24
GB2376806B GB2376806B (en) 2003-05-28

Family

ID=26246161

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0220792A Expired - Lifetime GB2376806B (en) 2000-06-20 2001-06-06 RF module

Country Status (1)

Country Link
GB (1) GB2376806B (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100197187B1 (en) * 1995-04-05 1999-06-15 모리 가즈히로 High frequency power amplifier circuit device
US6301122B1 (en) * 1996-06-13 2001-10-09 Matsushita Electric Industrial Co., Ltd. Radio frequency module with thermally and electrically coupled metal film on insulating substrate
US5949383A (en) * 1997-10-20 1999-09-07 Ericsson Inc. Compact antenna structures including baluns
JP2000133765A (en) * 1998-10-23 2000-05-12 Sony Corp High-frequency integrated circuit device

Also Published As

Publication number Publication date
GB2376806A (en) 2002-12-24
GB2376806B (en) 2003-05-28

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Expiry date: 20210605