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FR3137526B1 - POWER MODULE - Google Patents

POWER MODULE Download PDF

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Publication number
FR3137526B1
FR3137526B1 FR2206692A FR2206692A FR3137526B1 FR 3137526 B1 FR3137526 B1 FR 3137526B1 FR 2206692 A FR2206692 A FR 2206692A FR 2206692 A FR2206692 A FR 2206692A FR 3137526 B1 FR3137526 B1 FR 3137526B1
Authority
FR
France
Prior art keywords
track
switches
tabs
power module
low side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2206692A
Other languages
French (fr)
Other versions
FR3137526A1 (en
Inventor
Laurent Massol
Ky Lim Tan
Frutos Xavier De
Didier Canitrot
Jean-Michel Morelle
Gregory Godefroy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Equipements Electriques Moteur SAS
Original Assignee
Valeo Equipements Electriques Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Equipements Electriques Moteur SAS filed Critical Valeo Equipements Electriques Moteur SAS
Priority to FR2206692A priority Critical patent/FR3137526B1/en
Publication of FR3137526A1 publication Critical patent/FR3137526A1/en
Application granted granted Critical
Publication of FR3137526B1 publication Critical patent/FR3137526B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/41—Structure, shape, material or disposition of the strap connectors after the connecting process of a plurality of strap connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L’invention concerne un module de puissance (300) qui comporte : une piste positive (P+), une piste de phase (PP) et une piste négative (P-) ; des interrupteurs de côté haut (HS) alignés et des interrupteurs de côté bas (LS) alignés. La piste négative (P-) s’étend entre la piste positive (P+) et la piste de phase (PP) et le module de puissance (300) comporte une barrette conductrice électrique de côté haut (304) sur les interrupteurs de côté haut (HS) et comportant plusieurs pattes (306) plaquées contre la piste de phase (PP), et une barrette conductrice électrique de côté bas (310) sur les interrupteurs de côté bas (LS) et comportant plusieurs pattes (312) plaquées contre la piste négative (P-), les pattes (306, 312) des deux barrettes (304, 310) sont intercalées de manière à alterner, parallèlement aux alignements d’interrupteurs (HS, LS), entre pattes (306) de la barrette de côté haut (304) et pattes (312) de la barrette de côté bas (310). Figure pour l’abrégé : Fig. 3A power module (300) is provided with: a positive track (P+), a phase track (PP) and a negative track (P-); high side (HS) switches aligned and low side (LS) switches aligned. The negative track (P-) extends between the positive track (P+) and the phase track (PP) and the power module (300) has a high side electrical conductor strip (304) on the high side switches (HS) and comprising several tabs (306) pressed against the phase track (PP), and a low side electrical conductive strip (310) on the low side switches (LS) and comprising several tabs (312) pressed against the negative track (P-), the tabs (306, 312) of the two strips (304, 310) are interposed so as to alternate, parallel to the alignments of switches (HS, LS), between tabs (306) of the strip of high side (304) and tabs (312) of the low side bar (310). Figure for abstract: Fig. 3

FR2206692A 2022-06-30 2022-06-30 POWER MODULE Active FR3137526B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR2206692A FR3137526B1 (en) 2022-06-30 2022-06-30 POWER MODULE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2206692 2022-06-30
FR2206692A FR3137526B1 (en) 2022-06-30 2022-06-30 POWER MODULE

Publications (2)

Publication Number Publication Date
FR3137526A1 FR3137526A1 (en) 2024-01-05
FR3137526B1 true FR3137526B1 (en) 2024-06-21

Family

ID=84359638

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2206692A Active FR3137526B1 (en) 2022-06-30 2022-06-30 POWER MODULE

Country Status (1)

Country Link
FR (1) FR3137526B1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1316999A1 (en) * 2001-11-28 2003-06-04 Continental ISAD Electronic Systems GmbH & Co. oHG Method and device of contacting power electronic devices
EP3573096B1 (en) * 2011-06-27 2022-03-16 Rohm Co., Ltd. Semiconductor module
JP7264855B2 (en) * 2020-08-26 2023-04-25 矢崎総業株式会社 SUBSTRATE, SEMICONDUCTOR MODULE AND SUBSTRATE MODULE

Also Published As

Publication number Publication date
FR3137526A1 (en) 2024-01-05

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