FR3106695B1 - Method for sealing a microelectronic device - Google Patents
Method for sealing a microelectronic device Download PDFInfo
- Publication number
- FR3106695B1 FR3106695B1 FR2000799A FR2000799A FR3106695B1 FR 3106695 B1 FR3106695 B1 FR 3106695B1 FR 2000799 A FR2000799 A FR 2000799A FR 2000799 A FR2000799 A FR 2000799A FR 3106695 B1 FR3106695 B1 FR 3106695B1
- Authority
- FR
- France
- Prior art keywords
- microelectronic device
- sealing
- formation
- series
- steps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004377 microelectronic Methods 0.000 title abstract 4
- 238000007789 sealing Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- 230000015572 biosynthetic process Effects 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Titre : procédé pour l’étanchéité d’un dispositif microélectronique L’invention concerne un procédé de fabrication d’un dispositif microélectronique comprenant la formation d’un revêtement d’étanchéité (2, 9) au contact d’une surface d’une partie du dispositif microélectronique, caractérisé en ce que la formation du revêtement d’étanchéité (2, 9) comprend la formation d’un empilement (21, 91) de couches d’oxyde sur la surface par une pluralité d’étapes de dépôt de couche atomique, directement successives, chacune configurée pour former une couche (211, 212 ; 911, 912) à base d’un ou plusieurs oxydes, et en ce qu’une première série d’au moins une étape de la pluralité d’étapes présente une vitesse de dépôt strictement inférieure à celle d’une deuxième série, directement successive à la première série, d’au moins une étape de la pluralité d’étapes. Figure pour l’abrégé : Fig.11Title: method for sealing a microelectronic device The invention relates to a method for manufacturing a microelectronic device comprising the formation of a sealing coating (2, 9) in contact with a surface of a of the microelectronic device, characterized in that the formation of the sealing coating (2, 9) comprises the formation of a stack (21, 91) of oxide layers on the surface by a plurality of layer deposition steps atomic, directly successive, each configured to form a layer (211, 212; 911, 912) based on one or more oxides, and in that a first series of at least one step of the plurality of steps has a deposition rate strictly lower than that of a second series, directly successive to the first series, of at least one step of the plurality of steps. Figure for the abstract: Fig.11
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2000799A FR3106695B1 (en) | 2020-01-28 | 2020-01-28 | Method for sealing a microelectronic device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2000799A FR3106695B1 (en) | 2020-01-28 | 2020-01-28 | Method for sealing a microelectronic device |
| FR2000799 | 2020-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR3106695A1 FR3106695A1 (en) | 2021-07-30 |
| FR3106695B1 true FR3106695B1 (en) | 2022-02-25 |
Family
ID=70295362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR2000799A Expired - Fee Related FR3106695B1 (en) | 2020-01-28 | 2020-01-28 | Method for sealing a microelectronic device |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR3106695B1 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5220106B2 (en) * | 2007-06-22 | 2013-06-26 | ザ・リージエンツ・オブ・ザ・ユニバーシティ・オブ・コロラド | Protective coatings for organic electronic devices manufactured using atomic layer deposition and molecular layer deposition methods |
-
2020
- 2020-01-28 FR FR2000799A patent/FR3106695B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| FR3106695A1 (en) | 2021-07-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PLFP | Fee payment |
Year of fee payment: 2 |
|
| PLSC | Publication of the preliminary search report |
Effective date: 20210730 |
|
| PLFP | Fee payment |
Year of fee payment: 3 |
|
| PLFP | Fee payment |
Year of fee payment: 4 |
|
| ST | Notification of lapse |
Effective date: 20240905 |