[go: up one dir, main page]

FR3075559B1 - Unite electronique de puissance et convertisseur de tension le comprenant - Google Patents

Unite electronique de puissance et convertisseur de tension le comprenant Download PDF

Info

Publication number
FR3075559B1
FR3075559B1 FR1762373A FR1762373A FR3075559B1 FR 3075559 B1 FR3075559 B1 FR 3075559B1 FR 1762373 A FR1762373 A FR 1762373A FR 1762373 A FR1762373 A FR 1762373A FR 3075559 B1 FR3075559 B1 FR 3075559B1
Authority
FR
France
Prior art keywords
electronic component
power unit
voltage converter
electronic power
converter including
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1762373A
Other languages
English (en)
Other versions
FR3075559A1 (fr
Inventor
Aurelien Pouilly
Gael Blondel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Systemes de Controle Moteur SAS
Original Assignee
Valeo Systemes de Controle Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes de Controle Moteur SAS filed Critical Valeo Systemes de Controle Moteur SAS
Priority to FR1762373A priority Critical patent/FR3075559B1/fr
Publication of FR3075559A1 publication Critical patent/FR3075559A1/fr
Application granted granted Critical
Publication of FR3075559B1 publication Critical patent/FR3075559B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/32227—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the layer connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/40227—Connecting the strap to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Inverter Devices (AREA)

Abstract

L'invention se rapporte à une unité électronique (10), notamment destinée à être intégrée dans une machine électrique pour véhicule automobile, comprenant : - un support comprenant au moins une trace conductrice électriquement, au moins un composant électronique agencé sur ladite trace, dans laquelle le support et le au moins un composant électronique sont au moins en partie surmoulés, l'épaisseur du surmoulage (22) étant ajustée en fonction de l'agencement d'un élément de liaison électrique dudit au moins un composant électronique et/ou dudit au moins un composant électronique sur le support.
FR1762373A 2017-12-18 2017-12-18 Unite electronique de puissance et convertisseur de tension le comprenant Active FR3075559B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1762373A FR3075559B1 (fr) 2017-12-18 2017-12-18 Unite electronique de puissance et convertisseur de tension le comprenant

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1762373 2017-12-18
FR1762373A FR3075559B1 (fr) 2017-12-18 2017-12-18 Unite electronique de puissance et convertisseur de tension le comprenant

Publications (2)

Publication Number Publication Date
FR3075559A1 FR3075559A1 (fr) 2019-06-21
FR3075559B1 true FR3075559B1 (fr) 2020-09-04

Family

ID=61802109

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1762373A Active FR3075559B1 (fr) 2017-12-18 2017-12-18 Unite electronique de puissance et convertisseur de tension le comprenant

Country Status (1)

Country Link
FR (1) FR3075559B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3104891B1 (fr) * 2019-12-11 2021-11-19 Valeo Equip Electr Moteur Ensemble électrique et convertisseur de tension

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5708300A (en) * 1995-09-05 1998-01-13 Woosley; Alan H. Semiconductor device having contoured package body profile
EP0939379A4 (fr) * 1997-07-18 2002-01-30 Dainippon Printing Co Ltd Module a circuit integre, carte a circuit integre, resine d'etancheite pour module a circuit integre, et procede de fabrication d'un module a circuit integre
WO2012031703A1 (fr) * 2010-09-06 2012-03-15 Heraeus Noblelight Gmbh Procédé pour recouvrir un module puce-sur-plaque optoélectronique d'un revêtement
US8753926B2 (en) * 2010-09-14 2014-06-17 Qualcomm Incorporated Electronic packaging with a variable thickness mold cap
DE102015200219A1 (de) * 2015-01-09 2016-07-14 Robert Bosch Gmbh Verfahren zum Herstellen eines Elektronikmoduls insbesondere eines Getriebesteuermoduls
US20160317068A1 (en) * 2015-04-30 2016-11-03 Verily Life Sciences Llc Electronic devices with encapsulating silicone based adhesive

Also Published As

Publication number Publication date
FR3075559A1 (fr) 2019-06-21

Similar Documents

Publication Publication Date Title
MA38047B1 (fr) Port de charge spécialisé pour la haute tension
FR3044842B1 (fr) Architecture electronique destinee a alimenter une machine electrique pour vehicule automobile
WO2007046720A3 (fr) Dispositif de connecteur de cable pour batterie
MA31499B1 (fr) Systeme de fabrication d'un faisceau de cables
EP1944645A3 (fr) Dispositif à cristaux liquides utilisant champs de dispersion et bornes pour le montage de composants
FR3013435B1 (fr) Dispositif de support d'un tube, notamment d'un tube d'un echangeur de chaleur destine a venir en contact d'une batterie de vehicule automobile
FR3075559B1 (fr) Unite electronique de puissance et convertisseur de tension le comprenant
FR3050066B1 (fr) Cable electrique presentant une resistance a la corrosion galvanique amelioree
WO2009024709A3 (fr) Dispositif de redressement de courant pour machine electrique tournante et machine electrique tournante comportant un tel dispositif
FR3076095B1 (fr) Element de boitier pour equipement electrique
FR3044862B1 (fr) Support d'une carte electronique, ensemble d'une carte electronique et d'un tel support, convertisseur de tension le comprenant et machine electrique pour vehicule automobile le comprenant
FR3019398B1 (fr) Capteur de temperature pour stator de machine electrique et machine electrique comportant un tel capteur
FR3040564B1 (fr) Ensemble comprenant un dispositif de connexion et un organe d'etancheite
FR3053847B1 (fr) Demi-connecteur sous-marin et connecteur sous-marin comprenant un tel demi-connecteur
FR3062247B1 (fr) Boitier de distribution de puissance electrique pour un aeronef
FR3083024B1 (fr) Dispositif d'interconnexion pour une machine electrique tournante destinee a un vehicule automobile
FR2973604B1 (fr) Dispositif de fixation d'un conducteur electrique dans un compresseur
ATE450920T1 (de) Klemmenkasten für einen elektromotor
FR3105644B1 (fr) Stator comprenant un interconnecteur
FR3064827B1 (fr) Connecteur electrique pour composant electrique d'un vehicule automobile comprenant au moins deux dispositifs d'etancheite
FR3076178B1 (fr) Unite electronique de puissance et convertisseur de tension le comportant
FR3083170B1 (fr) Ensemble d’habitacle de véhicule
FR3081486B1 (fr) Clef pour vehicule automobile comprenant une membrane en silicone
FR3040837B1 (fr) Unite de controle destinee a controler une machine electrique
FR3068185B1 (fr) Assemblage mecanique avec isolation electrique entre une machine electrique tournante et sa partie electronique

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20190621

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8