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FR3065114B1 - ELECTRICAL DEVICE AND METHOD FOR ASSEMBLING THE ELECTRICAL DEVICE - Google Patents

ELECTRICAL DEVICE AND METHOD FOR ASSEMBLING THE ELECTRICAL DEVICE Download PDF

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Publication number
FR3065114B1
FR3065114B1 FR1753150A FR1753150A FR3065114B1 FR 3065114 B1 FR3065114 B1 FR 3065114B1 FR 1753150 A FR1753150 A FR 1753150A FR 1753150 A FR1753150 A FR 1753150A FR 3065114 B1 FR3065114 B1 FR 3065114B1
Authority
FR
France
Prior art keywords
electrical device
electronic
electronic unit
raised portion
assembling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1753150A
Other languages
French (fr)
Other versions
FR3065114A1 (en
Inventor
Emmanuel Talon
Mimoun Askeur
Timothee Voos
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Systemes de Controle Moteur SAS
Original Assignee
Valeo Systemes de Controle Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes de Controle Moteur SAS filed Critical Valeo Systemes de Controle Moteur SAS
Priority to FR1753150A priority Critical patent/FR3065114B1/en
Publication of FR3065114A1 publication Critical patent/FR3065114A1/en
Application granted granted Critical
Publication of FR3065114B1 publication Critical patent/FR3065114B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Power Conversion In General (AREA)
  • Dc-Dc Converters (AREA)
  • Inverter Devices (AREA)

Abstract

L'invention a pour objet un dispositif électrique (10), notamment pour un convertisseur de tension, le dispositif électrique (10) comprenant : - une unité électronique (20) comprenant au moins un orifice traversant (22), - un composant électronique (30) supporté par l'unité électronique (20), au moins une partie d'une face (32) du composant électronique, dite face de contact, étant agencée en vis-à-vis du au moins un orifice traversant (22) de l'unité électronique (20), - une pièce (40) formant un drain thermique, réalisée en matériau conducteur thermiquement, la pièce (40) comprenant une portion en relief (42), dans lequel la portion en relief (42) de la pièce (40) coopère avec l'orifice traversant (22) de l'unité électronique (20) de sorte que la portion en relief (42) de la pièce (40) est en contact avec la face (32) de contact du composant électronique (30).The invention relates to an electrical device (10), in particular for a voltage converter, the electrical device (10) comprising: - an electronic unit (20) comprising at least one through orifice (22), - an electronic component ( 30) supported by the electronic unit (20), at least part of a face (32) of the electronic component, called the contact face, being arranged opposite the at least one through orifice (22) of the electronic unit (20), - a part (40) forming a heat sink, made of thermally conductive material, the part (40) comprising a raised portion (42), in which the raised portion (42) of the part (40) cooperates with the through hole (22) of the electronic unit (20) so that the raised portion (42) of the part (40) is in contact with the contact face (32) of the component electronic (30).

FR1753150A 2017-04-11 2017-04-11 ELECTRICAL DEVICE AND METHOD FOR ASSEMBLING THE ELECTRICAL DEVICE Active FR3065114B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1753150A FR3065114B1 (en) 2017-04-11 2017-04-11 ELECTRICAL DEVICE AND METHOD FOR ASSEMBLING THE ELECTRICAL DEVICE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1753150 2017-04-11
FR1753150A FR3065114B1 (en) 2017-04-11 2017-04-11 ELECTRICAL DEVICE AND METHOD FOR ASSEMBLING THE ELECTRICAL DEVICE

Publications (2)

Publication Number Publication Date
FR3065114A1 FR3065114A1 (en) 2018-10-12
FR3065114B1 true FR3065114B1 (en) 2019-12-20

Family

ID=59031185

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1753150A Active FR3065114B1 (en) 2017-04-11 2017-04-11 ELECTRICAL DEVICE AND METHOD FOR ASSEMBLING THE ELECTRICAL DEVICE

Country Status (1)

Country Link
FR (1) FR3065114B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3093396A1 (en) * 2019-02-28 2020-09-04 Valeo Systemes Thermiques ELECTRONIC BOARD AND ASSOCIATED ASSEMBLY TO CONTROL A MOTOR-FAN GROUP OF A MOTOR VEHICLE

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5920458A (en) * 1997-05-28 1999-07-06 Lucent Technologies Inc. Enhanced cooling of a heat dissipating circuit element
KR100555546B1 (en) * 2004-01-08 2006-03-03 삼성전자주식회사 Integrated circuit cooling device and disk drive having same
JP4433875B2 (en) * 2004-05-14 2010-03-17 オムロン株式会社 Heat dissipating structure of heat generating component and method of manufacturing heat dissipating member in this heat dissipating structure
SE529673C2 (en) * 2004-09-20 2007-10-16 Danaher Motion Stockholm Ab Circuit arrangement for cooling surface-mounted semiconductors
US8592825B2 (en) * 2010-07-27 2013-11-26 Sumitomo Electric Industries Ltd. Semiconductor device having Si-substrate and process to form the same
FR2984679B1 (en) * 2011-12-15 2015-03-06 Valeo Sys Controle Moteur Sas THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING CONNECTION BETWEEN AT LEAST ONE ELECTRONIC COMPONENT AND A RADIATOR IN ALL OR METALLIC PORTION
CN103167787B (en) * 2013-03-13 2016-03-02 温州市三立电子科技有限公司 Electric vehicle controller and comprise the vehicle of described electric vehicle controller
JP6457206B2 (en) * 2014-06-19 2019-01-23 株式会社ジェイデバイス Semiconductor package and manufacturing method thereof

Also Published As

Publication number Publication date
FR3065114A1 (en) 2018-10-12

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