FR3048288B1 - Detecteur electronique integre de variations de potentiel a haute sensibilite - Google Patents
Detecteur electronique integre de variations de potentiel a haute sensibilite Download PDFInfo
- Publication number
- FR3048288B1 FR3048288B1 FR1651570A FR1651570A FR3048288B1 FR 3048288 B1 FR3048288 B1 FR 3048288B1 FR 1651570 A FR1651570 A FR 1651570A FR 1651570 A FR1651570 A FR 1651570A FR 3048288 B1 FR3048288 B1 FR 3048288B1
- Authority
- FR
- France
- Prior art keywords
- configuration
- integrated electronic
- mos transistor
- high sensitivity
- electronic sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000035945 sensitivity Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
- H10D84/401—Combinations of FETs or IGBTs with BJTs
- H10D84/403—Combinations of FETs or IGBTs with BJTs and with one or more of diodes, resistors or capacitors
- H10D84/409—Combinations of FETs or IGBTs with lateral BJTs and with one or more of diodes, resistors or capacitors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
- G01N27/4145—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS specially adapted for biomolecules, e.g. gate electrode with immobilised receptors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/512—Disposition of the gate electrodes, e.g. buried gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
- H10D84/401—Combinations of FETs or IGBTs with BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D87/00—Integrated devices comprising both bulk components and either SOI or SOS components on the same substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/48—Biological material, e.g. blood, urine; Haemocytometers
- G01N33/483—Physical analysis of biological material
- G01N33/487—Physical analysis of biological material of liquid biological material
- G01N33/49—Blood
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
- G01R19/16504—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values characterised by the components employed
- G01R19/16519—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values characterised by the components employed using FET's
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Molecular Biology (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
- Measurement Of Current Or Voltage (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
Le détecteur électronique intégré est configuré pour détecter l'apparition d'une variation de potentiel sur sa borne d'entrée et comporte un transistor MOS (11) dont le drain (D) forme une borne de sortie, et dans lequel la variation du courant de drain (Id) est représentative de ladite variation de potentiel sur la borne d'entrée. Le détecteur comprend en outre un transistor bipolaire (12) dont la base forme la borne d'entrée et dont le collecteur (C) est électriquement connecté à la grille (G) du transistor MOS, et possède une première configuration dans laquelle le transistor bipolaire (12) est passant et le transistor MOS est bloqué, et une deuxième configuration dans laquelle le transistor bipolaire (12) est bloqué et le transistor MOS (11) est dans un fonctionnement sous-seuil, le détecteur étant configuré pour passer de sa première configuration à sa deuxième configuration lors de l'apparition de ladite variation de potentiel.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1651570A FR3048288B1 (fr) | 2016-02-25 | 2016-02-25 | Detecteur electronique integre de variations de potentiel a haute sensibilite |
US15/251,009 US10074649B2 (en) | 2016-02-25 | 2016-08-30 | High-sensitivity electronic detector |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1651570A FR3048288B1 (fr) | 2016-02-25 | 2016-02-25 | Detecteur electronique integre de variations de potentiel a haute sensibilite |
FR1651570 | 2016-02-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3048288A1 FR3048288A1 (fr) | 2017-09-01 |
FR3048288B1 true FR3048288B1 (fr) | 2018-03-23 |
Family
ID=57348744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1651570A Expired - Fee Related FR3048288B1 (fr) | 2016-02-25 | 2016-02-25 | Detecteur electronique integre de variations de potentiel a haute sensibilite |
Country Status (2)
Country | Link |
---|---|
US (1) | US10074649B2 (fr) |
FR (1) | FR3048288B1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11482521B2 (en) * | 2020-02-06 | 2022-10-25 | Globalfoundries U.S. Inc. | Integrated circuit with P-N-P junction and vertically aligned field effect transistor, and method to form same |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51101478A (fr) * | 1975-03-04 | 1976-09-07 | Suwa Seikosha Kk | |
US5087579A (en) * | 1987-05-28 | 1992-02-11 | Texas Instruments Incorporated | Method for fabricating an integrated bipolar-CMOS circuit isolation for providing different backgate and substrate bias |
US5256582A (en) * | 1989-02-10 | 1993-10-26 | Texas Instruments Incorporated | Method of forming complementary bipolar and MOS transistor having power and logic structures on the same integrated circuit substrate |
US5171699A (en) * | 1990-10-03 | 1992-12-15 | Texas Instruments Incorporated | Vertical DMOS transistor structure built in an N-well CMOS-based BiCMOS process and method of fabrication |
US5296409A (en) * | 1992-05-08 | 1994-03-22 | National Semiconductor Corporation | Method of making n-channel and p-channel junction field-effect transistors and CMOS transistors using a CMOS or bipolar/CMOS process |
JPH06163907A (ja) * | 1992-11-20 | 1994-06-10 | Hitachi Ltd | 電圧駆動型半導体装置 |
US5936454A (en) * | 1993-06-01 | 1999-08-10 | Motorola, Inc. | Lateral bipolar transistor operating with independent base and gate biasing |
US5717241A (en) * | 1993-12-09 | 1998-02-10 | Northern Telecom Limited | Gate controlled lateral bipolar junction transistor |
US5764106A (en) * | 1993-12-09 | 1998-06-09 | Northern Telecom Limited | Gain-controlled amplifier and automatic gain control amplifier using GCLBT |
JP3325396B2 (ja) * | 1994-08-19 | 2002-09-17 | 株式会社東芝 | 半導体集積回路 |
US6071768A (en) * | 1996-05-17 | 2000-06-06 | Texas Instruments Incorporated | Method of making an efficient NPN turn-on in a high voltage DENMOS transistor for ESD protection |
EP0809293B1 (fr) * | 1996-05-21 | 2001-08-29 | Co.Ri.M.Me. Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno | Structure semi-conductrice de puissance avec transistor latéral commandé par un transistor vertical |
FR2789519B1 (fr) * | 1999-02-05 | 2003-03-28 | Commissariat Energie Atomique | Transistor mos a tension de seuil dynamique equipe d'un limiteur de courant, et procede de realisation d'un tel transistor |
JP4128700B2 (ja) * | 1999-09-08 | 2008-07-30 | ローム株式会社 | 誘導性負荷駆動回路 |
JP4091785B2 (ja) * | 2001-12-13 | 2008-05-28 | 三菱電機株式会社 | 半導体回路 |
JP2005005446A (ja) * | 2003-06-11 | 2005-01-06 | Renesas Technology Corp | 半導体装置およびその製造方法 |
US7489490B2 (en) * | 2006-06-07 | 2009-02-10 | International Rectifier Corporation | Current limiting MOSFET structure for solid state relays |
US8063443B2 (en) * | 2007-10-30 | 2011-11-22 | Fairchild Semiconductor Corporation | Hybrid-mode LDMOS |
JP4632068B2 (ja) * | 2008-05-30 | 2011-02-16 | 三菱電機株式会社 | 半導体装置 |
US7989875B2 (en) * | 2008-11-24 | 2011-08-02 | Nxp B.V. | BiCMOS integration of multiple-times-programmable non-volatile memories |
JP4822292B2 (ja) * | 2008-12-17 | 2011-11-24 | 三菱電機株式会社 | 半導体装置 |
KR101050761B1 (ko) * | 2010-02-19 | 2011-07-21 | 경북대학교 산학협력단 | 배열형 수평 바이폴라 트랜지스터를 이용한 수소이온 감지소자 |
US8884682B2 (en) * | 2011-04-04 | 2014-11-11 | Renesas Electronics Corporation | Power semiconductor device |
US20130240744A1 (en) * | 2011-05-03 | 2013-09-19 | Trusted Semiconductor Solutions, Inc. | Neutron detection chip assembly |
FR2993406B1 (fr) * | 2012-07-13 | 2014-08-22 | Commissariat Energie Atomique | Circuit integre sur soi comprenant un transistor bipolaire a tranchees d'isolation de profondeurs distinctes |
US9214542B2 (en) * | 2013-03-11 | 2015-12-15 | Freescale Semiconductor, Inc. | Semiconductor device with integrated electrostatic discharge (ESD) clamp |
US10209215B2 (en) * | 2013-06-20 | 2019-02-19 | K.Eklund Innovation | Integrated circuit sensor device for charge detection hybridizing a lateral metal oxide semiconductor field effect transistor (MOSFET) and a vertical bipolar junction transistor (BJT) |
-
2016
- 2016-02-25 FR FR1651570A patent/FR3048288B1/fr not_active Expired - Fee Related
- 2016-08-30 US US15/251,009 patent/US10074649B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
FR3048288A1 (fr) | 2017-09-01 |
US10074649B2 (en) | 2018-09-11 |
US20170248543A1 (en) | 2017-08-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20170901 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 5 |
|
ST | Notification of lapse |
Effective date: 20211005 |