FR3038133B1 - Cellule memoire a changement de phase ayant une structure compacte - Google Patents
Cellule memoire a changement de phase ayant une structure compacteInfo
- Publication number
- FR3038133B1 FR3038133B1 FR1555733A FR1555733A FR3038133B1 FR 3038133 B1 FR3038133 B1 FR 3038133B1 FR 1555733 A FR1555733 A FR 1555733A FR 1555733 A FR1555733 A FR 1555733A FR 3038133 B1 FR3038133 B1 FR 3038133B1
- Authority
- FR
- France
- Prior art keywords
- memory cell
- phase change
- change memory
- compact structure
- compact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/061—Shaping switching materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/253—Multistable switching devices, e.g. memristors having three or more electrodes, e.g. transistor-like devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/823—Device geometry adapted for essentially horizontal current flow, e.g. bridge type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
- H10N70/8265—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices on sidewalls of dielectric structures, e.g. mesa-shaped or cup-shaped devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
- H10N70/8413—Electrodes adapted for resistive heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/79—Array wherein the access device being a transistor
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/82—Array having, for accessing a cell, a word line, a bit line and a plate or source line receiving different potentials
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1555733A FR3038133B1 (fr) | 2015-06-23 | 2015-06-23 | Cellule memoire a changement de phase ayant une structure compacte |
US15/098,025 US9735353B2 (en) | 2015-06-23 | 2016-04-13 | Phase-change memory cell having a compact structure |
US15/654,405 US20170317275A1 (en) | 2015-06-23 | 2017-07-19 | Phase-change memory cell having a compact structure |
US16/457,855 US11031550B2 (en) | 2015-06-23 | 2019-06-28 | Phase-change memory cell having a compact structure |
US17/328,917 US11957067B2 (en) | 2015-06-23 | 2021-05-24 | Phase-change memory cell having a compact structure |
US18/506,383 US20240081160A1 (en) | 2015-06-23 | 2023-11-10 | Phase-change memory cell having a compact structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1555733A FR3038133B1 (fr) | 2015-06-23 | 2015-06-23 | Cellule memoire a changement de phase ayant une structure compacte |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3038133A1 FR3038133A1 (fr) | 2016-12-30 |
FR3038133B1 true FR3038133B1 (fr) | 2017-08-25 |
Family
ID=54356455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1555733A Expired - Fee Related FR3038133B1 (fr) | 2015-06-23 | 2015-06-23 | Cellule memoire a changement de phase ayant une structure compacte |
Country Status (2)
Country | Link |
---|---|
US (5) | US9735353B2 (fr) |
FR (1) | FR3038133B1 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3038133B1 (fr) * | 2015-06-23 | 2017-08-25 | St Microelectronics Crolles 2 Sas | Cellule memoire a changement de phase ayant une structure compacte |
EP3261141A1 (fr) * | 2016-06-24 | 2017-12-27 | STMicroelectronics Srl | Cellule de mémoire à changement de phase et procédé de fabrication de la cellule de mémoire à changement de phase |
FR3066310B1 (fr) * | 2017-05-12 | 2020-01-24 | Stmicroelectronics (Rousset) Sas | Cellule memoire de type ram resistive |
FR3073319A1 (fr) | 2017-11-09 | 2019-05-10 | Stmicroelectronics (Grenoble 2) Sas | Puce a memoire non volatile embarquee a materiau a changement de phase |
US10580977B2 (en) * | 2018-07-24 | 2020-03-03 | International Business Machines Corporation | Tightly integrated 1T1R ReRAM for planar technology |
CN114430006A (zh) * | 2020-10-29 | 2022-05-03 | 意法半导体(克洛尔2)公司 | 相变存储器 |
CN116437670A (zh) * | 2021-12-29 | 2023-07-14 | 长鑫存储技术有限公司 | 半导体结构及其制备方法 |
JP2023127756A (ja) * | 2022-03-02 | 2023-09-14 | キオクシア株式会社 | 抵抗変化型不揮発性メモリ |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0982912A (ja) | 1995-09-13 | 1997-03-28 | Toshiba Corp | 半導体記憶装置及びその製造方法 |
US6545287B2 (en) * | 2001-09-07 | 2003-04-08 | Intel Corporation | Using selective deposition to form phase-change memory cells |
US7042749B2 (en) * | 2002-05-16 | 2006-05-09 | Micron Technology, Inc. | Stacked 1T-nmemory cell structure |
ATE410774T1 (de) | 2005-05-19 | 2008-10-15 | Koninkl Philips Electronics Nv | Verfahren zum regeln des zuerst schmelzenden bereiches einer pcm-zelle und damit hergestellte vorrichtungen |
EP1845567A1 (fr) * | 2006-04-11 | 2007-10-17 | STMicroelectronics S.r.l. | Dispositif de mémoire à changement de phase et procédé associé |
US7538411B2 (en) * | 2006-04-26 | 2009-05-26 | Infineon Technologies Ag | Integrated circuit including resistivity changing memory cells |
US7479671B2 (en) * | 2006-08-29 | 2009-01-20 | International Business Machines Corporation | Thin film phase change memory cell formed on silicon-on-insulator substrate |
US8258493B2 (en) * | 2006-11-20 | 2012-09-04 | Panasonic Corporation | Nonvolatile semiconductor memory apparatus and manufacturing method thereof |
US8513637B2 (en) | 2007-07-13 | 2013-08-20 | Macronix International Co., Ltd. | 4F2 self align fin bottom electrodes FET drive phase change memory |
US8043888B2 (en) * | 2008-01-18 | 2011-10-25 | Freescale Semiconductor, Inc. | Phase change memory cell with heater and method therefor |
KR101415509B1 (ko) * | 2008-07-24 | 2014-07-04 | 삼성전자주식회사 | 메모리 소자, 그 제조 방법 및 동작 방법 |
JP2010251529A (ja) * | 2009-04-16 | 2010-11-04 | Sony Corp | 半導体記憶装置およびその製造方法 |
JP2012204404A (ja) * | 2011-03-23 | 2012-10-22 | Toshiba Corp | 抵抗変化型不揮発性半導体記憶装置 |
US8987700B2 (en) * | 2011-12-02 | 2015-03-24 | Macronix International Co., Ltd. | Thermally confined electrode for programmable resistance memory |
US8698118B2 (en) * | 2012-02-29 | 2014-04-15 | Globalfoundries Singapore Pte Ltd | Compact RRAM device and methods of making same |
US9455343B2 (en) | 2013-09-27 | 2016-09-27 | Intel Corporation | Hybrid phase field effect transistor |
KR102114202B1 (ko) * | 2013-11-25 | 2020-05-26 | 삼성전자주식회사 | 가변 저항 메모리 소자 및 그 형성 방법 |
FR3038133B1 (fr) * | 2015-06-23 | 2017-08-25 | St Microelectronics Crolles 2 Sas | Cellule memoire a changement de phase ayant une structure compacte |
-
2015
- 2015-06-23 FR FR1555733A patent/FR3038133B1/fr not_active Expired - Fee Related
-
2016
- 2016-04-13 US US15/098,025 patent/US9735353B2/en active Active
-
2017
- 2017-07-19 US US15/654,405 patent/US20170317275A1/en not_active Abandoned
-
2019
- 2019-06-28 US US16/457,855 patent/US11031550B2/en active Active
-
2021
- 2021-05-24 US US17/328,917 patent/US11957067B2/en active Active
-
2023
- 2023-11-10 US US18/506,383 patent/US20240081160A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20190326510A1 (en) | 2019-10-24 |
US20210280779A1 (en) | 2021-09-09 |
US20170317275A1 (en) | 2017-11-02 |
US11957067B2 (en) | 2024-04-09 |
US20240081160A1 (en) | 2024-03-07 |
US20160380190A1 (en) | 2016-12-29 |
US11031550B2 (en) | 2021-06-08 |
FR3038133A1 (fr) | 2016-12-30 |
US9735353B2 (en) | 2017-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20161230 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 5 |
|
PLFP | Fee payment |
Year of fee payment: 6 |
|
ST | Notification of lapse |
Effective date: 20220205 |