[go: up one dir, main page]

FR2967367B1 - Tampon a polir composite contenant du silicate - Google Patents

Tampon a polir composite contenant du silicate

Info

Publication number
FR2967367B1
FR2967367B1 FR1160257A FR1160257A FR2967367B1 FR 2967367 B1 FR2967367 B1 FR 2967367B1 FR 1160257 A FR1160257 A FR 1160257A FR 1160257 A FR1160257 A FR 1160257A FR 2967367 B1 FR2967367 B1 FR 2967367B1
Authority
FR
France
Prior art keywords
buffer containing
composite polymer
containing silicate
polymer buffer
silicate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1160257A
Other languages
English (en)
Other versions
FR2967367A1 (fr
Inventor
Andrew R Wank
Donna M Alden
Joseph K So
Robert Gargione
Mark E Gazze
David Drop
Colin F Cameron Jr
Mai Tieu Banh
Shawn Riley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DUPONT ELECTRONIC MATERIALS HOLDING, INC., US
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR2967367A1 publication Critical patent/FR2967367A1/fr
Application granted granted Critical
Publication of FR2967367B1 publication Critical patent/FR2967367B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
FR1160257A 2010-11-12 2011-11-10 Tampon a polir composite contenant du silicate Active FR2967367B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/945,557 US8257152B2 (en) 2010-11-12 2010-11-12 Silicate composite polishing pad

Publications (2)

Publication Number Publication Date
FR2967367A1 FR2967367A1 (fr) 2012-05-18
FR2967367B1 true FR2967367B1 (fr) 2015-05-22

Family

ID=45999137

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1160257A Active FR2967367B1 (fr) 2010-11-12 2011-11-10 Tampon a polir composite contenant du silicate

Country Status (7)

Country Link
US (1) US8257152B2 (fr)
JP (1) JP5845833B2 (fr)
KR (1) KR101915318B1 (fr)
CN (1) CN102528647B (fr)
DE (1) DE102011117867A1 (fr)
FR (1) FR2967367B1 (fr)
TW (1) TWI515082B (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8894732B2 (en) * 2012-05-11 2014-11-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Hollow polymeric-alkaline earth metal oxide composite
US9073172B2 (en) 2012-05-11 2015-07-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Alkaline-earth metal oxide-polymeric polishing pad
US8888877B2 (en) 2012-05-11 2014-11-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Forming alkaline-earth metal oxide polishing pad
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9731398B2 (en) * 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
US11524390B2 (en) 2017-05-01 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Methods of making chemical mechanical polishing layers having improved uniformity
CN112743443A (zh) * 2019-10-29 2021-05-04 山西钜星超硬工具制品有限公司 一种珩磨油石
CN112812743A (zh) * 2019-11-15 2021-05-18 圣戈班磨料磨具有限公司 磨料制品及其形成方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL162006C (nl) * 1973-09-26 Norddeutsche Schleifmittel Ind Slijpwerktuig.
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5334335A (en) * 1992-10-19 1994-08-02 Clearfix Corporation Compositions and methods for repairing and removing scratches and other imperfections from plastic surfaces
US5934478A (en) * 1995-07-25 1999-08-10 Canon Kabushiki Kaisha Gas stream classifier and process for producing toner
US5976000A (en) * 1996-05-28 1999-11-02 Micron Technology, Inc. Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
GB2334205B (en) * 1998-02-12 2001-11-28 Shinetsu Handotai Kk Polishing method for semiconductor wafer and polishing pad used therein
US6585574B1 (en) * 1998-06-02 2003-07-01 Brian Lombardo Polishing pad with reduced moisture absorption
US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
US6641463B1 (en) * 1999-02-06 2003-11-04 Beaver Creek Concepts Inc Finishing components and elements
US6454644B1 (en) * 2000-07-31 2002-09-24 Ebara Corporation Polisher and method for manufacturing same and polishing tool
US6659846B2 (en) * 2001-09-17 2003-12-09 Agere Systems, Inc. Pad for chemical mechanical polishing
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7579071B2 (en) * 2002-09-17 2009-08-25 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
US20050176251A1 (en) * 2004-02-05 2005-08-11 Duong Chau H. Polishing pad with releasable slick particles
US7195544B2 (en) * 2004-03-23 2007-03-27 Cabot Microelectronics Corporation CMP porous pad with component-filled pores
TWI293266B (en) * 2004-05-05 2008-02-11 Iv Technologies Co Ltd A single-layer polishing pad and a method of producing the same
US20060154579A1 (en) * 2005-01-12 2006-07-13 Psiloquest Thermoplastic chemical mechanical polishing pad and method of manufacture
US7591865B2 (en) * 2005-01-28 2009-09-22 Saint-Gobain Abrasives, Inc. Method of forming structured abrasive article
US20070049164A1 (en) * 2005-08-26 2007-03-01 Thomson Clifford O Polishing pad and method for manufacturing polishing pads
RU2301141C1 (ru) * 2005-11-30 2007-06-20 Открытое акционерное общество "ФОМОС-МАТЕРИАЛС" Способ обработки подложек монокристаллического лантангаллиевого силиката
TW200817497A (en) * 2006-08-14 2008-04-16 Nippon Chemical Ind Polishing composition for semiconductor wafer, production method thereof, and polishing method
US8083820B2 (en) * 2006-12-22 2011-12-27 3M Innovative Properties Company Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same
JP2009184858A (ja) * 2008-02-04 2009-08-20 Nippon Chem Ind Co Ltd ヒドラジンが固定化されたシリカ粒子よりなるコロイダルシリカ
TW201016391A (en) * 2008-10-20 2010-05-01 Bestac Advanced Material Co Ltd Polishing pad having abrasive grains and method for making the same

Also Published As

Publication number Publication date
US20120122381A1 (en) 2012-05-17
CN102528647A (zh) 2012-07-04
CN102528647B (zh) 2014-12-24
TW201228769A (en) 2012-07-16
US8257152B2 (en) 2012-09-04
DE102011117867A1 (de) 2012-05-16
KR101915318B1 (ko) 2018-11-05
JP2012101354A (ja) 2012-05-31
KR20120057517A (ko) 2012-06-05
TWI515082B (zh) 2016-01-01
FR2967367A1 (fr) 2012-05-18
JP5845833B2 (ja) 2016-01-20

Similar Documents

Publication Publication Date Title
FR2967367B1 (fr) Tampon a polir composite contenant du silicate
DK3130609T5 (da) Sammensætning omfattende et geleringsmiddel plus glucan
BRDI7005236S (pt) Configuração aplicada em garrafa
DK2569319T3 (da) Heteroaryl-cyclohexyl-tetraazabenzo[e]azulener
PL2491356T3 (pl) System i urządzenie związane z pakowaniem
EP2634548A4 (fr) Contenant
EP2532351A4 (fr) Agent pour améliorer la motilité
BRDI7005834S (pt) Configuração aplicada em garrafa
UA22142S (uk) Упаковка
BR112013004046A2 (pt) estrutura absorvente a fluído
BR112013004785A2 (pt) agente citoprotetor
BR112013012232A2 (pt) fibra inorgânica
BRDI7103671S (pt) Configuração aplicada a frasco
FI20100094A0 (fi) Kerrostettu muoviputki
UA21350S (uk) М`яка упаковка
UA21204S (uk) М`яка упаковка
ITPD20100041U1 (it) Tampone riducente
UA19007S (uk) Упаковка для морепродуктів
FI9194U1 (fi) Pakkaus
UA21349S (uk) Упаковка
UA20407S (uk) Упаковка
UA20522S (uk) Упаковка
UA20624S (uk) Упакування
UA21067S (uk) Упаковка
UA21107S (uk) Упаковка

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8

PLFP Fee payment

Year of fee payment: 9

PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 14

CD Change of name or company name

Owner name: DUPONT ELECTRONIC MATERIALS HOLDING, INC., US

Effective date: 20241108