[go: up one dir, main page]

FR2946036B1 - Procede d'integration de micro-interrupteurs de type mems sur des substrats en gan comportant des composants electroniques de puissance - Google Patents

Procede d'integration de micro-interrupteurs de type mems sur des substrats en gan comportant des composants electroniques de puissance

Info

Publication number
FR2946036B1
FR2946036B1 FR0902522A FR0902522A FR2946036B1 FR 2946036 B1 FR2946036 B1 FR 2946036B1 FR 0902522 A FR0902522 A FR 0902522A FR 0902522 A FR0902522 A FR 0902522A FR 2946036 B1 FR2946036 B1 FR 2946036B1
Authority
FR
France
Prior art keywords
electronic power
power components
type micro
micro switches
gan substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0902522A
Other languages
English (en)
Other versions
FR2946036A1 (fr
Inventor
Afshin Ziaei
Baillif Matthieu Le
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Priority to FR0902522A priority Critical patent/FR2946036B1/fr
Priority to PCT/EP2010/056278 priority patent/WO2010136322A1/fr
Priority to EP10718178A priority patent/EP2566807A1/fr
Priority to US13/696,569 priority patent/US8859318B2/en
Publication of FR2946036A1 publication Critical patent/FR2946036A1/fr
Application granted granted Critical
Publication of FR2946036B1 publication Critical patent/FR2946036B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/01Switches
    • B81B2201/012Switches characterised by the shape
    • B81B2201/016Switches characterised by the shape having a bridge fixed on two ends and connected to one or more dimples
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00Forming microstructural systems
    • B81C2203/07Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0735Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00Electrostatic relays; Electro-adhesion relays
    • H01H59/0009Electrostatic relays; Electro-adhesion relays making use of micromechanics

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Pressure Sensors (AREA)
FR0902522A 2009-05-26 2009-05-26 Procede d'integration de micro-interrupteurs de type mems sur des substrats en gan comportant des composants electroniques de puissance Active FR2946036B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR0902522A FR2946036B1 (fr) 2009-05-26 2009-05-26 Procede d'integration de micro-interrupteurs de type mems sur des substrats en gan comportant des composants electroniques de puissance
PCT/EP2010/056278 WO2010136322A1 (fr) 2009-05-26 2010-05-07 PROCEDE D'INTEGRATION DE MICRO-INTERRUPTEURS DE TYPE MEMS SUR DES SUBSTRATS EN GaN COMPORTANT DES COMPOSANTS ELECTRONIQUES DE PUISSANCE
EP10718178A EP2566807A1 (fr) 2009-05-26 2010-05-07 PROCEDE D'INTEGRATION DE MICRO-INTERRUPTEURS DE TYPE MEMS SUR DES SUBSTRATS EN GaN COMPORTANT DES COMPOSANTS ELECTRONIQUES DE PUISSANCE
US13/696,569 US8859318B2 (en) 2009-05-26 2010-05-07 Method for integrating MEMS microswitches on GaN substrates comprising electronic power components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0902522A FR2946036B1 (fr) 2009-05-26 2009-05-26 Procede d'integration de micro-interrupteurs de type mems sur des substrats en gan comportant des composants electroniques de puissance

Publications (2)

Publication Number Publication Date
FR2946036A1 FR2946036A1 (fr) 2010-12-03
FR2946036B1 true FR2946036B1 (fr) 2011-11-25

Family

ID=41460168

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0902522A Active FR2946036B1 (fr) 2009-05-26 2009-05-26 Procede d'integration de micro-interrupteurs de type mems sur des substrats en gan comportant des composants electroniques de puissance

Country Status (4)

Country Link
US (1) US8859318B2 (fr)
EP (1) EP2566807A1 (fr)
FR (1) FR2946036B1 (fr)
WO (1) WO2010136322A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9917244B2 (en) 2014-06-17 2018-03-13 The Regents Of The University Of Michigan Resonant body high electron mobility transistor
US9798132B2 (en) * 2014-06-17 2017-10-24 Infineon Technologies Ag Membrane structures for microelectromechanical pixel and display devices and systems, and methods for forming membrane structures and related devices

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6232150B1 (en) * 1998-12-03 2001-05-15 The Regents Of The University Of Michigan Process for making microstructures and microstructures made thereby
CN1292447C (zh) * 2001-11-09 2006-12-27 图恩斯通系统公司 具有三层横梁的mems器件
US7514759B1 (en) * 2004-04-19 2009-04-07 Hrl Laboratories, Llc Piezoelectric MEMS integration with GaN technology
WO2007131796A2 (fr) * 2006-05-17 2007-11-22 Microgan Gmbh Actionneurs micromécaniques en semi-conducteurs à base de nitrures du groupe iii

Also Published As

Publication number Publication date
WO2010136322A1 (fr) 2010-12-02
EP2566807A1 (fr) 2013-03-13
US8859318B2 (en) 2014-10-14
FR2946036A1 (fr) 2010-12-03
US20130056751A1 (en) 2013-03-07

Similar Documents

Publication Publication Date Title
FR2954505B1 (fr) Structure micromecanique comportant une partie mobile presentant des butees pour des deplacements hors plan de la structure et son procede de realisation
PL2212072T3 (pl) Sposób wytwarzania mat mocujących do mocowania elementu kontroli zanieczyszczenia
DK2162617T3 (da) Fuldstændigt neddykket apparat til omdannelse af bølgeenergi
GB2463180B (en) Method for bonding two bonding partners
DK2462637T3 (da) Fremgangsmåde til fremstilling af en elektromekanisk transducer
PT2347053E (pt) Elemento de separação para áreas de tráfego
PL2176185T3 (pl) Sposób trwałego połączenia dwóch składników przez lutowanie lutem szklanym lub metalowym
EP2246978A4 (fr) Procédé de fabrication d'un élément d'onde élastique
ZA201200979B (en) Low shear mounting for pollution control devices
BR112012000358A2 (pt) meio para remoção de contaminantes de correntes de fluidos e método para fazer e usar o mesmo
FI20075920A7 (fi) Menetelmä kuparirikasteen jalostamiseksi
PL2258499T3 (pl) Urządzenie do ciągłego młotkowania odlewów wytwarzanych w procesie ciągłego odlewania
FR2949171B1 (fr) Procede d'assemblage de deux composants electroniques
FR2953989B1 (fr) Procede de formation de materiaux metalliques comportant des semi-conducteurs
DK2317877T3 (da) Fremgangsmåde til filtrering af mælk
BRPI0812123A2 (pt) Método para produção de membros de transferência transmissíveis por ondas elétricas
FR2953064B1 (fr) Procede d'encapsulation de composants electroniques sur tranche
GB0615403D0 (en) Apparatus For Converting Energy From Wave Or Current Flow
FR2927743B1 (fr) Circuit de filtrage comportant des resonateurs acoustiques couples
EP2396095A4 (fr) Disque d'extraction sur phase solide et procédé de fabrication
BR112012010523A2 (pt) acionador operado por mola para um aparelho de comutação elétrica
FR2946036B1 (fr) Procede d'integration de micro-interrupteurs de type mems sur des substrats en gan comportant des composants electroniques de puissance
DK2408560T3 (da) Mikrofluidsystem til isolering af partikler
FR2945680B1 (fr) Actionneur lineaire electromecanique pour turbomachine
EP2426238A4 (fr) PROCÉDÉ DE FABRICATION D'UN SUBSTRAT DE SiC

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 8

PLFP Fee payment

Year of fee payment: 9

PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 14

PLFP Fee payment

Year of fee payment: 15

PLFP Fee payment

Year of fee payment: 16

PLFP Fee payment

Year of fee payment: 17