FR2914497B1 - Structure de composants haute frequence a faibles capacites parasites - Google Patents
Structure de composants haute frequence a faibles capacites parasitesInfo
- Publication number
- FR2914497B1 FR2914497B1 FR0754221A FR0754221A FR2914497B1 FR 2914497 B1 FR2914497 B1 FR 2914497B1 FR 0754221 A FR0754221 A FR 0754221A FR 0754221 A FR0754221 A FR 0754221A FR 2914497 B1 FR2914497 B1 FR 2914497B1
- Authority
- FR
- France
- Prior art keywords
- parasites
- high frequency
- frequency components
- low capacity
- capacity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/411—PN diodes having planar bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/221—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0754221A FR2914497B1 (fr) | 2007-04-02 | 2007-04-02 | Structure de composants haute frequence a faibles capacites parasites |
US12/059,600 US8269252B2 (en) | 2007-04-02 | 2008-03-31 | Structure of high-frequency components with low stray capacitances |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0754221A FR2914497B1 (fr) | 2007-04-02 | 2007-04-02 | Structure de composants haute frequence a faibles capacites parasites |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2914497A1 FR2914497A1 (fr) | 2008-10-03 |
FR2914497B1 true FR2914497B1 (fr) | 2009-06-12 |
Family
ID=38626319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0754221A Expired - Fee Related FR2914497B1 (fr) | 2007-04-02 | 2007-04-02 | Structure de composants haute frequence a faibles capacites parasites |
Country Status (2)
Country | Link |
---|---|
US (1) | US8269252B2 (fr) |
FR (1) | FR2914497B1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3029686A1 (fr) * | 2014-12-08 | 2016-06-10 | St Microelectronics Tours Sas | Dispositif radiofrequence protege contre des surtensions |
US10283463B2 (en) * | 2017-04-11 | 2019-05-07 | International Business Machines Corporation | Terahertz detector comprised of P-N junction diode |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0099979B1 (fr) * | 1982-07-26 | 1987-04-08 | LGZ LANDIS & GYR ZUG AG | Détecteur de champ magnétique et son application |
JPS6173345A (ja) * | 1984-09-19 | 1986-04-15 | Toshiba Corp | 半導体装置 |
US5241210A (en) * | 1987-02-26 | 1993-08-31 | Kabushiki Kaisha Toshiba | High breakdown voltage semiconductor device |
US5344785A (en) * | 1992-03-13 | 1994-09-06 | United Technologies Corporation | Method of forming high speed, high voltage fully isolated bipolar transistors on a SOI substrate |
US5841169A (en) | 1996-06-27 | 1998-11-24 | Harris Corporation | Integrated circuit containing devices dielectrically isolated and junction isolated from a substrate |
JPH10270567A (ja) * | 1997-03-21 | 1998-10-09 | Oki Electric Ind Co Ltd | トランジスタ保護素子 |
JP2001345428A (ja) * | 2000-03-27 | 2001-12-14 | Toshiba Corp | 半導体装置とその製造方法 |
US6429502B1 (en) * | 2000-08-22 | 2002-08-06 | Silicon Wave, Inc. | Multi-chambered trench isolated guard ring region for providing RF isolation |
JP2002100761A (ja) * | 2000-09-21 | 2002-04-05 | Mitsubishi Electric Corp | シリコンmosfet高周波半導体デバイスおよびその製造方法 |
US6562666B1 (en) * | 2000-10-31 | 2003-05-13 | International Business Machines Corporation | Integrated circuits with reduced substrate capacitance |
FR2830123A1 (fr) * | 2001-09-26 | 2003-03-28 | St Microelectronics Sa | Peripherie haute tension |
-
2007
- 2007-04-02 FR FR0754221A patent/FR2914497B1/fr not_active Expired - Fee Related
-
2008
- 2008-03-31 US US12/059,600 patent/US8269252B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20080237785A1 (en) | 2008-10-02 |
FR2914497A1 (fr) | 2008-10-03 |
US8269252B2 (en) | 2012-09-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL278805A (en) | Selective bass post filter | |
EP2377202A4 (fr) | Ouverture d'antenne à double fréquence | |
EP2643863A4 (fr) | Résonateur piézoélectrique | |
EP2140549A4 (fr) | Stabilisation de signal d'oscillateur | |
DK2318396T5 (da) | Krystalform af posaconazol | |
EP2245738A4 (fr) | Résonateur micromécanique | |
DK2274417T3 (da) | Cellulær produktion af glucarsyre | |
BRPI0910673A2 (pt) | separador vibratório | |
FI20105434A0 (fi) | Lämpötilakompensoitu mikromekaanista oskillaattoria käyttävä taajuusreferenssi | |
FR2930076B1 (fr) | Biopile a rendement ameliore | |
DK2545333T3 (da) | Dybfryser | |
EP2224602A4 (fr) | Commutateur haute fréquence | |
EP2284988A4 (fr) | Oscillateur | |
FI20105772L (fi) | Resonaattorisuodin | |
FI20095361L (fi) | Taajuusmuuttajan käynnistys | |
FR2952486B1 (fr) | Oscillateur radiofrequence | |
DE112009001672A5 (de) | Stimmbare Klarinettenbirne | |
EP2751817A4 (fr) | Condensateur variable à mems possédant de meilleures performances rf | |
FR2964499B1 (fr) | Ligne de transmission haute frequence accordable | |
FR2961354B1 (fr) | Antenne haute frequence | |
FR2932334B1 (fr) | Resonateur hbar a integration elevee | |
FI7573U1 (fi) | Taajuusmuuttaja | |
BR112012010239A2 (pt) | acoplador para sintonizar cavidades ressonantes | |
FR2914497B1 (fr) | Structure de composants haute frequence a faibles capacites parasites | |
FI20075715A0 (fi) | Taajuusjakajan konfiguraatio |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20131231 |