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FR2901408A1 - Conductive substrate e.g. lead frame, and electronic component e.g. power module, connecting device, has conductive substrate circulating high power currents and including thin part i.e. tongue, formed in substrate in form of loop - Google Patents

Conductive substrate e.g. lead frame, and electronic component e.g. power module, connecting device, has conductive substrate circulating high power currents and including thin part i.e. tongue, formed in substrate in form of loop Download PDF

Info

Publication number
FR2901408A1
FR2901408A1 FR0608480A FR0608480A FR2901408A1 FR 2901408 A1 FR2901408 A1 FR 2901408A1 FR 0608480 A FR0608480 A FR 0608480A FR 0608480 A FR0608480 A FR 0608480A FR 2901408 A1 FR2901408 A1 FR 2901408A1
Authority
FR
France
Prior art keywords
conductive substrate
substrate
tongue
lead frame
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
FR0608480A
Other languages
French (fr)
Inventor
Roland Dutoya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive France SAS
Original Assignee
Siemens VDO Automotive SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens VDO Automotive SAS filed Critical Siemens VDO Automotive SAS
Priority to FR0608480A priority Critical patent/FR2901408A1/en
Publication of FR2901408A1 publication Critical patent/FR2901408A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/2405—Shape
    • H01L2224/24051—Conformal with the semiconductor or solid-state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4009—Loop shape
    • H01L2224/40091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/842—Applying energy for connecting
    • H01L2224/84201—Compression bonding
    • H01L2224/84205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The device has a conductive substrate e.g. lead frame (11), circulating high power currents and including a thin part i.e. tongue (10), in form of a loop. The tongue formed in the substrate is fixed on a contact zone of an electronic component e.g. power module (12), at a free end of the tongue. A printed circuit board (14) is connected to the substrate using a press-fit process. A heat sink (13) is positioned below the substrate and the component.

Description

2 La connexion électrique ainsi réalisée entre une partie du "lead frame"2 The electrical connection thus made between a part of the lead frame

lui même et un module de puissance permet de faire circuler des courants de fortes puissances sans échauffements thermique excessifs. Cette connexion électrique est plus fiable et surtout moins onéreuse.  it itself and a power module makes it possible to circulate currents of high power without excessive thermal overheating. This electrical connection is more reliable and especially less expensive.

D'autres objets, caractéristiques et avantage de la présente invention, ressortiront d'ailleurs de la description qui suit à titre d'exemple non limitatif et en référence aux figures annexées, dans lesquelles: - La figure 1 est une vue en coupe du dispositif de connexion selon l'invention, et - La figure 2 est une vue de dessus du dispositif représenté à la figure 1. Selon l'exemple de réalisation représenté aux figures 1 et 2, le dispositif de connexion selon l'invention est réalisé dans un substrat conducteur encore appelé "lead frame" 11. Ce "lead frame" 11 comporte une partie amincie 10 en forme de languette. Cette languette est en forme de boucle de sorte à créer une certaine souplesse (élasticité) au niveau de cette partie amincie. La languette 10 supporte autant les dilations thermiques que les fils de "bonding" classiques. La languette 10 est ainsi directement réalisée dans le "lead frame" et est adaptée pour venir se fixer sur une zone de contact du module de puissance 12 au niveau de son extrémité libre. La fixation à vocation de connexion électrique est réalisée par soudure laser, par exemple. Dans l'exemple représenté un circuit imprimé 14 est également connecté au "lead f rame" 11 par un procédé de montage en force (technologie appelée press fit). En outre un radiateur 13 est placé sous le composant électronique et le "lead frame". On notera que des languettes peuvent être également prévues pour relier le "lead frame" au circuit imprimé, Comme cela est mieux visible à la figure 2 la largeur des pattes des languettes est adaptée à la puissance du courant qui les parcourt. De ce fait les languettes peuvent présenter des largeurs différentes. Elles peuvent également être multiples et montées en parallèle. On notera qu'un tel dispositif de connexion permet de réduire le nombre d'interconnexions entre le module de puissance (ici il s'agit d'un module SiPLIT), un calculateur électronique et un circuit imprimé. Le nombre d'étapes de fabrication est également réduit. En outre un tel dispositif de connexion ne nécessite pas de préparation spécifique des zones de contact sur le "Iead f rame" et sur le module de puissance. Un tel dispositif de connexion est compatible avec un procédé de montage en force (press fit) des connexions sur le circuit imprimé 3 Etant constitué de matériaux de nature homogène, un tel dispositif n'exige pas de protection chimique particulière. Bien entendu, la présente invention n'est pas limitée à une connexion avec un module de puissance. Le lead frame (substrat conducteur) peut être relié 5 à tous types de composant électronique.  Other objects, features and advantages of the present invention will become apparent from the following description by way of nonlimiting example and with reference to the appended figures, in which: - Figure 1 is a sectional view of the device connection device according to the invention, and - Figure 2 is a top view of the device shown in Figure 1. According to the embodiment shown in Figures 1 and 2, the connection device according to the invention is made in a conductive substrate also called "lead frame" 11. This "lead frame" 11 has a thin portion 10 in the form of tongue. This tongue is in the form of a loop so as to create a certain flexibility (elasticity) at this thinned portion. Tab 10 supports both thermal expansion and conventional bonding wires. The tongue 10 is thus directly formed in the "lead frame" and is adapted to be fixed on a contact zone of the power module 12 at its free end. The attachment for electrical connection purpose is performed by laser welding, for example. In the example shown, a printed circuit 14 is also connected to the "lead f rame" 11 by a force-fitting method (technology called press fit). In addition, a radiator 13 is placed under the electronic component and the "lead frame". It will be noted that tongues may also be provided for connecting the lead frame to the printed circuit board. As is better seen in FIG. 2, the width of the tabs of the tongues is adapted to the power of the current flowing through them. As a result, the tongues may have different widths. They can also be multiple and mounted in parallel. It will be noted that such a connection device makes it possible to reduce the number of interconnections between the power module (here it is a SiPLIT module), an electronic calculator and a printed circuit. The number of manufacturing steps is also reduced. In addition, such a connection device does not require specific preparation of the contact zones on the "Iead f rame" and on the power module. Such a connection device is compatible with a method of press fit of the connections on the printed circuit 3 Being made of homogeneous materials, such a device does not require any particular chemical protection. Of course, the present invention is not limited to a connection with a power module. The lead frame can be connected to all types of electronic components.

Claims (2)

REVENDICATIONS 1. Dispositif de connexion entre un substrat conducteur et un composant électronique, le dit substrat conducteur étant adapté pour faire circuler des courants de fortes puissances, caractérisé en ce que le substrat conducteur comporte une partie amincie, en forme de boucle, une extrémité libre de cette boucle étant adaptée pour être fixée à un composant électronique.  1. A connection device between a conductive substrate and an electronic component, said conductive substrate being adapted to circulate currents of high power, characterized in that the conductive substrate comprises a thinned portion, in the form of a loop, a free end of this loop being adapted to be attached to an electronic component. 2. Dispositif selon la revendication 1, caractérisé en ce que la partie amincie présente la forme d'une languette adaptée pour sa bonne connexion électrique et mécanique au composant électronique.  2. Device according to claim 1, characterized in that the thinned portion has the shape of a tongue adapted for its good electrical and mechanical connection to the electronic component.
FR0608480A 2006-09-27 2006-09-27 Conductive substrate e.g. lead frame, and electronic component e.g. power module, connecting device, has conductive substrate circulating high power currents and including thin part i.e. tongue, formed in substrate in form of loop Pending FR2901408A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0608480A FR2901408A1 (en) 2006-09-27 2006-09-27 Conductive substrate e.g. lead frame, and electronic component e.g. power module, connecting device, has conductive substrate circulating high power currents and including thin part i.e. tongue, formed in substrate in form of loop

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0608480A FR2901408A1 (en) 2006-09-27 2006-09-27 Conductive substrate e.g. lead frame, and electronic component e.g. power module, connecting device, has conductive substrate circulating high power currents and including thin part i.e. tongue, formed in substrate in form of loop

Publications (1)

Publication Number Publication Date
FR2901408A1 true FR2901408A1 (en) 2007-11-23

Family

ID=37969818

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0608480A Pending FR2901408A1 (en) 2006-09-27 2006-09-27 Conductive substrate e.g. lead frame, and electronic component e.g. power module, connecting device, has conductive substrate circulating high power currents and including thin part i.e. tongue, formed in substrate in form of loop

Country Status (1)

Country Link
FR (1) FR2901408A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5872403A (en) * 1997-01-02 1999-02-16 Lucent Technologies, Inc. Package for a power semiconductor die and power supply employing the same
EP0966038A2 (en) * 1998-06-15 1999-12-22 Ford Motor Company Bonding of semiconductor power devices
US20010044167A1 (en) * 2000-05-18 2001-11-22 Frank Kuo Power semiconductor package and method for making the same
US6593527B1 (en) * 2002-04-17 2003-07-15 Delphi Technologies, Inc. Integrated circuit assembly with bar bond attachment
US20060038265A1 (en) * 2004-08-17 2006-02-23 Oberlin Gary E Multi-path bar bond connector for an integrated circuit assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5872403A (en) * 1997-01-02 1999-02-16 Lucent Technologies, Inc. Package for a power semiconductor die and power supply employing the same
EP0966038A2 (en) * 1998-06-15 1999-12-22 Ford Motor Company Bonding of semiconductor power devices
US20010044167A1 (en) * 2000-05-18 2001-11-22 Frank Kuo Power semiconductor package and method for making the same
US6593527B1 (en) * 2002-04-17 2003-07-15 Delphi Technologies, Inc. Integrated circuit assembly with bar bond attachment
US20060038265A1 (en) * 2004-08-17 2006-02-23 Oberlin Gary E Multi-path bar bond connector for an integrated circuit assembly

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