FR2853144A1 - Electronic component e.g. radio communication module for mobile telephone, has card to card connector with two connection contacts to insulate partly RF signal transmission contact as per principle similar to Faradays principle - Google Patents

Abstract

The invention relates to an electronic component intended to be attached to a support, comprising a card to single card connection element, having a plurality of structurally identical contacts, among which, a first connection contact is dedicated to the transmission of radio signals. frequencies, at least two second neighboring connection contacts of said first contact are connected to ground, so as to at least partially isolate said first contact and at least a third contact is dedicated to digital signal transmissions.

Description

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 Single connector electronic component comprising radio frequency signals and digital signals, support, electronic system and corresponding implementation method.

 The field of the invention is that of the production and assembly of electronic systems, comprising a support, such as a printed circuit, and one or more components reported thereon, by means of connection.

 More specifically, the invention relates to the connection and securing of a component on its support.

 The invention relates in particular to components provided with such connection means, as well as the corresponding printed circuits, the implementation method and the electronic systems thus obtained.

 In particular, but not exclusively, the invention relates to macrocomponents, or modules, which group together several components on the same substrate, so as to form a single element ready to be reported, providing a set of functions. It may especially be radiocommunication modules, for example for radio-telephones, and combining radio-frequency signal processing (RF) and baseband processing.

 The holder of this patent application has already developed and distributed several modules of this type, which are intended to be reported card-board ("board to board" in English) on a printed circuit board.

 For this, two specific connectors are provided, one comprising a plurality of contacts for the digital signals, and another, conventionally of the coaxial type, for the RF signals.

 The presence of these two connectors can make mounting difficult, because it is necessary to position the module, and there may be manufacturing games. This also poses cost problems, since it is necessary to provide two separate connectors, and manufacturing, since it is necessary to assemble these two connectors, precisely respecting their relative positioning.

 In addition, these connectors increase the size of the module,

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 the thickness of the assembly once mounted. However, it is known that the size, and in particular the thickness, must always be reduced, to be able to offer products also small.

 Thus, it is desirable to obtain a two-millimeter card-to-board connection, which does not exist at present among the solutions of the prior art, when RF signals are to be exchanged.

 The invention particularly aims to overcome these disadvantages of the prior art.

 More specifically, an object of the invention is to provide a card-to-board assembly technique to obtain a reduced thickness, compared to known systems. In particular, an object of the invention is to provide such a technique to obtain a thickness of about two millimeters for the connection, while allowing the exchange of RF signals.

 The invention also aims to provide such a technique, of course not requiring the increase of the surface of the component or the module.

Thus, by way of example, a particular object of the invention is to provide, in the field of radiocommunications, a module of dimension less than 32 × 44 millimeters.

 The invention also aims to provide such a technique, to reduce the manufacturing cost of modules or components, as well as costs and installation time.

 Yet another object of the invention is to provide such a technique for optimizing the distribution of the constituent elements of a module.

 These objectives, as well as others which will appear more clearly later, are achieved according to the invention with the aid of an electronic component intended to be mounted on a support, and comprising a single card board connection element, having a plurality of structurally identical contacts, among which: - a first connection contact is dedicated to the transmission of radio frequency signals;

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 - At least two second connection contacts adjacent said first contact are connected to ground, so as to isolate at least partially said first contact; at least one third contact is dedicated to digital signal transmissions.

 Thus, according to the invention, a single connector is used, making it possible to simultaneously pass radio-frequency (RF) signals and digital signals, without mutually disturbing each other, because the second contacts isolate the first contact, according to a principle similar to that of a Faraday cage.

 According to an advantageous embodiment, said contacts are pins.

It can also be other types of connection contacts, depending on the needs.

 Preferably, said second contacts comprise two sets of at least eight contacts, on either side of said first contact. In some cases, however, a lower number may be considered.

 According to another aspect of the invention, said third contacts are preferably organized so as to group respectively in the same set of neighboring contacts at least one of the following groups of signals: groups of signals with fast switching times; - groups of analog signals; - signal buses; - power supplies.

 In particular, such an electronic component comprises a set of third contacts dedicated to fast signals, said assembly being remote from said first and second contacts.

 According to a preferred embodiment of the invention, said connector extends transversely on said component, and parallel to the edges of the latter vis-à-vis which it is distant.

 In particular, said connector can advantageously extend

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 substantially in a central position with respect to said parallel edges.

 Advantageously, said component forms a module integrating on the same support at least two interconnected components.

 In this case, said module may advantageously be organized in two distinct subsets, separated by said connector.

 In particular, a first of said subsets can thus correspond to the processing of radio frequency signals and the second to the processing of baseband signals.

 An advantageous distribution is thus obtained, in particular a limitation of the lengths of the tracks carrying the various signals, and in particular the RF signals.

 According to another advantageous aspect of the invention, the electronic component comprises at least one metal casing forming a shield. In the case described above, each of said subsets is preferably covered by a metal casing forming a shield.

 Preferably, at least one of said metal housings is designed to form support means and / or guide said component on said support.

 Furthermore, advantageously, at least one of said metal housings is designed so as to be secured to said support.

 In particular, at least one of said metal housings is advantageously designed so as to be secured to said support with the aid of at least one weld point.

 Preferably, said welding point connects said metal casing to the electrical ground of said support.

 This provides a simple and efficient mounting, with a single operation simultaneously ensuring the mechanical maintenance of the component and its grounding.

 According to a particular embodiment of the invention, said connector has 100 contacts.

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 The invention also relates to the supports intended to receive one (or more) component (s) such (s) as described (s) This support may be in the form of a printed circuit comprising a single board card connection element , having a plurality of structurally identical contacts, among which: - a first connection contact is dedicated to the transmission of radio frequency signals; - At least two second connection contacts adjacent said first contact are connected to ground, so as to isolate at least partially said first contact; at least one third contact is dedicated to digital signal transmissions.

 Advantageously, said printed circuit comprises means for supporting and / or guiding said component.

 The invention also relates to electronic systems associating such a support and at least one component.

 The invention also relates to a method of implementation on a support of at least one electronic component, comprising a step of distributing the structurally identical contacts of a single board card connection element as follows: a first contact dedicated connection to the transmission of radio-frequency signals; at least two second adjacent connection contacts of said first contact connected to ground, so as to at least partially isolate said first contact; at least one third contact dedicated to digital signal transmissions.

 Advantageously, this method comprises, during assembly, a step of setting up said component using a laying template provided for this purpose, taking into account at least one predefined mark on said support.

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 According to a preferred embodiment, this method also comprises a step of adjusting said template, so as to adapt it to a particular support.

 This makes it possible to have a single tool (template) for assembly on several types of supports (corresponding for example to different radiotelephones). Of course, it is also possible to provide a template for each type of support.

 In this case, said adjusting step advantageously comprises a positioning of two guide elements mounted respectively sliding, in two perpendicular directions.

 Furthermore, the method advantageously comprises a step of securing said component to said support. Said bonding step may thus preferably comprise an operation for depositing at least one soldering point between said support and at least one metal casing of said component.

 Other features and advantages of the invention will appear more clearly on reading the following description of a preferred embodiment of the invention, given by way of a simple illustrative and nonlimiting example, and the appended drawings, among which: : Figure 1 shows an example of distribution of the pins of a connector according to the invention.

 FIG. 2 is a perspective view of an exemplary module embodying the invention; FIG. 3 is a view from above of the module of FIG. 2; FIG. 4 shows a printed circuit designed to receive the module of FIGS. 2 and 3; - Figure 5 is a sectional view of the module of Figures 2 and 3 mounted on the printed circuit of Figure 3; - Figure 6 is an example of a tool for facilitating the mounting of the component of Figures 1 and 2 on a printed circuit; FIG. 7 illustrates the principle of adjustment of the tool of FIG. 6.

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 The invention therefore relates to a particularly simple and effective technique of card-to-board connection of a component to exchange with its support RF signals and digital signals. According to the invention, this is possible using a single connector, having a plurality of contacts all structurally identical. This connector also advantageously allows the transmission of power supplies.

 This provides a system whose size can be reduced, the simplified assembly, and the cost price lowered. It is possible to use a conventional connector. This has the further advantage of allowing to reduce the thickness of this connector.

 Figure 1 schematically illustrates the principle of the distribution of contacts on a connector, according to the invention. These are pins. Other types of contact can of course be envisaged without departing from the scope of the invention.

 The connector therefore comprises first of all a pin 11, dedicated to the transmission of radio-frequency (RF) signals. Thus, according to the invention, these RF signals do not require the presence of a special connector (and thicker), conventionally of the coaxial type. To sufficiently isolate this pin 11 from the other pins carrying digital signals, the inventors have indeed found that it was sufficient to provide at least one isolation pin, on both sides. Thus, two sets 12, and 122 of at least eight pins all connected to the electrical ground frame the pin 11.

 These two assemblies 12, and 122 provide a function similar to that of a Faraday cage, making it possible to separate the RF signals from the base and digital band signals 13.

 These different signals are advantageously grouped together to optimize the management and reduction of disturbances. Thus, the fast switching time signals 131, which are relatively disruptive will be remote from the RF pin 11. The power supplies 132

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 may be placed near the insulation assembly 12,. Analog signals that are generally sensitive and signal buses will also be grouped together.

 The embodiment described in more detail below relates to a GSM / GPRS type radio telephone module, which uses a 100-point connector, for example of the NAIS (registered trademark) type, of reference AXK6F00345EJ. It should be noted here that the invention does not relate to the connector, which can instead be a commercial connector, but the particular organization of its pinout, so as to allow new applications, and in particular the transmission on the same connector RF signals and digital signals.

 Appendix 1 shows a particular example of pinout in this connector. As will be noted in this appendix, the RF signal is protected by 19 grounding points, which ensure that the digital signals do not disturb the RF signal too much.

 Note also that, to facilitate the routing of the card on the digital side, we gave ourselves a little flexibility on the positioning of the connector 100 points, so as not to make too many crossings, and to isolate as much as possible. fast switching signals, with respect to sensitive signals.

 The module equipped with this connector is illustrated in Figures 2 and 3, respectively in perspective and in plan view. This particular module has dimensions of 32 x 44 x 3 millimeters, the connector having a thickness of 2 millimeters.

 This module must process on the one hand baseband signals, and on the other hand RF signals. It was organized in two separate cells 21 and 22, in which are distributed respectively the elements necessary for baseband processing and RF processing. Each of these cells 21 and 22 have a shield, for example, of the bowl type.

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These two cells 21 and 22 are separated by the connector 23 which is therefore in the central position on the module.

This approach is new, the connectors being generally made on one edge of the module. This approach according to the invention, however, makes it possible to optimize the routing of the signals towards one or the other of the cells (the distances being reduced, and the isolation of the signals being improved). Thus, there is no RF signal flowing under the baseband slot 21, nor any baseband signal flowing under the RF cell 22. However, this location makes assembly a little more difficult. which may require the use of specific tools, described later (Figures 6 and 7).

 The module of FIG. 3 must therefore be attached to the printed circuit of FIG. 4, to form the assembly illustrated in FIG.

 It appears clearly in this figure that the set is very thin.

 The fact that the connector 23 is central could cause support problems, the module 51 can tilt slightly. To avoid or at least limit this risk, it is advantageously provided a boss 53, 532 on the printed circuit, at the two cells 21 and 22, so that they come to bear on the printed circuit.

Such bosses could of course be provided alternately on the shields of the cells 21 and 22.

 According to yet another approach, it is possible to provide complementary shapes on the shield and on the printed circuit, which could also facilitate the guiding and setting up of the module.

 Once the module has been put in place, it can advantageously be secured to the integrated circuit, for example with one or two solder points applied directly to the shield of the cells 21 and 22. These welding points will advantageously and also be an advantage. the circuit ground for these shields. We can also provide other

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 means of solidarity such as a collage.

 We understand that the central position of the connector then makes it more difficult to mount on the module compared to the classic case where the connector is on an edge. Indeed, the editor does not see exactly where the connector is, and may therefore fumble and if necessary deteriorate the connector.

To avoid this problem, and allow industrial implementation, the inventors have developed specific tools, in the form of templates, which have an opening corresponding to the footprint of the module, and means for positioning them by relative to the printed circuit board (client card). This template thus comprises one or more means of association with a marker made on the client card, in the case where a template is provided for each type of card. These markers make it possible to precisely position the template on the client card. The opening is then in place and just insert the module.

 According to another approach, illustrated in FIG. 6, it is possible to provide a universal template that can be adapted to any type of card. For this, adjustment elements are provided, in the form of sliders 61 and 62 mounted in slideways, which are set on the first card of a series, in the dimensions X and Y, as illustrated in FIG. so that the opening 63 is in the proper position, relative to the card which will be wedged against the sliding 61 and 62.

 It is also advantageous to adjust the height Z.

 Then simply place each card and then mount the module using the opening 63.

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ANNEX 1

<Tb>
<tb> Pin # <SEP> Name <SEP> I / O <SEP> Type <SEP> of I / O <SEP> Description <SEP> Comment
<tb> 22 <SEP> -RST <SEP> I / O <SEP> SCHMITT <SEP> Reset <SEP> of <SEP> module <SEP> Active <SEP> at <SEP><SEP> Low
<tb> 23 <SEP> SPI ~ CLK ~ 1 <SEP> O <SEP> CMOS / 3X <SEP> Clock <SEP> SPI <SEP> Multiplexed
<tb> gold <SEP> Or
<tb> SCL <SEP> Horology <SEP> 12C
<tb> 24 <SEP> GPO1 <SEP> 0 <SEP> CMOS / 3X <SEP> Output <SEP> Fingerprint
<tb> 25 <SEP> SPI ~ DAT ~ 1 <SEP> I / O <SEP> CMOS / 3X <SEP> Input / Output <SEP> SPI <SEP> Multiplexed
<tb> Gold <SEP> Or
<tb> SDA <SEP> Input / Output <SEP> I2C
<tb> 26 <SEP> GPIO1 <SEP> I / O <SEP> CMOS / 2X <SEP> Output <SEP> digital <SEP> Multiplexed
<tb> Gold
<tb> CT109 / DCD1 <SEP> O <SEP> Signal <SEP> V24 <SEP> Data <SEP> Carrier <SEP> Detect
<tb> 27 <SEP> GPI07 <SEP> I / O <SEP> CMOS / 2X <SEP> Output <SEP> Digital <SEP> Multiplexed
<tb> gold <SEP> Or
<tb> SPI ~ CLK ~ 2 <SEP> O <SEP> Clock <SEP> SPI
<tb> 28 <SEP> SPI ~ EN ~ 1 <SEP> O <SEP> CMOS / 1X <SEP> Validation <SEP> SPI ~ 1
<tb> 29 <SEP> -INTR <SEP> I <SEP> CMOS <SEP><SEP> External <SEP> Active <SEP> Interrupt at the <SEP><SEP> Low Level.
<Tb>

<SEP> resistance of <SEP> pull-up
<tb> of <SEP> 100K <SEP> included
<tb> 30 <SEP> SIM ~ PRES <SEP> I <SEP> CMOS <SEP> Detection <SEP> Card <SEP> SIM <SEP> Multiplexed
<tb> or <SEP> or
<tb> GPI02 <SEP> I / O <SEP> Digital <SEP> I / O
<tb> 31 <SEP> VCC <SEP> O <SEP> Supply <SEP> Power <SEP> Low <SEP> Power <SEP> 2.8V
<tb> 32 <SEP> ROWI <SEP> I / O <SEP> CMOS / IX <SEP> Interface <SEP> Keyboard <SEP> Line
<tb> 33 <SEP> ROWO <SEP> I / O <SEP> CMOS / IX <SEP> Interface <SEP> Keyboard <SEP> Line
<tb> 34 <SEP> ROW3 <SEP> I / O <SEP> CMOS / IX <SEP> Interface <SEP> Keyboard <SEP> Line
<tb> 35 <SEP> ROW2 <SEP> I / O <SEP> CMOS / IX <SEP> Interface <SEP> Keyboard <SEP> Line
<tb> 36 <SEP> COLO <SEP> I / O <SEP> CMOS / IX <SEP><SEP> Interface <SEP> Keyboard
<tb> 37 <SEP> ROW4 <SEP> 1/0 <SEP> CMOS / IX <SEP> Interface <SEP> Keyboard <SEP> Line
<tb> 38 <SEP> COL2 <SEP> I / O <SEP> CMOS / IX <SEP><SEP> Interface <SEP> Keyboard
<tb> 39 <SEP> COL1 <SEP> I / O <SEP> CMOS / 1 <SEP> X <SEP> Interface <SEP> Keyboard <SEP> Column
<tb> 40 <SEP> COL4 <SEP> I / O <SEP> CMOS / 1X <SEP><SEP> Interface <SEP> Keyboard
<tb> 41 <SEP> COL3 <SEP> I / O <SEP> CMOS / IX <SEP><SEP> Interface <SEP> Keyboard
<tb> 42 <SEP> AUX ~ ADC <SEP> 1 <SEP> Analog <SEP> Input <SEP> Analog / Digital <SEP> Can <SEP> be <SEP> Set <SEP> to <SEP><SEP> mass
<tb> auxiliary <SEP> if <SEP> no <SEP> used
<tb> 43 <SEP> BAT ~ TEMP <SEP> I <SEP> Analog <SEP> Input <SEP> Analog / Digital <SEP> for <SEP> The <SEP> Can <SEP> be <SEP> Set <SEP > to <SEP> the <SEP> mass
<tb> measure <SEP> of <SEP><SEP> temperature <SEP> of <SEP><SEP> if <SEP> no <SEP> used
<tb> battery
<tb> 44 <SEP> GPI04 <SEP> I / O <SEP> CMOSI2X <SEP> Input / Output <SEP> Digital <SEP> Multiplexed
<tb> Gold
<tb> CTS2 / ADD22
<tb> 45 <SEP> CT107 / DSRI <SEP> O <SEP> CMOS / 1X <SEP> Signal <SEP> V24
<tb> Data <SEP> Set <SEP> Ready
<Tb>

46 CTI08-2/DTRI 1 CMOS Signal V24 Mettre une résistance de

46 CTI08-2 / DTRI 1 CMOS Signal V24 Set a resistance of

<Tb>
<tb> Gold <SEP> Data <SEP> Terminal <SEP> Ready <SEP> 100K <SEP> at <SEP> VCC <SEP> if <SEP> No
<tb> EXTINT2 <SEP> Or <SEP> used
<tb> Interrupt <SEP> external <SEP> n 2
<tb> 47 <SEP> GPI05 <SEP> I / O <SEP> CMOS / 2X <SEP> Input / Output <SEP> Digital <SEP> Multiplexed
<tb> Gold
<tb> RTS2 / ADD23
<tb> 48 <SEP> GPI08 <SEP> I / O <SEP> CMOS / 2X <SEP> Input / Output <SEP> Digital <SEP> Multiplexed
<tb> Gold <SEP> or
<tb> CT125 / RII <SEP> O <SEP> signal <SEP> V24 <SEP> Ring <SEP> Indicator
<tb> 49 <SEP> CT104 / RXD1 <SEP> 0 <SEP> 1X <SEP> Signal <SEP> V24
<tb> Receive
<tb> 50 <SEP> GPI06 <SEP> I / O <SEP> CMOS / 2X <SEP> Input / Output <SEP> Digital <SEP> Multiplexed
<tb> Gold <SEP> Or
<tb> SPI ~ DAT ~ 2 <SEP> In / Out <SEP> SPI2
<tb> Gold <SEP> Or
<tb> SDA2 <SEP> In / Out <SEP> 12C
<Tb>

<Desc / Clms Page number 12>

Continued ANNEX I

<Tb>
<tb> 51 <SEP> CT103 / TXD1 <SEP> I <SEP> CMOS <SEP> Signal <SEP> V24
<tb> Transmit <SEP> data
<tb> 52 <SEP> CT105 / RTS1 <SEP> I <SEP> CMOS <SEP> Signal <SEP> V24 <SEP> Set <SEP> a <SEP><SEP> resistance of
<tb> Request <SEP> to <SEP> send <SEP> pull-up <SEP> from <SEP> 100K <SEP> to
<tb> VCC <SEP> if <SEP> no <SEP> used
<tb> 53 <SEP> GPI03 <SEP> I / O <SEP> CMOSI2X <SEP> Input / Output <SEP> Digital <SEP> Multiplexed
<tb> Gold <SEP> Or
<tb> CSUSR <SEP> O <SEP> Chip <SEP> Select <SEP> User
<tb> 54 <SEP> CT106 / CTS1 <SEP> O <SEP> 1X <SEP> Signal <SEP> V24
<tb> Clear <SEP> To <SEP> Send
<tb> 55 <SEP> BOOT <SEP> I <SEP> CMOS <SEP> BOOT <SEP> Set <SEP> a <SEP><SEP> resistance of
<tb> pull-down <SEP> of <SEP> 1 <SEP> K <SEP> for
<tb> the <SEP> loading <SEP> of <SEP> la
<tb> flash
<tb> 56 <SEP> ON / -OFF <SEP> I <SEP> CMOS <SEP> Function <SEP> ON / OFF <SEP> of the <SEP> module
<tb> 57 <SEP> MICIN <SEP> I <SEP> Analog <SEP> Entry <SEP> negative <SEP> Microphone <SEP> 1
<tb> 58 <SEP> SPK1P <SE> O <SEP> Analog <SEP> Output <SEP> positive <SEP> Speaker <SEP> 1
<tb> 59 <SEP> MIC1P <SEP> I <SEP> Analog <SEP> Enter <SEP> positive <SEP> Microphone <SEP> 1
<tb> 60 <SEP> SPK1N <SE> O <SEP> Analog <SEP> Output <SEP> Negative <SEP> Speaker <SEP> 1
<tb> 61 <SEP> MIC2P <SEP> I <SEP> Analog <SEP> Enter <SEP> positive <SEP> Microphone <SEP> 2
<tb> 62 <SEP> SPK2N <SEP> O <SEP> Analog <SEP> Output <SEP> negative <SEP> Speaker <SEP> 2
<tb> 63 <SEP> MIC2N <SEP> I <SEP> Analog <SEP> Entry <SEP> negative <SEP> Microphone <SEP> 2
<tb> 64 <SEP> SPK2P <SE> O <SEP> Analog <SEP> Output <SEP> positive <SEP> Speaker <SEP> 2
<tb> 65 <SEP> CHG ~ IN <SEP> I <SEP> Supply <SEP> Output <SEP> Power <SEP> for <SEP> Load <SEP><SEP> Strong <SEP> Current
<tb> battery
<tb> 66 <SEP> CHG ~ IN <SEP> I <SEP> Supply <SEP> Output <SEP> Power <SEP> for <SEP> Load <SEP><SEP> Strong <SEP> Current
<tb> battery
<tb> 67 <SEP> GPIOO <SEP> I / O <SEP> CMOS / 2X <SEP> Input / Output <SEP> Digital <SEP> Multiplexed
<tb> Gold <SEP> Or
<tb> LED ~ OUT <SEP> O <SEP><SEP><SEP> state module
<tb> 68 <SEP> BAT ~ RTC <SEP> I / O <SEP> Supply <SEP> Power <SEP> from <SEP> Backup <SEP> from <SEP><SEP> RTC
<tb> 69 <SEP> GPO0 <SEP> O <SEP> CMOS / 3X <SEP> Input / Output <SEP> Fingerprint
<tb> 70 <SEP> BUZ <SEP> O <SEP> CMOS <SEP> Output <SEP> Buzzer <SEP> 80 <SEP> mA <SEP> Max
<tb> 71 <SEP> GPI <SEP> I <SEP> CMOS <SEP> Input / Output <SEP> Digital <SEP><SEP><SEP> Resistance <SEP> Pulldown <SEP> 100K <SEP> Included
<tb> 72 (*) <SEP> GP02IRXD2 <SEP> I <SEP> CMOS / 3X <SEP> Output <SEP> digital <SEP> Multiplexed
<tb> Gold <SEP> or
<tb> GP03 / 32K <SEP> Input / output <SEP> digital
<tb> 73 <SEP> SIM <SEP> CLK <SEP> O <SEP> CMOSI2X <SEP> Horology <SEP> for <SEP> the <SEP> SIM interface
<tb> 74 <SEP> SIM ~ IO <SEP> I / O <SEP> CMOS / 3X <SEP> Input / Output <SEP> SIM
<tb> 75 <SEP> SIM ~ VCC <SEP> O <SEP> Supply <SEP> Power <SEP> Card <SEP> SIM <SEP> 6mA <SEP> Max
<tb> 76 <SEP> SIM ~ RST <SEP> O <SEP> 2X <SEP> Reset <SEP> of <SEP> the <SEP> SIM interface
<tb> 77 <SEP> VBATT <SEP> Supply <SEP> Input <SEP> Battery
<tb> 78 <SEP> VBATT <SEP> Supply <SEP> Input <SEP> Battery
<tb> 79 <SEP> VBATT <SEP> Supply <SEP> Input <SEP> Battery
<tb> 80 <SEP> VBATT <SEP> Supply <SEP> Input <SEP> Battery
<tb>81-> 95 <SEP> GND <SEP> 0 <SEP> volt <SEP> of the <SEP> module
<tb> 96 <SEP> ANT <SEP> I / O <SEP> RF <SEP><SEP> Connection of <SEP><SEP> Output <SEP> RF
<tb>97-> 100 <SEP> GND <SEP> 0 <SEP> volt <SEP> of the <SEP> module
<Tb>

Claims (26)

 1. An electronic component intended to be mounted on a support, characterized in that it comprises a single card board connection element, having a plurality of structurally identical contacts, among which: a first connection contact is dedicated to the transmission of radio frequency signals; - At least two second connection contacts adjacent said first contact are connected to ground, so as to isolate at least partially said first contact; at least one third contact is dedicated to digital signal transmissions. 2. Electronic component according to claim 1, characterized in that said contacts are pins. 3. Electronic component according to any one of claims 1 and 2, characterized in that said second contacts comprise two sets of at least 8 contacts on either side of said first contact. 4. Electronic component according to any one of claims 1 to 3, characterized in that said third contacts are organized so as to group respectively in the same set of neighboring contacts at least one of the following groups of signals: - groups of signals fast switching times; - groups of analog signals; - signal buses; - power supplies. 5. Electronic component according to claim 4, characterized in that it comprises a set of third contacts dedicated to fast signals, and in that said assembly is remote from said first and second contacts. 6. Electronic component according to any one of claims 1 to 5, characterized in that said connector extends transversely on said <Desc / Clms Page number 14>  component, and remote from the edges of said component to which it is parallel. 7. Electronic component according to claim 6, characterized in that said connector extends substantially in a central position relative to said parallel edges. 8. Electronic component according to any one of claims 1 to 7, characterized in that it forms a module integrating on the same support at least two interconnected components. 9. Electronic component according to claim 8, characterized in that said module is organized in two separate subsets, separated by said connector. 10. Electronic component according to claim 9, characterized in that a first of said subsets corresponds to the processing of radio frequency signals and the second to the processing of baseband signals. 11. Electronic component according to any one of claims 1 to 10, characterized in that it comprises at least one metal casing forming a shield. 12. Electronic component according to claims 9 and 11, characterized in that each of said subassemblies is covered by a metal casing forming a shield. 13. Electronic component according to any one of claims 11 and 12, characterized in that at least one of said metal housings is designed to form support means and / or guiding said component on said support. 14. Electronic component according to any one of claims 11 to 13, characterized in that at least one of said metal housings is designed to be secured to said support. 15. Electronic component according to claim 14, characterized in that at least one of said metal housings is designed to be secured to said support with the aid of at least one weld spot. 16. Electronic component according to claim 15, characterized in that said weld spot connects said metal case to the electrical ground of said <Desc / Clms Page number 15>  support. 17. Electronic component according to any one of claims 1 to 16, characterized in that said connector has 100 contacts. 18. Printed circuit forming a support for at least one electronic component intended to be attached to said support, characterized in that it comprises a single card board connection element, having a plurality of structurally identical contacts, among which: a first Connection contact is dedicated to the transmission of radio-frequency signals; - At least two second connection contacts adjacent said first contact are connected to ground, so as to isolate at least partially said first contact; at least one third contact is dedicated to digital signal transmissions. 19. Circuit board according to claim 18, characterized in that it comprises means for supporting and / or guiding said component. 20. Electronic system comprising on a support at least one electronic component intended to be attached to said support, characterized in that it comprises a single card card connector, having a plurality of structurally identical contacts, among which: a first contact connection is dedicated to the transmission of radio-frequency signals; - At least two second connection contacts adjacent said first contact are connected to ground, so as to isolate at least partially said first contact; at least one third contact is dedicated to digital signal transmissions. 21. Method of implementation on a support of at least one electronic component, characterized in that it comprises a step of distribution of the structurally identical contacts of a card-to-board connection element. <Desc / Clms Page number 16>  unique in the following way: - a first connection contact dedicated to the transmission of radio-frequency signals; at least two second adjacent connection contacts of said first contact connected to ground, so as to at least partially isolate said first contact; at least one third contact dedicated to digital signal transmissions. 22. Method of implementation according to claim 21, characterized in that it comprises a step of setting up said component using a laying template provided for this purpose, taking into account at least one predefined benchmark on said support. 23. Implementation method according to claim 22, characterized in that it comprises a step of adjusting said template, so as to adapt to a particular support. 24. The method of implementation according to claim 23, characterized in that said adjusting step comprises a positioning of two guide elements mounted sliding respectively in two perpendicular directions. 25. Method of implementation according to any one of claims 21 and 24, characterized in that it comprises a step of securing said component to said support. 26. A method of implementation according to claim 25, characterized in that said step of joining comprises an operation of depositing at least one weld point between said support and at least one metal housing of said component.