FR2843067A1 - Molding and decorating plastic smart card e.g. bank- or telephone card employs system of heated mold plates, frames, films and pouches filled with plastic resin - Google Patents

Abstract

The mold (7) includes molding plates (70) with heating and end plates (71, 72). The plates are heated, and moved by a drive. A small pouch (100) is made. A frame (1) is selected, its thickness being equal to that of a card. It is located on a film (2). The electronic circuit (4) is placed against the lower edge (10) of the frame. A second film (2') is located on the frame and fixed to its lower edges (10) and sides (11, 12). A resin (5) is prepared. A predefined volume of it is introduced into the pouch (100). The second film is fixed to the upper edge (13) of the frame, closing the pouch (100) over its entire periphery. The pouch is positioned on a support (6) holding it vertically during a residence time required for the resin. When the mold is hot and the residence time of the resin has expired, the pouches (100) are positioned in the mold (7) against the molding plates (70). The drive is operated, bringing the plates into mutual contact. The pockets are left in the closed mold, maintaining the temperature during the time required for resin polymerization. The mold is then opened; the pouches are removed. Once the resin has set, the pouches are cut away in the shape of the cards required. The films (2, 2') are pulled off. Variant methods are proposed to transfer decoration onto the card from the films. An adhered band holds the electronics in place on bridging sections, during the operation. The resin is compatible with electronic component encapsulation. A system of inflatables within the plates, applies pressure. Inserted spacers define card thickness. The molding equipment is further detailed. An Independent claim is included for the mold used.

Description

The present invention relates generally to a means

  information in the form of a small card containing an electronic circuit which may include a power source and / or at least one antenna and / or at least one push button and / or at least one sensor intended for measuring quantities and / or at least one display means, and more particularly

  a method of manufacturing such an information medium in the form of a card.

  Said card has for example dimensions close to those of a known type smart card, payment bank card or card intended to be used in a telephone booth, and is intended to be implemented for transmitting information, it can constitute a transmitter for sending information to a receiver, for example so as to control the operation of said receiver or to exchange data with said receiver, or a device comprising a means for displaying information such as an LCD screen

  or diodes and intended to be viewed by the user.

  At the present time, cards are known which do not contain a circuit which are obtained by plastic molding. This manufacturing process cannot be implemented when the cards must contain a complex electronic circuit because the molding is carried out at a temperature of approximately 200 ° C. and under a pressure of approximately 400 bars, which neither would support or components

  or an electrochemical cell or battery.

  Also known are cards which are molded and have one or more hole (s) in which they are arranged, after the molding of the support, the electronic means or else cards obtained by superimposing and fixing sheets of thin plastic material having cutouts intended to receive the

electronic means.

  Cards produced according to the last two processes often exhibit poor cohesion which leads to their destruction or the tearing of

  electronic means over time.

  There are currently means of information such as those to which the invention applies, but these devices are generally larger than a smart card. They are for example intended to ensure the closing and opening of the doors of a vehicle or the activation and deactivation of an alarm device. These devices are manufactured by positioning the electronic circuit in a previously molded case constituting the vehicle key or the

  alarm device remote control.

  The object of the invention is to propose a method of manufacturing a card of approximately 85 millimeters in length, 54 millimeters in width and 1.5 millimeters in thickness containing the electronic means listed above. The thickness of the card depends on the thickness of the electronic means and may of course be more

  important, for example of the order of a few millimeters.

  To this end, the invention relates to a method of manufacturing an information medium in the form of a small card containing an electronic circuit, characterized in that: - a mold is provided comprising at least one molding plate carrying heating means and at least one end plate and means intended to drive said plates in translation, - the mold is heated, - at least one pocket is made for this purpose : - we choose a frame with a thickness equal to that of the card to be manufactured, - we position and fix the frame on a first film, - we position the electronic circuit against the lower edge of the frame, - we position a second film on the frame and fixes it on the lower and lateral edges of the frame, - a resin is prepared, - a predefined volume of resin is introduced into the pocket, - the second film is fixed on the upper edge of the frame in order to close the po chette around its entire circumference, - the pouch is positioned on a support so that it is vertical during the rest time necessary for the resin, - when the mold is hot and the rest time of the resin has elapsed, it is positioned the pouches in the mold against each of the molding plates, - the drive means are used to bring the mold plates into contact with each other, - the pouches are left in the closed mold and kept at temperature for the time necessary for the polymerization of the resin, - the mold is opened and the pouches are removed, - when the resin has reached its final state, the pouches are cut out

  format of the card to be obtained, then the films are removed.

  By implementing the method according to the invention, the information medium is produced by molding at a temperature of the order of 35 ° C. and under very low pressure, which ensures that the electronic components do not

are not deteriorated.

  The method according to the invention is also remarkable in that: - at least one of the films bears a decoration printed on the face by which it is glued to the frame, - at least one decoration is carried by a decorated support which will remain fixed on one face of the card, - when the decoration consists of at least one decorated support, said decoration is positioned against the lower edge of the frame by applying the face intended to form the decorated exterior of the card against the film, - the support of the electronic circuit is connected to a retaining strip by bridges, said retaining strip being glued to the lower edge of the frame, - the resin can advantageously be chosen from the resins which can be used for coating electronic components, or may be of any other nature, - each molding plate has on one of its faces a generally parallelepiped recess, the internal volume of which is connected by a conduit to the blank plate, this recess being intended to contain an inflatable bladder through a tube inserted in the duct and connected to means for supplying air under pressure, - spacers defining the thickness of the cards produced in the mold are positioned on one of the faces of the molding plate, - the mold consists of several molding plates, two end plates arranged on either side of said molding plates and a control plate carrying means intended to drive the plates in translation, the first end plate and the control plate being fixed while the second end plate moves in translation at the same time as the molding plates, - each molding plate is traversed by : - a first group of orifices composed of the openings opening onto each large face of the plate and connected, inside said plate, by a bore of smaller diameter tre, cylindrical uprights being inserted into this first group of orifices, said cylindrical uprights carrying return springs, each being arranged between two molding plates and pressing at each of its ends against a shoulder separating an opening from a bore, and by - a second group made up of four small diameter orifices into which guide rods are inserted, - each elongated heating means is positioned in a channel passing through each molding plate parallel to its large faces, permeable elements creating passages allowing the evacuation of air that can be trapped between the pockets and the mold plates are

  positioned on either side of each pocket.

  The invention also relates to a mold intended for implementing the manufacturing method according to the invention, characterized in that it comprises at least one molding plate carrying heating means and at least one end plate and means intended to drive said plates in translation, said mold is also remarkable in that: - each molding plate has on one of its faces a generally parallelepipedal recess whose internal volume is connected by a conduit to the lateral blank of the plate, recess being intended to contain an inflatable bladder through a tube inserted in the duct and connected to means for supplying air under pressure, - spacers defining the thickness of the cards produced in the mold are positioned on one of the faces of the molding plate, - it consists of several molding plates, two end plates arranged on either side of said plates molding and a control plate carrying means for driving the plates in translation, the first end plate and the control plate being fixed while the second end plate moves in translation at the same time as the molding plates, - each molding plate is traversed by: - a first group of orifices composed of the openings opening on each face of the plate and connected, inside said plate, by a bore of smaller diameter, and cylindrical uprights are inserted into this first group of orifices, said cylindrical uprights carrying return springs, each being disposed between two molding plates and bearing at each of its ends against a shoulder separating an opening from a bore, and by - a second group made up of four small diameter orifices into which guide rods are inserted, - each elongated heating means is posit erected in a channel

  passing through each molding plate parallel to its large faces.

  The invention also relates to the information medium in the form of a small card containing an electronic circuit obtained by

  the implementation of the manufacturing process according to the invention.

  The invention will be better understood thanks to the description which follows

  given by way of nonlimiting example with reference to the accompanying drawings in which - Figures La to Li schematically represent the different phases of the process according to the invention, - Figure 2 is a perspective view of the molding device, - Figure 3 is a front view of a plate of the molding device, - Figure 4 is a partial sectional view along the line IV-IV of Figure 3, - Figure 5 shows schematically the positioning of a pocket

in front of a molding plate.

  As shown diagrammatically in FIG. 1, step a of the method according to the invention consists in positioning a frame 1 on a film 2. The frame 1 is of thickness equal to or greater than that of the card which is to be manufactured, it ie thicker than the most

  thick electronic components that must contain said card.

  Said frame 1 carries on its two faces a self-adhesive product covered by a protective paper, it is, as described below, intended to form a pocket 100 after positioning and gluing on its opposite faces two

films 2, 2 '.

  The frame 1 is positioned on the film 2 after removing said protective paper from the four edges of a first face of the frame 1 so as to be fixed to said frame 1. In FIG. 1a, the film 2 is placed under the frame 1 and the protective paper has been removed from the underside of said frame 1. In order to facilitate understanding of the

  designs, shine effects were symbolized by oblique streaks.

  On the internal face of the film 2, that is to say on the face on which the frame 1 is glued, a decoration 3 is positioned. This decoration 3 is intended to decorate one of the faces of the card manufactured by the process according to the invention. The decoration 3 can in a manner known per se be previously printed on the film 2, in which case care must be taken to position the frame 1 on the printed side of said film 2, against the lower edge of said decoration, or be constituted by a decorated support. which will remain fixed on the card. When the decoration 3 is constituted by a decorated support, said decoration is positioned against an edge of the frame 1 by applying the face intended to form the decorated exterior of the card against the film 2 (FIG. 1b). The edge of the frame

  against the lower edge of the decoration is intended to constitute the bottom of the pocket 100.

  In the step shown diagrammatically in FIG. 1 c, the electronic circuit 4 is positioned on the decoration 3, being substantially centered relative to the latter. The

  support of said electronic circuit 4 is very thin, for example a flexible support.

  The support of the electronic circuit 4 is preferably connected to a retaining strip by bridges 41. By this arrangement, said electronic circuit 4 is held in position by gluing said retaining strip 40 to the lower edge 10 of the frame

  after removing the protective paper.

  During the next step (Figure I d), the protective papers covering the two side faces II and 12 of the frame 1 are removed and a second

  film 2 ′ is positioned and fixed on the lower 10 and lateral 11, 12 edges of the frame 1.

  The second 2 ′ film can carry a decoration, or a decoration can be positioned

  on the electronic circuit 4 before the installation of the second film 2 '.

  At the end of this fourth step, we are in possession of a pocket 100 of which only the upper side is open and this pocket contains one or more decorations and the electronic circuit necessary for the information means. During the making of the pouch, or following it, a resin 5 is prepared in a glass 50. This resin can advantageously be chosen from the resins known to be able to be used for coating electronic components. By way of nonlimiting example, let us cite the resin sold under the name AXSON. The resin will of course be chosen according to its properties and the

  characteristics that we want to obtain.

  After having allowed the resin to stand and possibly having positioned the glass 50 under the cover of a vacuum pump in order to extract the bubbles which have formed during the mixing of the components constituting the resin, we introduce (figure le) into the pouch 100, for example using a graduated pipette, a predefined volume of resin corresponding to the volume of a card having for width: the width of the frame 1, for height: a height slightly greater than that of the decoration 3 and

  for thickness: the thickness of the frame 1.

  At the step shown in FIG. If, the protective paper covering the upper edge 13 of the frame 1 is removed in order to close the pocket 100 around its entire periphery, during this operation, said pocket is held vertically so that the resin 5 remains in the bottom of said pocket. In this position, the resin constitutes a pocket thicker than the frame 1 and less tall than the decor (s) 3

and the electronic circuit 4.

  The fully closed pocket 100 is then positioned on a support

  6 so that it remains vertical during the rest time necessary for the resin.

  A resin with a relatively long standing time will preferably be chosen in order to facilitate handling and, as described below, to be able to prepare several pouches 100 before continuing the manufacturing process to allow

  making several cards at the same time.

  Once the rest time has practically ended, at the stage shown diagrammatically in FIG. 1h, the pouch (s) 100 prepared as described above is (are)

positioned in a mold 7.

  The mold 7 shown diagrammatically in FIG. 1h is better visible in FIG. 2.

  This mold 7 consists of at least one molding plate 70, but preferably comprises several such molding plates 70 in order to ensure the simultaneous molding of several cards. Each molding plate is generally parallelepipedic and of small thickness. Said molding plates 70 are intended to be brought closer to one another to exert pressure on the sleeves 100 arranged between them to ensure the shaping of the cards. End plates 71, 72 and a control plate 73 are arranged on either side of the molding plates 70. The first end plate 71 and the control plate 73 are fixed while the second plate end 72 moves in translation at the same time as the molding plates 70. On its face opposite to the molding plates 70, the control plate 73 carries means intended to drive the molding plates 70 and the end plate 72 in translation. By way of example, these means can be constituted by a jack, such as a hydraulic or pneumatic jack, the body of which, not shown in the drawing, is fixed to the control plate 73 and the end of the control rod of which is mounted through an opening of said control plate 73, bears against the second end plate 72. Any other means intended to apply a force to the second end plate 72 can of course be implemented without leaving the frame of the

present invention.

  Each molding plate 70 is traversed by a first group of orifices composed of the openings 75 opening out on each face of the plate 70 and connected, inside said plate, by a bore 74 of smaller diameter, and

  by a second group composed of four orifices 77 of small diameter.

  Cylindrical uprights 80 are inserted in the first group of orifices. Return springs 84 are positioned around said uprights 80, each of them being disposed between two plates 70 and supported by each of its

  ends against a shoulder 745 separating an opening 75 from a bore 74.

  Guide rods 86 are inserted in the orifices 77 of the second

group of orifices.

  The cylindrical uprights 80 and the guide rods 86 guide the plates 70, 72 in translation when the drive means carried by the control plate 73 is put into action. During this movement, the molding plates 70 are brought closer to one another. The thickness of the cards produced in the mold 7 is defined by spacers 700 placed on each molding plate 70, for example at the four corners of said plate. Said spacers can of course be replaced by spacers of different thickness in order to correspond to the thickness of the product to be manufactured. Each plate 70 has on one of its faces a generally parallelepiped recess 76 whose internal volume is connected by a conduit 78 to the lateral blank of the plate 70. This recess 76 is intended to contain a bladder 9 (FIG. 11) which is inflatable through a tube inserted into conduit 78 and connected to means for supplying pressurized air, for example a compressor. The spacers 700 are, in the embodiment shown in the drawing, positioned on the face of the

  molding plate 70 in which the recess 76 is formed.

  A channel 79 passes through each plate 70 parallel to its large faces, being disposed approximately halfway between the bottom of the recess 76 and the lower orifices 77 of the second group of orifices. This channel 79 constitutes a housing for elongated heating means intended to bring the molding plate to a temperature between 32 and 380C, preferably of the order of 350C. Thermometers not shown in the drawing are arranged on each molding plate in order to control the temperature thereof. Said thermometers are for example digital thermometers stuck on the edge of each plate of

molding 70.

  FIG. 5 shows the relative positioning of a pocket 100 in front of a molding plate 70. As visible in the drawing, the guide rods 86 are positioned so that the pocket 100 is placed on the lower rods 86 and between the lateral rods 86 , the frame 1 being around the recess 76. The hatched area A shows the space occupied by the decor (s) and the electronic circuit arranged in the pocket 100. This space is intended to be filled with resin 5 during molding. The volume of resin 5 poured into the pouch 100 in the step shown in FIG. 1f corresponds to that required to mold a product of

  surface equal to that of said hatched area A and of thickness equal to that of frame 1.

  As can be seen in the drawing, this zone A extends below the recess 76 of the

molding plate 70.

  For the production according to the invention of a card constituting a means of information, we first equip ourselves with a mold 7 as described above and we start the operation by putting said mold in heat. that is, by feeding the

  heating means inserted in the channels 79 of each molding plate 70.

  For heating, the mold plates 70 are brought into contact with each other. This heating is regulated so that said molding plates 70 are

at a temperature of around 350C.

  During the heating of the mold, pouches 100 in lower number but preferably equal to the number of molding plates 70 are prepared as

  described in relation to Figures la to 1 g.

  When the mold is hot and the rest time of the resin 5 has elapsed, the pockets 100 are positioned in the mold 7 against each of the molding plates 70 as shown diagrammatically in FIG. 1h and the drive means carried by the plate control 73 are used to bring the plates 71, 70 and 72 into contact with each other with the interposition of spacers 700. At the same time, the bladders 9 positioned in the recesses 76 of the molding plates 70 are inflated. The inflation of said bladders 9 is carried out at a pressure of approximately 0.4 bar and makes it possible to fill the space between the plates arranged above the hatched area A of FIG. 5. This operation makes it possible to prevent the resin 5 to spread beyond the hatched area

To which it is intended to fulfill.

  Thanks to the process according to the invention, the electronic components are subjected to a temperature of the order of 35 ° C. and to a very low pressure resulting from the pressing of the plates on the resin in order to spread it over the entire surface of the card to be produced since the spacers 700 hold the molding plates 70 apart

  a distance equal to the thickness of the card to be manufactured.

  The bags 100 are left for one hour in the closed mold and maintained at temperature so that the resin is polymerized, then the mold is opened.

  and the pouches are removed and left at room temperature.

  Usually, the resin reaches its final state after about a day. The pockets 100 are then cut to the format of the card to be obtained,

  generally around the decor (s) 3 then the films 2, 2 ′ are removed.

  11 In order to improve the surface condition of the large faces of the card, air-permeable sheet elements can be placed on either side of each pocket 100 when it is placed in the mold. These permeable elements create passages allowing the evacuation of the air that can be trapped between the pockets 100 and the mold plates 7. If these permeable elements have a face

  smooth, for example a sheet of blotting paper, the large faces of the card will be smooth.

  When the permeable elements have a non-smooth surface, for example a fabric, the large faces of the card will have the same surface condition. It is thus possible to give a pleasant appearance to the cards obtained by the manufacturing process according to

1 0 the invention.

Claims (19)

  1. A method of manufacturing an information medium in the form of a small card containing an electronic circuit, characterized in that: - a mold (7) is fitted with at least one molding plate (70) carrying heating means and at least one end plate (71, 72) and means intended to drive said plates in translation, - the mold (7) is heated, - minus a pocket (100), for this purpose: - we choose a frame (1) of thickness equal to that of the card to be manufactured, - we position and fix the frame (1) on a first film (2) , - the electronic circuit (4) is positioned against the lower edge (10) of the frame (1), - a second film (2 ') is positioned on the frame (1) and fixed on the lower edges (10) and sides (11, 12) of the frame (1), - a resin (5) is prepared, - a predefined volume of resin is introduced into the pocket (100), - the second wire is fixed m (2 ') on the upper edge (13) of the frame (1) in order to close the pocket (100) around its entire periphery, - the pocket (100) is positioned on a support (6) so that it is vertical during the rest time necessary for the resin, when the mold is hot and the rest time of the resin (5) has elapsed, the pockets (100) are positioned in the mold (7) against each of the molding plates ( 70), - the drive means are used to bring the mold plates (7) into contact with each other, - the pouches (100) are left in the closed mold and kept at temperature for the necessary time when the resin is polymerized, the mold is opened and the pouches are removed, - when the resin has reached its final state, the pouches are cut (100)   in the format of the card to be obtained, then the films (2, 2 ') are removed.   2. Method according to claim 1, characterized in that at least one of the films (2, 2 ') carries a decoration (3) printed on the face by which it is glued to the frame (1). 3. Method according to claim 1, characterized in that at least one   decoration (3) is carried by a decorated support which will remain fixed on one face of the card.   4. Method according to claim 1, characterized in that, when the decoration (3) consists of at least one decorated support, said decoration (3) is positioned against the lower edge (10) of the frame (1) by applying the face intended to form   the outside decorated with the card against the film (2, 2 ').   5. Method according to any one of claims 1 to 4, characterized   in that the support of the electronic circuit (4) is connected to a retaining strip (40) by bridges (41) and in that said retaining strip (40) is glued to the edge lower (10) of the frame.   6. Method according to any one of claims 1 to 5, characterized   in that the resin (5) is advantageously chosen from the resins which can be   used for coating electronic components.   7. Method according to any one of claims 1 to 6, characterized   in that each molding plate (70) has on one of its faces a generally parallelepiped recess (76) whose internal volume is connected by a conduit (78) to the lateral blank of the plate (70), this recess (76) being intended to contain a bladder (9) inflatable through a tube inserted in the duct   (78) and connected to means for supplying pressurized air.   8. Method according to claim 7, characterized in that spacers (700) defining the thickness of the cards produced in the mold (7) are positioned   on one of the faces of the molding plate (70).   9. Method according to any one of claims 1 to 8, characterized   in that the mold (7) consists of several molding plates (70), two end plates (71, 72) arranged on either side of said molding plates (70) and a plate control (73) carrying means intended to drive the plates in translation, and in that the first end plate (71) and the control plate (73) are fixed while the second end plate (72) is   moves in translation at the same time. as the molding plates (70).   10. Method according to any one of claims 1 to 9, characterized   in that each molding plate (70) is traversed by: - a first group of orifices composed of the openings (75) opening onto each face of the plate (70) and connected, inside said plate, by a bore (74) of smaller diameter, and cylindrical uprights (80) are inserted into this first group of orifices, said cylindrical uprights (80) carrying return springs (84), each being disposed between two mold plates (70 ) and in abutment by each of its ends against a shoulder (745) separating an opening (75) from a bore (74), and by - a second group composed of four orifices (77) of small diameter   in which are inserted guide rods (86).   11. Method according to any one of claims 1 to 10, characterized   in that each elongated heating means is positioned in a channel (79)   passing through each molding plate (70) parallel to its large faces.   12. Method according to any one of the preceding claims,   characterized in that permeable elements creating passages allowing the evacuation of the air which can be trapped between the pockets (100) and the plates   of the mold (7) are positioned on either side of each pocket (100).   13. Mold intended for the implementation of the method of manufacturing an information medium in the form of a card of small dimensions   containing an electronic circuit according to any one of claims 1 to 12,   characterized in that it comprises at least one molding plate (70) carrying heating means and at least one end plate (71,72) and means   intended to drive said plates in translation.   14. A mold according to claim 13, characterized in that each molding plate (70) has on one of its faces a generally parallelepiped recess (76) whose internal volume is connected by a conduit (78) to the lateral blank of the plate (70), this recess (76) being intended to contain a bladder (9) inflatable through a tube inserted in the duct (78) and connected to means of supply of pressurized air.   15. Mold according to claim 13 or according to claim 14, characterized in that spacers (700) defining the thickness of the cards produced in the mold (7) are positioned on one of the faces of the plate. molding (70).   16. Mold according to any one of claims 13 to 15 characterized   in that it consists of several molding plates (70), two end plates (71, 72) arranged on either side of said molding plates (70) and a control plate (73 ) carrying means intended to drive the plates in translation, and in that the first end plate (71) and the control plate (73) are fixed while the second end plate (72) moves   in translation at the same time as the molding plates (70).   17. Mold according to any one of claims 13 to 16, characterized   in that each molding plate (70) is traversed by: - a first group of orifices composed of the openings (75) opening onto each face of the plate (70) and connected, inside said plate, by a bore (74) of smaller diameter, and cylindrical uprights (80) are inserted into this first group of orifices, said cylindrical uprights (80) carrying return springs (84), each being disposed between two mold plates (70 ) and in abutment by each of its ends against a shoulder (745) separating an opening (75) from a bore (74), and by - a second group composed of four orifices (77) of small diameter   in which are inserted guide rods (86).   18. Mold according to any one of claims 13 to 17, characterized   in that each elongated heating means is positioned in a channel (79)   passing through each molding plate (70) parallel to its large faces.   19. Information medium in the form of a small card containing an electronic circuit characterized in that it is   manufactured by implementing the method according to any one of claims 1 to 12.