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FR2797554B1 - METHOD FOR ASSEMBLING ELECTRONIC COMPONENTS ON A SUPPORT AND ELECTRONIC DEVICE OBTAINED BY THIS METHOD - Google Patents

METHOD FOR ASSEMBLING ELECTRONIC COMPONENTS ON A SUPPORT AND ELECTRONIC DEVICE OBTAINED BY THIS METHOD

Info

Publication number
FR2797554B1
FR2797554B1 FR9910449A FR9910449A FR2797554B1 FR 2797554 B1 FR2797554 B1 FR 2797554B1 FR 9910449 A FR9910449 A FR 9910449A FR 9910449 A FR9910449 A FR 9910449A FR 2797554 B1 FR2797554 B1 FR 2797554B1
Authority
FR
France
Prior art keywords
support
device obtained
electronic device
electronic components
assembling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9910449A
Other languages
French (fr)
Other versions
FR2797554A1 (en
Inventor
Gerard Marie Martin
Meau Michel Le
Anabelle Lopez
Koupaia Henry
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Electronique SA
Original Assignee
Valeo Electronique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Electronique SA filed Critical Valeo Electronique SA
Priority to FR9910449A priority Critical patent/FR2797554B1/en
Priority to EP00958654A priority patent/EP1125480A1/en
Priority to PCT/FR2000/002281 priority patent/WO2001013687A1/en
Priority to KR1020017004550A priority patent/KR20010083902A/en
Priority to JP2001517845A priority patent/JP2003507897A/en
Publication of FR2797554A1 publication Critical patent/FR2797554A1/en
Application granted granted Critical
Publication of FR2797554B1 publication Critical patent/FR2797554B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR9910449A 1999-08-12 1999-08-12 METHOD FOR ASSEMBLING ELECTRONIC COMPONENTS ON A SUPPORT AND ELECTRONIC DEVICE OBTAINED BY THIS METHOD Expired - Fee Related FR2797554B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR9910449A FR2797554B1 (en) 1999-08-12 1999-08-12 METHOD FOR ASSEMBLING ELECTRONIC COMPONENTS ON A SUPPORT AND ELECTRONIC DEVICE OBTAINED BY THIS METHOD
EP00958654A EP1125480A1 (en) 1999-08-12 2000-08-09 Method for assembling electronic components on a support and resulting device
PCT/FR2000/002281 WO2001013687A1 (en) 1999-08-12 2000-08-09 Method for assembling electronic components on a support and resulting device
KR1020017004550A KR20010083902A (en) 1999-08-12 2000-08-09 Method for assembling electronic components on a support and resulting device
JP2001517845A JP2003507897A (en) 1999-08-12 2000-08-09 Method for mounting electronic component on support and device obtained by the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9910449A FR2797554B1 (en) 1999-08-12 1999-08-12 METHOD FOR ASSEMBLING ELECTRONIC COMPONENTS ON A SUPPORT AND ELECTRONIC DEVICE OBTAINED BY THIS METHOD

Publications (2)

Publication Number Publication Date
FR2797554A1 FR2797554A1 (en) 2001-02-16
FR2797554B1 true FR2797554B1 (en) 2001-11-02

Family

ID=9549107

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9910449A Expired - Fee Related FR2797554B1 (en) 1999-08-12 1999-08-12 METHOD FOR ASSEMBLING ELECTRONIC COMPONENTS ON A SUPPORT AND ELECTRONIC DEVICE OBTAINED BY THIS METHOD

Country Status (5)

Country Link
EP (1) EP1125480A1 (en)
JP (1) JP2003507897A (en)
KR (1) KR20010083902A (en)
FR (1) FR2797554B1 (en)
WO (1) WO2001013687A1 (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3503721A (en) * 1967-02-16 1970-03-31 Nytronics Inc Electronic components joined by tinsilver eutectic solder
DE2655238A1 (en) * 1976-12-06 1978-06-08 Patra Patent Treuhand Electroless tin plating of electric lamp leads - to permit easy machine soldering even after prolonged storage
JPS6461089A (en) * 1987-09-01 1989-03-08 Fujitsu Ltd Surface mounting structure of printed board
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
DE19512838C2 (en) * 1995-04-06 2000-09-14 Hella Kg Hueck & Co Electrical or electronic device
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JPH09153673A (en) * 1995-12-01 1997-06-10 Matsushita Electric Ind Co Ltd Solder connecting method for electronic component
CA2214130C (en) * 1996-09-19 2003-12-02 Northern Telecom Limited Assemblies of substrates and electronic components

Also Published As

Publication number Publication date
FR2797554A1 (en) 2001-02-16
EP1125480A1 (en) 2001-08-22
JP2003507897A (en) 2003-02-25
WO2001013687A1 (en) 2001-02-22
KR20010083902A (en) 2001-09-03

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20060428