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FR2782506B1 - Dispositif et procede de distribution de suspension abrasive pour le polissage mecanique de substrat - Google Patents

Dispositif et procede de distribution de suspension abrasive pour le polissage mecanique de substrat

Info

Publication number
FR2782506B1
FR2782506B1 FR9810508A FR9810508A FR2782506B1 FR 2782506 B1 FR2782506 B1 FR 2782506B1 FR 9810508 A FR9810508 A FR 9810508A FR 9810508 A FR9810508 A FR 9810508A FR 2782506 B1 FR2782506 B1 FR 2782506B1
Authority
FR
France
Prior art keywords
substrate
distribution device
mechanical polishing
abrasive suspension
suspension distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9810508A
Other languages
English (en)
Other versions
FR2782506A1 (fr
Inventor
Thierry Laederich
Georges Guarneri
Herve Dulphy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LABEILLE ETS
Original Assignee
LABEILLE ETS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LABEILLE ETS filed Critical LABEILLE ETS
Priority to FR9810508A priority Critical patent/FR2782506B1/fr
Priority to US09/223,497 priority patent/US6125876A/en
Priority to DE69903893T priority patent/DE69903893T2/de
Priority to SG1999003470A priority patent/SG75972A1/en
Priority to EP99401715A priority patent/EP0980741B1/fr
Priority to TW088112864A priority patent/TW411289B/zh
Priority to CNB991117875A priority patent/CN1139106C/zh
Priority to JP23031099A priority patent/JP4970635B2/ja
Priority to KR1019990034072A priority patent/KR100601812B1/ko
Publication of FR2782506A1 publication Critical patent/FR2782506A1/fr
Application granted granted Critical
Publication of FR2782506B1 publication Critical patent/FR2782506B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4673—Plural tanks or compartments with parallel flow
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4673—Plural tanks or compartments with parallel flow
    • Y10T137/469—Sequentially filled and emptied [e.g., holding type]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4673—Plural tanks or compartments with parallel flow
    • Y10T137/4807—Tank type manifold [i.e., one tank supplies or receives from at least two others]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Air Transport Of Granular Materials (AREA)
FR9810508A 1998-08-18 1998-08-18 Dispositif et procede de distribution de suspension abrasive pour le polissage mecanique de substrat Expired - Lifetime FR2782506B1 (fr)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FR9810508A FR2782506B1 (fr) 1998-08-18 1998-08-18 Dispositif et procede de distribution de suspension abrasive pour le polissage mecanique de substrat
US09/223,497 US6125876A (en) 1998-08-18 1998-12-29 Apparatus and process for delivering an abrasive suspension for the mechanical polishing of a substrate
SG1999003470A SG75972A1 (en) 1998-08-18 1999-07-08 Apparatus and process for delivering an abrasive suspension for the mechanical polishing of a substrate
EP99401715A EP0980741B1 (fr) 1998-08-18 1999-07-08 Dispositif et procédé de distribution de suspension abrasive pour le polissage mécanique de substrat
DE69903893T DE69903893T2 (de) 1998-08-18 1999-07-08 Verfahren und Vorrichtung zur Abgabe von Poliermittel -Aufschlämmung im mechanischen Polieren von Substraten
TW088112864A TW411289B (en) 1998-08-18 1999-07-29 Apparatus and process for delivering an abrasive suspension for the mechanical polishing of a substrate
CNB991117875A CN1139106C (zh) 1998-08-18 1999-08-11 输送基片机械抛光研磨悬浮液的设备和方法
JP23031099A JP4970635B2 (ja) 1998-08-18 1999-08-17 基板の機械研磨のための研磨懸濁液を送り出す装置
KR1019990034072A KR100601812B1 (ko) 1998-08-18 1999-08-18 기판의 기계적 연마용 연마 현탁액 송출 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9810508A FR2782506B1 (fr) 1998-08-18 1998-08-18 Dispositif et procede de distribution de suspension abrasive pour le polissage mecanique de substrat

Publications (2)

Publication Number Publication Date
FR2782506A1 FR2782506A1 (fr) 2000-02-25
FR2782506B1 true FR2782506B1 (fr) 2000-09-22

Family

ID=9529747

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9810508A Expired - Lifetime FR2782506B1 (fr) 1998-08-18 1998-08-18 Dispositif et procede de distribution de suspension abrasive pour le polissage mecanique de substrat

Country Status (9)

Country Link
US (1) US6125876A (fr)
EP (1) EP0980741B1 (fr)
JP (1) JP4970635B2 (fr)
KR (1) KR100601812B1 (fr)
CN (1) CN1139106C (fr)
DE (1) DE69903893T2 (fr)
FR (1) FR2782506B1 (fr)
SG (1) SG75972A1 (fr)
TW (1) TW411289B (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6561381B1 (en) * 2000-11-20 2003-05-13 Applied Materials, Inc. Closed loop control over delivery of liquid material to semiconductor processing tool
US6736154B2 (en) * 2001-01-26 2004-05-18 American Air Liquide, Inc. Pressure vessel systems and methods for dispensing liquid chemical compositions
US7334708B2 (en) * 2001-07-16 2008-02-26 L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Integral blocks, chemical delivery systems and methods for delivering an ultrapure chemical
DE50203258D1 (de) * 2001-12-04 2005-07-07 Levitronix Llc Waltham Abgabevorrichtung für ein Fluid
EP1318306B1 (fr) * 2001-12-04 2005-06-01 Levitronix LLC Dispositif de distribution de liquid
US20040197731A1 (en) * 2003-03-27 2004-10-07 Swan Keith Daniel Dental abrasive system using helium gas
JP4852323B2 (ja) * 2006-03-07 2012-01-11 株式会社荏原製作所 液供給方法、液供給装置、基板研磨装置、液供給流量測定方法
WO2009076276A2 (fr) * 2007-12-06 2009-06-18 Advanced Technology Materials, Inc. Systèmes et procédés pour la délivrance de combinaisons de matériaux de traitement contenant du fluide
CN102248489B (zh) * 2010-05-21 2013-05-29 中芯国际集成电路制造(上海)有限公司 一种脉动缓冲器及研磨液供应系统
CN102806526A (zh) * 2011-05-31 2012-12-05 无锡华润上华半导体有限公司 研磨液供应系统
CN103522171B (zh) * 2012-07-05 2016-04-06 上海华虹宏力半导体制造有限公司 一种用于抛光垫研磨盘的氮气输送装置
US9770804B2 (en) 2013-03-18 2017-09-26 Versum Materials Us, Llc Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture
US9841010B2 (en) * 2014-02-14 2017-12-12 Stephen B. Maguire Method and apparatus for closed loop automatic refill of liquid color
JP6450650B2 (ja) * 2015-06-16 2019-01-09 東京エレクトロン株式会社 処理装置、処理方法および記憶媒体
JP6562396B2 (ja) * 2015-07-17 2019-08-21 大成建設株式会社 電池電極スラリー分配装置、電池電極スラリー処理装置、電池電極スラリー分配方法、懸濁液分配装置、および懸濁液分配方法
CN108274396B (zh) * 2017-12-26 2020-06-12 中国科学院长春光学精密机械与物理研究所 一种用于光学研抛浆料供给的低速液流控制装置及方法
JP7064979B2 (ja) * 2018-06-25 2022-05-11 株式会社荏原製作所 流体の漏洩を確認する方法、および研磨装置
JP6538952B1 (ja) * 2018-12-11 2019-07-03 株式会社西村ケミテック 研磨液供給装置
JP6538954B1 (ja) * 2018-12-11 2019-07-03 株式会社西村ケミテック 研磨液供給装置
CN109696802B (zh) * 2019-01-16 2024-05-07 宁波南大光电材料有限公司 一种溶剂生产设备、溶剂制备及取用方法
JP6887693B2 (ja) * 2019-07-16 2021-06-16 エリーパワー株式会社 循環装置、処理装置および電池電極スラリーの循環方法
JP7583383B2 (ja) * 2021-05-12 2024-11-14 株式会社西村ケミテック 薬液供給装置及び薬液供給方法
CN114102439B (zh) * 2021-11-23 2024-01-09 大连大学 智能芯片化学研磨液供给方法
KR102431849B1 (ko) * 2022-01-21 2022-08-12 웨스글로벌 주식회사 씨엠피 슬러리 혼합 및 공급 제어 시스템

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317649Y2 (fr) * 1985-04-24 1988-05-18
US5148945B1 (en) * 1990-09-17 1996-07-02 Applied Chemical Solutions Apparatus and method for the transfer and delivery of high purity chemicals
US5503139A (en) * 1994-02-02 1996-04-02 Mcmahon; Michael D. Continuous flow adaptor for a nebulizer
US5722447A (en) * 1994-04-29 1998-03-03 Texas Instruments Incorporated Continuous recirculation fluid delivery system and method
DE69529751D1 (de) * 1994-07-19 2003-04-03 Applied Chemical Solutions Hol Vorrichtung und methode zur anwendung beim chemischen-mechanischen polieren
KR19980064179A (ko) * 1996-12-19 1998-10-07 윌리엄비.켐플러 웨이퍼 연마 공정시 실리콘 제거율을 안정화하는 방법

Also Published As

Publication number Publication date
DE69903893T2 (de) 2003-10-09
JP2000071173A (ja) 2000-03-07
KR20000017362A (ko) 2000-03-25
FR2782506A1 (fr) 2000-02-25
EP0980741B1 (fr) 2002-11-13
DE69903893D1 (de) 2002-12-19
KR100601812B1 (ko) 2006-07-19
CN1139106C (zh) 2004-02-18
EP0980741A1 (fr) 2000-02-23
TW411289B (en) 2000-11-11
CN1247381A (zh) 2000-03-15
JP4970635B2 (ja) 2012-07-11
SG75972A1 (en) 2000-10-24
US6125876A (en) 2000-10-03

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