FR2774197B1 - PROCESS FOR MANUFACTURING A MICROCIRCUIT CARD AND CARD OBTAINED BY THE IMPLEMENTATION OF THIS PROCESS - Google Patents
PROCESS FOR MANUFACTURING A MICROCIRCUIT CARD AND CARD OBTAINED BY THE IMPLEMENTATION OF THIS PROCESSInfo
- Publication number
- FR2774197B1 FR2774197B1 FR9800778A FR9800778A FR2774197B1 FR 2774197 B1 FR2774197 B1 FR 2774197B1 FR 9800778 A FR9800778 A FR 9800778A FR 9800778 A FR9800778 A FR 9800778A FR 2774197 B1 FR2774197 B1 FR 2774197B1
- Authority
- FR
- France
- Prior art keywords
- card
- implementation
- manufacturing
- microcircuit
- microcircuit card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9800778A FR2774197B1 (en) | 1998-01-26 | 1998-01-26 | PROCESS FOR MANUFACTURING A MICROCIRCUIT CARD AND CARD OBTAINED BY THE IMPLEMENTATION OF THIS PROCESS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9800778A FR2774197B1 (en) | 1998-01-26 | 1998-01-26 | PROCESS FOR MANUFACTURING A MICROCIRCUIT CARD AND CARD OBTAINED BY THE IMPLEMENTATION OF THIS PROCESS |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2774197A1 FR2774197A1 (en) | 1999-07-30 |
FR2774197B1 true FR2774197B1 (en) | 2001-11-23 |
Family
ID=9522143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9800778A Expired - Lifetime FR2774197B1 (en) | 1998-01-26 | 1998-01-26 | PROCESS FOR MANUFACTURING A MICROCIRCUIT CARD AND CARD OBTAINED BY THE IMPLEMENTATION OF THIS PROCESS |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2774197B1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6032136A (en) * | 1998-11-17 | 2000-02-29 | First Usa Bank, N.A. | Customer activated multi-value (CAM) card |
FR2806189B1 (en) * | 2000-03-10 | 2002-05-31 | Schlumberger Systems & Service | REINFORCED INTEGRATED CIRCUIT AND METHOD FOR REINFORCING INTEGRATED CIRCUITS |
JP2005276176A (en) * | 2004-02-27 | 2005-10-06 | Toshiba Corp | Portable electronic device |
EP1615165A1 (en) * | 2004-07-07 | 2006-01-11 | Axalto SA | Chip card with prevention of crack propagation in the card body |
EP2418608A1 (en) * | 2010-07-23 | 2012-02-15 | Gemalto SA | Secure electronic module, device with secure electronic module and manufacturing method |
FR3144885A1 (en) * | 2023-01-09 | 2024-07-12 | Linxens Holding | Reinforced smart card module and method of manufacturing such a smart card |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62214998A (en) * | 1986-03-17 | 1987-09-21 | 三菱電機株式会社 | Thin-type semiconductor card |
US4921160A (en) * | 1988-02-29 | 1990-05-01 | American Telephone And Telegraph Company | Personal data card and method of constructing the same |
US5581445A (en) * | 1994-02-14 | 1996-12-03 | Us3, Inc. | Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module |
-
1998
- 1998-01-26 FR FR9800778A patent/FR2774197B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2774197A1 (en) | 1999-07-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2740371B1 (en) | METHOD FOR MANUFACTURING A BLADE | |
FR2716281B1 (en) | Method of manufacturing a contactless card. | |
FR2716555B1 (en) | Method of manufacturing a contactless card. | |
EP1280190A4 (en) | PROCESS FOR PRODUCING COMPOUND NITRIDE SEMICONDUCTOR III, AND COMPOUND NITRIDE SEMICONDUCTOR III | |
BR9504327A (en) | Process for manufacturing low expansion molecular sieve corsages | |
FR2741191B1 (en) | PROCESS FOR MANUFACTURING A MICROMODULE, PARTICULARLY FOR CHIP CARDS | |
EP1367611A4 (en) | INDUCTANCE PART AND METHOD FOR PRODUCING THE SAME | |
FR2776796B1 (en) | METHOD FOR MANUFACTURING CHIP CARDS | |
FR2733526B1 (en) | PROCESS FOR MANUFACTURING A CUNETTE | |
FR2774197B1 (en) | PROCESS FOR MANUFACTURING A MICROCIRCUIT CARD AND CARD OBTAINED BY THE IMPLEMENTATION OF THIS PROCESS | |
FR2786939B1 (en) | SEMICONDUCTOR LASER AND PROCESS FOR PRODUCING THE SAME | |
FR2793331B1 (en) | METHOD FOR MANUFACTURING A MICROCIRCUIT CARD | |
FR2728765B3 (en) | METHOD FOR MANUFACTURING A FIRST OF FOOTWEAR, AND FIRST AND FOOTWEAR FORMED BY ITS IMPLEMENTATION | |
FR2777675B1 (en) | METHOD OF MANUFACTURING A MICROCIRCUIT CARD AND A MICROCIRCUIT CARD OBTAINED BY IMPLEMENTATION OF THIS PROCESS | |
EP1391725A4 (en) | PHOSPHOPROTEIN IDENTIFICATION METHOD | |
FR2769530B1 (en) | METHOD FOR MANUFACTURING A CONNECTING ROD | |
FR2801968B1 (en) | METHOD FOR IDENTIFYING OSCILLATIONS | |
FR2665281B1 (en) | PROCESS FOR MANUFACTURING A MICROCIRCUIT CARD AND CARD OBTAINED BY THIS PROCESS. | |
FR2735998B1 (en) | PROCESS FOR MANUFACTURING COMPOSITE-METAL-MATRIX CONSTRUCTION ELEMENTS (MMC) | |
FR2775099B1 (en) | METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT CARD | |
FR2724040B1 (en) | METHOD FOR MANUFACTURING A CHIP CARD AND CARD THUS OBTAINED | |
FR2778768B1 (en) | METHOD FOR PERSONALIZING A CHIP CARD | |
FR2779007B1 (en) | PROCESS FOR FORMING A CONDUCTIVE STRUCTURE | |
FR2780915B1 (en) | METHOD FOR MANUFACTURING LABELS | |
FR2760015B1 (en) | PROCESS FOR THE INDUSTRIAL MANUFACTURE OF DIOSMINE FROM HESPERIDINE |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 19 |
|
PLFP | Fee payment |
Year of fee payment: 20 |