FR2769100B1 - Boitier pour dispositif photosemi-conducteur - Google Patents
Boitier pour dispositif photosemi-conducteurInfo
- Publication number
- FR2769100B1 FR2769100B1 FR9812235A FR9812235A FR2769100B1 FR 2769100 B1 FR2769100 B1 FR 2769100B1 FR 9812235 A FR9812235 A FR 9812235A FR 9812235 A FR9812235 A FR 9812235A FR 2769100 B1 FR2769100 B1 FR 2769100B1
- Authority
- FR
- France
- Prior art keywords
- photosemic
- conductor
- housing
- photosemic conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26637797A JP3526518B2 (ja) | 1997-09-30 | 1997-09-30 | 光半導体素子収納用パッケージ |
JP35585097A JP3502756B2 (ja) | 1997-12-24 | 1997-12-24 | 光半導体素子収納用パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2769100A1 FR2769100A1 (fr) | 1999-04-02 |
FR2769100B1 true FR2769100B1 (fr) | 2003-05-30 |
Family
ID=26547415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9812235A Expired - Fee Related FR2769100B1 (fr) | 1997-09-30 | 1998-09-30 | Boitier pour dispositif photosemi-conducteur |
Country Status (2)
Country | Link |
---|---|
US (1) | US6031253A (fr) |
FR (1) | FR2769100B1 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4284634B2 (ja) * | 1999-10-29 | 2009-06-24 | 富士通株式会社 | 半導体受光装置 |
US7019335B2 (en) * | 2001-04-17 | 2006-03-28 | Nichia Corporation | Light-emitting apparatus |
JP2003050341A (ja) * | 2001-08-06 | 2003-02-21 | Yamaha Corp | 光学部品複合体およびその製造方法 |
WO2003063309A2 (fr) | 2002-01-18 | 2003-07-31 | Oepic, Inc. | Boitiers to optoelectroniques a haute vitesse |
US20050018994A1 (en) * | 2003-07-24 | 2005-01-27 | Oepic, Inc. | Active and passive to-can extension boards |
JP4491657B2 (ja) * | 2003-09-19 | 2010-06-30 | 三菱電機株式会社 | 光学部品および金属ホルダ |
TWM273824U (en) * | 2005-03-21 | 2005-08-21 | Wen-Jen Li | Ultra high brightness LED |
US7500793B2 (en) * | 2005-05-31 | 2009-03-10 | Greene, Tweed Of Delaware, Inc. | High-pressure/high-temperature seals between glass fibers and metals, downhole optical feedthroughs containing the same, and methods of preparing such seals |
US10158357B1 (en) | 2016-04-05 | 2018-12-18 | Vlt, Inc. | Method and apparatus for delivering power to semiconductors |
US10903734B1 (en) | 2016-04-05 | 2021-01-26 | Vicor Corporation | Delivering power to semiconductor loads |
US10785871B1 (en) | 2018-12-12 | 2020-09-22 | Vlt, Inc. | Panel molded electronic assemblies with integral terminals |
US11336167B1 (en) | 2016-04-05 | 2022-05-17 | Vicor Corporation | Delivering power to semiconductor loads |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5422115B2 (fr) * | 1972-05-19 | 1979-08-04 | ||
US4307934A (en) * | 1978-05-08 | 1981-12-29 | General Dynamics, Pomona Division | Packaged fiber optic modules |
DE3642153A1 (de) * | 1986-12-10 | 1988-06-23 | Bosch Gmbh Robert | Tragbare handwerkzeugmaschine, insbesondere winkelschleifer |
JP2871780B2 (ja) * | 1990-01-22 | 1999-03-17 | 日本電気株式会社 | 光結合用レンズ付きホルダ |
JP3067151B2 (ja) * | 1990-03-13 | 2000-07-17 | 日本電気株式会社 | 光電気変換素子サブキャリア |
US5108167A (en) * | 1990-07-16 | 1992-04-28 | Rockwell International Corporation | Method and apparatus for obtaining a simplified electro-optical signal coupling system |
JP3110039B2 (ja) * | 1990-10-31 | 2000-11-20 | 日本電気株式会社 | 半導体レーザモジュール |
JPH05127050A (ja) * | 1991-10-30 | 1993-05-25 | Hitachi Ltd | 半導体レーザモジユール |
JP3199611B2 (ja) * | 1995-08-09 | 2001-08-20 | 京セラ株式会社 | 光半導体素子収納用パッケージ |
-
1998
- 1998-09-29 US US09/163,080 patent/US6031253A/en not_active Expired - Lifetime
- 1998-09-30 FR FR9812235A patent/FR2769100B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2769100A1 (fr) | 1999-04-02 |
US6031253A (en) | 2000-02-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20160531 |