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FR2749477B3 - Ensemble siege d'ergots/ventilateur pour circuit integre - Google Patents

Ensemble siege d'ergots/ventilateur pour circuit integre

Info

Publication number
FR2749477B3
FR2749477B3 FR9606727A FR9606727A FR2749477B3 FR 2749477 B3 FR2749477 B3 FR 2749477B3 FR 9606727 A FR9606727 A FR 9606727A FR 9606727 A FR9606727 A FR 9606727A FR 2749477 B3 FR2749477 B3 FR 2749477B3
Authority
FR
France
Prior art keywords
ergots
seat
integrated circuit
fan assembly
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9606727A
Other languages
English (en)
Other versions
FR2749477A3 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to GB9608158A priority Critical patent/GB2312324B/en
Priority to US08/636,397 priority patent/US5734553A/en
Priority to DE29608072U priority patent/DE29608072U1/de
Application filed by Individual filed Critical Individual
Priority to FR9606727A priority patent/FR2749477B3/fr
Publication of FR2749477A3 publication Critical patent/FR2749477A3/fr
Application granted granted Critical
Publication of FR2749477B3 publication Critical patent/FR2749477B3/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
FR9606727A 1996-04-19 1996-05-31 Ensemble siege d'ergots/ventilateur pour circuit integre Expired - Lifetime FR2749477B3 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB9608158A GB2312324B (en) 1996-04-19 1996-04-19 Fan/pins seat assembly for an integrated circuit
US08/636,397 US5734553A (en) 1996-04-19 1996-04-23 Fan/pins seat assembly for an intergrated circuit
DE29608072U DE29608072U1 (de) 1996-04-19 1996-05-04 Ventilator-Stifteaufnahme-Kombination für eine integrierte Schaltung
FR9606727A FR2749477B3 (fr) 1996-04-19 1996-05-31 Ensemble siege d'ergots/ventilateur pour circuit integre

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB9608158A GB2312324B (en) 1996-04-19 1996-04-19 Fan/pins seat assembly for an integrated circuit
US08/636,397 US5734553A (en) 1996-04-19 1996-04-23 Fan/pins seat assembly for an intergrated circuit
DE29608072U DE29608072U1 (de) 1996-04-19 1996-05-04 Ventilator-Stifteaufnahme-Kombination für eine integrierte Schaltung
FR9606727A FR2749477B3 (fr) 1996-04-19 1996-05-31 Ensemble siege d'ergots/ventilateur pour circuit integre

Publications (2)

Publication Number Publication Date
FR2749477A3 FR2749477A3 (fr) 1997-12-05
FR2749477B3 true FR2749477B3 (fr) 1998-04-24

Family

ID=27439120

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9606727A Expired - Lifetime FR2749477B3 (fr) 1996-04-19 1996-05-31 Ensemble siege d'ergots/ventilateur pour circuit integre

Country Status (4)

Country Link
US (1) US5734553A (fr)
DE (1) DE29608072U1 (fr)
FR (1) FR2749477B3 (fr)
GB (1) GB2312324B (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2322962B (en) * 1997-03-03 2001-10-10 Motor One Electronics Inc Heat dissipating fan/integrated circuit assemblies
DE19710375C2 (de) * 1997-03-13 2002-11-07 Micronas Semiconductor Holding Verfahren zum Herstellen von räumlich strukturierten Bauteilen
GB2330901B (en) * 1997-11-04 2001-05-09 Sunonwealth Electr Mach Ind Co Heat dissipation device
USD403755S (en) * 1998-04-06 1999-01-05 Robert Liang Fan
US6229706B1 (en) 1998-04-27 2001-05-08 Aavid Thermal Products, Inc. Reverse cantilever spring clip
US6109890A (en) * 1998-07-02 2000-08-29 Sunonwealth Electric Machine Industry Co., Ltd. Miniature blower assembly for outputting air in a certain direction
CA2343751A1 (fr) * 1998-07-27 2000-02-10 Webtv Networks, Inc. Acces a un ordinateur eloigne
US6017185A (en) * 1998-08-13 2000-01-25 Chaun-Choung Industrial Corp. Fan fixing structure of a radiator
US6282091B1 (en) * 1999-11-11 2001-08-28 Sunonwealth Electric Machine Industry Co. Ltd Mounting devices for a heat-generating element and a heat-dissipating device
FR2810192A1 (fr) * 2000-06-08 2001-12-14 Cit Alcatel Montage electronique a haute densite d'interconnexions
JP4431263B2 (ja) * 2000-09-29 2010-03-10 山洋電気株式会社 電子部品冷却装置
US7164582B2 (en) * 2004-10-29 2007-01-16 Hewlett-Packard Development Company, L.P. Cooling system with submerged fan
JP2006250132A (ja) * 2005-03-14 2006-09-21 Nippon Densan Corp 送風機及びその関連技術
GB0512292D0 (en) * 2005-06-16 2005-07-27 Global Cross Search Ltd A heat dissipating fan
US7235895B2 (en) * 2005-10-13 2007-06-26 General Electric Company Method and apparatus for gravity induced thermal energy dissipation
US7619892B2 (en) * 2008-02-05 2009-11-17 Malico Inc. Positioning device for heatsink
CN105378417A (zh) * 2013-04-26 2016-03-02 酷奇普科技股份有限公司 具有固定式翅片的动力学散热器
JP2015021427A (ja) * 2013-07-18 2015-02-02 日本電産株式会社 送風ファン
FR3063864B1 (fr) 2017-03-09 2019-07-05 Aptiv Technologies Limited Dispositif electronique pour vehicule automobile
US20230378024A1 (en) * 2022-05-17 2023-11-23 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package structures and methods of forming the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2901867B2 (ja) * 1993-03-19 1999-06-07 富士通株式会社 ヒートシンク及びヒートシンクの取付構造
US5287249A (en) * 1993-07-07 1994-02-15 Global Win Technology Co., Ltd. Fin assembly for an integrated circuit
US5335722A (en) * 1993-09-30 1994-08-09 Global Win Technology Co., Ltd Cooling assembly for an integrated circuit
US5368094A (en) * 1993-11-02 1994-11-29 Hung; Chin-Ping Bipartite heat sink positioning device for computer chips
US5377745A (en) * 1993-11-30 1995-01-03 Hsieh; Hsin M. Cooling device for central processing unit
US5436798A (en) * 1994-01-21 1995-07-25 Wakefield Engineering, Inc. Spring clip and heat sink assembly for electronic components
US5430610A (en) * 1994-06-15 1995-07-04 Hung; Chin-Ping Separable positioning device for the heat sink on computer chips
US5421402A (en) * 1994-11-22 1995-06-06 Lin; Chuen-Sheng Heat sink apparatus
GB2298520B (en) * 1995-03-03 1999-09-08 Hong Chen Fu In Heat sink device for integrated circuit

Also Published As

Publication number Publication date
FR2749477A3 (fr) 1997-12-05
DE29608072U1 (de) 1996-07-25
GB2312324B (en) 2000-11-15
GB9608158D0 (en) 1996-06-26
GB2312324A (en) 1997-10-22
US5734553A (en) 1998-03-31

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