FR2735256A1 - INTEGRATED CIRCUIT CARD - Google Patents
INTEGRATED CIRCUIT CARD Download PDFInfo
- Publication number
- FR2735256A1 FR2735256A1 FR9506840A FR9506840A FR2735256A1 FR 2735256 A1 FR2735256 A1 FR 2735256A1 FR 9506840 A FR9506840 A FR 9506840A FR 9506840 A FR9506840 A FR 9506840A FR 2735256 A1 FR2735256 A1 FR 2735256A1
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- groove
- card
- intermediate support
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 238000005452 bending Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 239000003292 glue Substances 0.000 description 5
- 239000012792 core layer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
La présente invention concerne une carte à circuit intégré. The present invention relates to an integrated circuit card.
On connaît des cartes à circuit intégré comportant un corps de carte ayant une cavité dans laquelle est disposé un module comportant un support intermédiaire portant des plages de contact et un circuit intégré relié aux plages de contact par des organes de liaison, par exemple des fils d'or ayant une extrémité soudée à un des plots du circuit intégré et une extrémité opposée soudée à l'une des plages de contact. Pour protéger le circuit intégré et les organes de liaisons, le circuit intégré et les organes de liaison sont recouverts d'une résine polymérisée. Lorsque le module est monté sur une carte, celle-ci est soumise lors de son utilisation à des efforts de flexion qui tendent à provoquer des fissures dans la résine.Les éléments de liaison étant très fins, l'écartement des parois d'une fissure provoque instantanément la rupture d'un organe de liaison, mettant ainsi le module hors service. Integrated circuit cards are known comprising a card body having a cavity in which is disposed a module comprising an intermediate support carrying contact pads and an integrated circuit connected to the contact pads by connecting members, for example wires gold having one end soldered to one of the pads of the integrated circuit and an opposite end soldered to one of the contact pads. To protect the integrated circuit and the connecting members, the integrated circuit and the connecting members are covered with a polymerized resin. When the module is mounted on a card, it is subjected during its use to bending forces which tend to cause cracks in the resin. The connecting elements being very fine, the spacing of the walls of a crack instantly causes a link member to rupture, thereby disabling the module.
Dans le cas de cartes laminées, c'est-à-dire dans le cas d'une carte comprenant une couche de coeur dans laquelle s'étend le bloc de résine contenant le circuit intégré et des couches de recouvrement disposées de part et d'autre de la couche de coeur, il est connu du document DE34 20 051 de réaliser dans la couche de coeur une rainure ou des perforations qui entourent la zone dans laquelle est disposé le module, cette rainure ou ces perforations étant recouvertes par la couche de recouvrement de façon à être masquée par celle-ci après laminage. Dans une carte comprenant un corps de carte en une seule pièce la réalisation d'une rainure dans le corps de carte resterait apparente, ce qui est généralement incompatible avec les conditions de manipulation de la carte.En outre, dans le document cité, la rainure ou les perforations sont réalisées à une distance substantielle du circuit intégré de sorte que le bloc de résine reste soumis à des contraintes importantes résultant de la flexion de la partie de carte comprise dans le périmètre délimité par la rainure ou les perforations. In the case of laminated cards, that is to say in the case of a card comprising a core layer in which extends the resin block containing the integrated circuit and covering layers arranged on either side other from the core layer, it is known from document DE34 20 051 to produce in the core layer a groove or perforations which surround the zone in which the module is arranged, this groove or these perforations being covered by the covering layer so as to be masked by it after rolling. In a card comprising a card body in one piece, the creation of a groove in the card body would remain apparent, which is generally incompatible with the conditions for handling the card. Furthermore, in the cited document, the groove or the perforations are made at a substantial distance from the integrated circuit so that the resin block remains subject to significant stresses resulting from the bending of the card part included in the perimeter delimited by the groove or the perforations.
Selon un mode de réalisation de l'invention on propose une carte à circuit intégré comportant un corps de carte ayant une cavité dans laquelle est disposé un module comportant un support intermédiaire portant des plages de contact et un circuit intégré relié aux plages de contact par des organes de liaison recouverts de résine, dans laquelle le corps de carte comporte au moins une rainure entourant au moins partiellement la résine et s'étendant à l'aplomb du support intermédiaire. According to one embodiment of the invention there is provided an integrated circuit card comprising a card body having a cavity in which is disposed a module comprising an intermediate support carrying contact pads and an integrated circuit connected to the contact pads by resin-coated connecting members, in which the card body has at least one groove at least partially surrounding the resin and extending directly above the intermediate support.
Ainsi, lors de la mise en place du module le support intermédiaire masque la rainure. En outre, le support intermédiaire s'étend généralement sur une zone de relativement faibles dimensions autour du circuit intégré de sorte que la zone de la carte qui est protégée contre les contraintes de flexion est de dimension réduite et ne risque pas d'être elle-même soumise à une flexion générant des contraintes importantes susceptibles de provoquer des fissures dans le bloc de résine. Thus, during the installation of the module the intermediate support hides the groove. In addition, the intermediate support generally extends over a relatively small area around the integrated circuit so that the area of the card which is protected against bending stresses is of reduced size and is not likely to be itself even subject to bending, generating significant stresses liable to cause cracks in the resin block.
Selon une version avantageuse de ce mode de réalisation de l'invention, la rainure s'étend de façon continue tout autour du circuit intégré et des organes de liaison associés. Ainsi on assure une protection des organes de liaison quelle que soit la direction de flexion de la carte. According to an advantageous version of this embodiment of the invention, the groove extends continuously all around the integrated circuit and the associated connecting members. This ensures protection of the connecting members whatever the bending direction of the card.
Selon un autre aspect avantageux de ce mode de réalisation de l'invention la rainure s'étend de façon adjacente à un bord du support intermédiaire. Ainsi, la rainure sert non seulement à éviter la transmission des contraintes résultant de la flexion de la carte mais également à recueillir un éventuel surplus de colle qui pourrait résulter d'un fluage de la colle servant à fixer le module sur le corps de carte. According to another advantageous aspect of this embodiment of the invention, the groove extends adjacent to an edge of the intermediate support. Thus, the groove is used not only to avoid the transmission of the stresses resulting from the bending of the card but also to collect any excess glue which could result from a creep of the glue used to fix the module on the card body.
Selon un second mode de réalisation de l'invention en relation avec une carte comportant un corps de carte dans lequel est fixé un circuit intégré et ayant une face comportant des pistes conductrices reliant des plots du circuit intégré à des plages conductrices, les pistes conductrices étant recouvertes d'une couche de résine, le corps de carte comporte au moins une rainure entourant au moins partiellement le circuit intégré et s'étendant à l'aplomb de la couche de résine. According to a second embodiment of the invention in relation to a card comprising a card body in which an integrated circuit is fixed and having a face comprising conductive tracks connecting pads of the integrated circuit to conductive pads, the conductive tracks being covered with a resin layer, the card body has at least one groove at least partially surrounding the integrated circuit and extending directly above the resin layer.
Selon un aspect avantageux de ce mode de réalisation de l'invention la rainure s'étend entre les pistes conductrices au voisinage du circuit intégré. On réduit ainsi au minimum les dimensions de la zone désolidarisée de sorte que les risques de générer des contraintes de flexion dans cette zone sont minimisés. According to an advantageous aspect of this embodiment of the invention, the groove extends between the conductive tracks in the vicinity of the integrated circuit. The dimensions of the separated zone are thus reduced to a minimum so that the risks of generating bending stresses in this zone are minimized.
D'autres caractéristiques et avantages de l'in- vention apparaîtront à la lecture de la description qui suit de modes de réalisation particuliers non limitatifs de l'invention, en relation avec les figures ci-jointes qui parmi lesquelles
- la figure 1 est une vue en coupe partielle très agrandie d'une carte à circuit intégré selon un premier mode de réalisation de l'invention.,
- la figure 2 est une vue de dessus partielle, partiellement écorchée, d'un second mode de réalisation de l'invention,
- la figure 3 est une vue en coupe selon la ligne
III-III de la figure 2.Other characteristics and advantages of the invention will appear on reading the following description of particular non-limiting embodiments of the invention, in relation to the attached figures which among which
- Figure 1 is a very enlarged partial sectional view of an integrated circuit card according to a first embodiment of the invention.,
FIG. 2 is a partial top view, partially cut away, of a second embodiment of the invention,
- Figure 3 is a sectional view along the line
III-III of figure 2.
En référence à la figure 1, la carte à circuit intégré selon ce premier mode de réalisation de l'invention comprend d'une façon conventionnelle un corps de carte 1 en matière plastique dans lequel a été fraisée une cavité généralement désignée en 2 recevant un module comportant un support intermédiaire 3 portant sur l'une de ses faces des plaques de contact 4 et sur la face opposée un circuit intégré 5 dont les plots sont reliés aux plages de contact 4 par des organes de liaison 6 qui sont formés par des fils dans le mode de réalisation illustré. Le circuit intégré 5 et les organes de liaison 6 sont noyés dans un bloc de résine 7 ayant des dimensions inférieures à celles du support intermédiaire de sorte que celui-ci s'étend au-delà de la paroi latérale du bloc de résine 7. Le module ainsi formé est collé dans la cavité 2 par une couche de colle 8. With reference to FIG. 1, the integrated circuit card according to this first embodiment of the invention comprises in a conventional manner a card body 1 of plastic material in which has been milled a cavity generally designated at 2 receiving a module comprising an intermediate support 3 carrying on one of its faces contact plates 4 and on the opposite face an integrated circuit 5 whose pads are connected to the contact pads 4 by connecting members 6 which are formed by wires in the illustrated embodiment. The integrated circuit 5 and the connecting members 6 are embedded in a resin block 7 having dimensions smaller than those of the intermediate support so that the latter extends beyond the side wall of the resin block 7. The module thus formed is glued into the cavity 2 by a layer of glue 8.
Selon le mode réalisation de l'invention tel qu'illustré, le corps de carte 1 comporte en outre une rainure annulaire 9 s'étendant à l'aplomb du bord externe du support intermédiaire 3 sur une profondeur sensiblement égale à l'épaisseur du module de façon à délimiter autour du bloc de résine 7 une zone désolidarisée du reste du corps de la carte. Une rainure d'une largeur de quelques dixièmes de millimètre suffit à désolidariser une zone qui est ainsi protégée des contraintes résultant d'une flexion de la partie environnante du corps de carte. According to the embodiment of the invention as illustrated, the card body 1 also comprises an annular groove 9 extending perpendicular to the external edge of the intermediate support 3 over a depth substantially equal to the thickness of the module so as to delimit around the resin block 7 an area separated from the rest of the card body. A groove with a width of a few tenths of a millimeter is sufficient to separate an area which is thus protected from the stresses resulting from bending of the surrounding part of the card body.
Dans ce mode de réalisation de l'invention la partie périphérique du support intermédiaire 3 masque la rainure 9 de sorte que la carte apparaît avec une surface sensiblement continue. En outre, la rainure 9 en bordure du support intermédiaire 3 présente l'avantage de recueillir le surplus éventuel de colle 8 qui est libre de fluer dans la rainure 9 lorsque le module est mis en place dans le corps de carte alors que dans les cartes de l'art antérieur ce surplus de colle tendait à ressortir le long du bord du support intermédiaire, ce qui conduisait éventuellement à une mise au rebut de la carte et à un encrassement de la presse de mise en place des modules. In this embodiment of the invention the peripheral part of the intermediate support 3 masks the groove 9 so that the card appears with a substantially continuous surface. In addition, the groove 9 at the edge of the intermediate support 3 has the advantage of collecting any excess glue 8 which is free to creep in the groove 9 when the module is placed in the card body while in the cards. from the prior art, this excess glue tended to come out along the edge of the intermediate support, which eventually led to a scrapping of the card and to a fouling of the press for installing the modules.
En référence aux figures 2 et 3, le module comporte également de façon connue en soi un corps de carte 1 dans lequel un circuit intégré a été mis en place en chauffant le circuit intégré au moyen d'un poinçon chauf fant et en appliquant une pression pour faire pénétrer le circuit intégré dans la masse du corps de carte, un dépôt d'encre conductrice étant ensuite effectué, par exemple par sérigraphie, pour réaliser des pistes conductrices 10 en une seule pièce avec des plages conductrices 11 recouvertes dune couche de résine 12 comportant des évidements à l'aplomb des plages conductrices 11. Selon ce mode de réalisation de l'invention le corps de carte comporte des segments de rainure 13 s'étendant à l'aplomb de la couche de résine 12 entre les pistes conductrices 10 et entourant le circuit intégré 5.Les segments de rainure 13 sont par exemple réalisés par un poinçon chauffant en même temps que la mise en place du circuit intégré. Ils peuvent également être réalisés indépendamment, par exemple par fraisage. La résine 12 ayant une largeur très faible il s'est avéré qu'elle n'était pas remplie par la résine 12 lors de l'application de celle-ci. With reference to FIGS. 2 and 3, the module also comprises, in a manner known per se, a card body 1 in which an integrated circuit has been put in place by heating the integrated circuit by means of a hot punch and applying pressure. to penetrate the integrated circuit into the mass of the card body, a deposit of conductive ink is then carried out, for example by screen printing, to produce conductive tracks 10 in one piece with conductive pads 11 covered with a layer of resin 12 comprising recesses in line with the conductive pads 11. According to this embodiment of the invention, the card body comprises groove segments 13 extending in line with the resin layer 12 between the conductive tracks 10 and surrounding the integrated circuit 5.The groove segments 13 are for example produced by a heating punch at the same time as the establishment of the integrated circuit. They can also be produced independently, for example by milling. The resin 12 having a very small width it turned out that it was not filled with the resin 12 during the application of the latter.
Bien entendu l'invention n'est pas limitée au mode de réalisation décrit et on peut y apporter des variantes de réalisation sans sortir du cadre de l'invention. Of course, the invention is not limited to the embodiment described and it is possible to make variant embodiments without departing from the scope of the invention.
En particulier, bien que l'invention ait été décrite avec une seule rainure disposée à l'aplomb du bord de support intermédiaire 3, on peut prévoir de réaliser plusieurs rainures concentriques ou une seule rainure disposée dans la partie intermédiaire entre le bord du support intermédiaire 3 et le bloc de résine 7. Si la flexibilité de la matière constituant le corps de carte le permet, il est également possible.de réaliser une rainure 9 ayant une profondeur moindre que la hauteur du bloc de résine 7. In particular, although the invention has been described with a single groove disposed vertically above the intermediate support edge 3, provision may be made for making several concentric grooves or a single groove disposed in the intermediate portion between the edge of the intermediate support 3 and the resin block 7. If the flexibility of the material constituting the card body allows, it is also possible to make a groove 9 having a depth less than the height of the resin block 7.
On peut également prévoir une rainure supplémentaire concentrique à la rainure 9 et débouchant sur la face de la carte opposée au module, les deux rainures étant disposées pour que la matière restante entre les deux rainures forme une charnière désolidarisant de façon pratiquement totale la zone du module par rapport au reste de la carte. It is also possible to provide an additional groove concentric with the groove 9 and opening onto the face of the card opposite the module, the two grooves being arranged so that the material remaining between the two grooves forms a hinge which almost completely separates the zone from the module. compared to the rest of the map.
Dans le premier mode de réalisation, la rainure peut soit s'étendre tout autour du bloc de résine soit être limitée à des segments correspondant aux directions privilégiées des contraintes. In the first embodiment, the groove can either extend all around the resin block or be limited to segments corresponding to the preferred directions of the constraints.
Dans le second mode de réalisation la rainure peut également entourer totalement le circuit intégré. Dans ce cas, pour éviter une rupture des pistes conductrices, la rainure est de préférence réalisée au voisinage du bord externe des plages conductrices. Cette solution peut être avantageuse dans certaines conditions de réalisation de la rainure, en particulier lorsque celle-ci est réalisée par fraisage car elle permet alors un usinage en continu de l'ensemble de la rainure. In the second embodiment, the groove can also completely surround the integrated circuit. In this case, to avoid rupture of the conductive tracks, the groove is preferably made in the vicinity of the outer edge of the conductive pads. This solution can be advantageous under certain conditions of production of the groove, in particular when the latter is produced by milling because it then allows continuous machining of the whole of the groove.
Dans le cas du second mode de réalisation on peut également réaliser une cavité par fraisage et y fixer le circuit intégré par collage avant de déposer les pistes et les plages conductrices, et la résine de protection. In the case of the second embodiment, it is also possible to produce a cavity by milling and fix the integrated circuit there by gluing before depositing the tracks and the conductive pads, and the protective resin.
Claims (6)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9506840A FR2735256A1 (en) | 1995-06-09 | 1995-06-09 | INTEGRATED CIRCUIT CARD |
| BR9603593A BR9603593A (en) | 1995-06-09 | 1996-01-09 | Card with integrated circuit |
| PCT/FR1996/000033 WO1996042069A1 (en) | 1995-06-09 | 1996-01-09 | Integrated circuit card |
| AU44917/96A AU4491796A (en) | 1995-06-09 | 1996-01-09 | Integrated circuit card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9506840A FR2735256A1 (en) | 1995-06-09 | 1995-06-09 | INTEGRATED CIRCUIT CARD |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2735256A1 true FR2735256A1 (en) | 1996-12-13 |
Family
ID=9479800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9506840A Pending FR2735256A1 (en) | 1995-06-09 | 1995-06-09 | INTEGRATED CIRCUIT CARD |
Country Status (4)
| Country | Link |
|---|---|
| AU (1) | AU4491796A (en) |
| BR (1) | BR9603593A (en) |
| FR (1) | FR2735256A1 (en) |
| WO (1) | WO1996042069A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0939379A4 (en) * | 1997-07-18 | 2002-01-30 | Dainippon Printing Co Ltd | Ic module, ic card, sealing resin for ic module, and method for manufacturing ic module |
| US6548888B1 (en) | 1998-05-15 | 2003-04-15 | Gemplus | Integrated circuit card comprising an interface terminal strip and method for making same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0075351A1 (en) * | 1981-09-11 | 1983-03-30 | Rtc-Compelec | Method of making an identity card, and identity card produced, for example, by means of this method |
| DE3420051A1 (en) * | 1984-05-29 | 1985-12-05 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | DATA CARRIER WITH IC COMPONENT AND METHOD FOR PRODUCING SUCH A DATA CARRIER |
| EP0334733A1 (en) * | 1988-03-22 | 1989-09-27 | Schlumberger Industries | Manufacturing process of an electronic memory card and card obtained by such process |
| EP0370114A1 (en) * | 1988-04-20 | 1990-05-30 | Matsushita Electric Industrial Co., Ltd. | Ic card and production method thereof |
| DE9110057U1 (en) * | 1991-08-14 | 1992-02-20 | Orga Kartensysteme GmbH, 6072 Dreieich | Data carrier card with glued-in circuit carrier |
-
1995
- 1995-06-09 FR FR9506840A patent/FR2735256A1/en active Pending
-
1996
- 1996-01-09 AU AU44917/96A patent/AU4491796A/en not_active Abandoned
- 1996-01-09 BR BR9603593A patent/BR9603593A/en not_active Application Discontinuation
- 1996-01-09 WO PCT/FR1996/000033 patent/WO1996042069A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0075351A1 (en) * | 1981-09-11 | 1983-03-30 | Rtc-Compelec | Method of making an identity card, and identity card produced, for example, by means of this method |
| DE3420051A1 (en) * | 1984-05-29 | 1985-12-05 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | DATA CARRIER WITH IC COMPONENT AND METHOD FOR PRODUCING SUCH A DATA CARRIER |
| EP0334733A1 (en) * | 1988-03-22 | 1989-09-27 | Schlumberger Industries | Manufacturing process of an electronic memory card and card obtained by such process |
| EP0370114A1 (en) * | 1988-04-20 | 1990-05-30 | Matsushita Electric Industrial Co., Ltd. | Ic card and production method thereof |
| DE9110057U1 (en) * | 1991-08-14 | 1992-02-20 | Orga Kartensysteme GmbH, 6072 Dreieich | Data carrier card with glued-in circuit carrier |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0939379A4 (en) * | 1997-07-18 | 2002-01-30 | Dainippon Printing Co Ltd | Ic module, ic card, sealing resin for ic module, and method for manufacturing ic module |
| US6548888B1 (en) | 1998-05-15 | 2003-04-15 | Gemplus | Integrated circuit card comprising an interface terminal strip and method for making same |
| EP1076882B1 (en) * | 1998-05-15 | 2003-05-14 | Gemplus | Integrated circuit card comprising an interface terminal strip and method for making same |
Also Published As
| Publication number | Publication date |
|---|---|
| BR9603593A (en) | 1999-06-15 |
| WO1996042069A1 (en) | 1996-12-27 |
| AU4491796A (en) | 1997-01-09 |
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