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FR2715773B1 - Liquid cooling device for a power electronic component. - Google Patents

Liquid cooling device for a power electronic component.

Info

Publication number
FR2715773B1
FR2715773B1 FR9401247A FR9401247A FR2715773B1 FR 2715773 B1 FR2715773 B1 FR 2715773B1 FR 9401247 A FR9401247 A FR 9401247A FR 9401247 A FR9401247 A FR 9401247A FR 2715773 B1 FR2715773 B1 FR 2715773B1
Authority
FR
France
Prior art keywords
electronic component
cooling device
liquid cooling
power electronic
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9401247A
Other languages
French (fr)
Other versions
FR2715773A1 (en
Inventor
Patrick Rousset
Pierre Perichon
Bruno Beranger
Nadim Malek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Merlin Gerin SA
Renault SA
Original Assignee
Merlin Gerin SA
Renault SA
Regie Nationale des Usines Renault
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merlin Gerin SA, Renault SA, Regie Nationale des Usines Renault filed Critical Merlin Gerin SA
Priority to FR9401247A priority Critical patent/FR2715773B1/en
Publication of FR2715773A1 publication Critical patent/FR2715773A1/en
Application granted granted Critical
Publication of FR2715773B1 publication Critical patent/FR2715773B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR9401247A 1994-02-02 1994-02-02 Liquid cooling device for a power electronic component. Expired - Fee Related FR2715773B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9401247A FR2715773B1 (en) 1994-02-02 1994-02-02 Liquid cooling device for a power electronic component.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9401247A FR2715773B1 (en) 1994-02-02 1994-02-02 Liquid cooling device for a power electronic component.

Publications (2)

Publication Number Publication Date
FR2715773A1 FR2715773A1 (en) 1995-08-04
FR2715773B1 true FR2715773B1 (en) 1996-04-26

Family

ID=9459763

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9401247A Expired - Fee Related FR2715773B1 (en) 1994-02-02 1994-02-02 Liquid cooling device for a power electronic component.

Country Status (1)

Country Link
FR (1) FR2715773B1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5818692A (en) * 1997-05-30 1998-10-06 Motorola, Inc. Apparatus and method for cooling an electrical component
FR2775416B1 (en) * 1998-02-23 2000-06-23 Gec Alsthom Transport Sa COOLING ELEMENT FOR ELECTRONIC POWER DEVICE AND ELECTRONIC POWER DEVICE COMPRISING SUCH AN ELEMENT
JP3082738B2 (en) * 1998-03-13 2000-08-28 日本電気株式会社 High efficiency liquid cooling device
US6434003B1 (en) * 2001-04-24 2002-08-13 York International Corporation Liquid-cooled power semiconductor device heatsink
ITBO20010258A1 (en) * 2001-04-27 2002-10-27 Aavid Thermalloy S R L FLUID HEAT DISSIPATOR FOR ELECTRONIC COMPONENTS
JP2003051689A (en) * 2001-08-06 2003-02-21 Toshiba Corp Heating element cooling unit
DE50213919D1 (en) 2002-01-26 2009-11-26 Danfoss Silicon Power Gmbh cooler
SE522397C2 (en) 2002-11-05 2004-02-03 Volvo Lastvagnar Ab Cable duct for a vehicle and method for mounting a cabling on a vehicle
FR2847762B1 (en) * 2002-11-21 2006-07-21 Renault Sa ELEMENT OF ELECTRONIC POWER MODULE
FR2911247B1 (en) * 2007-01-08 2009-02-27 Sames Technologies Soc Par Act ELECTRONIC CARD AND COLD PLATE FOR THIS CARD.
US8495890B2 (en) 2007-01-22 2013-07-30 Johnson Controls Technology Company Cooling member
US8149579B2 (en) 2008-03-28 2012-04-03 Johnson Controls Technology Company Cooling member
US7764041B2 (en) 2007-01-22 2010-07-27 Johnson Controls Technology Company System and method to extend synchronous operation of an active converter in a variable speed drive
US7957166B2 (en) 2007-10-30 2011-06-07 Johnson Controls Technology Company Variable speed drive
DE102008059452A1 (en) * 2008-11-28 2010-06-02 Hüttinger Elektronik Gmbh + Co. Kg Electronic component i.e. power semiconductor component, cooling arrangement, has conductor plates arranged at mounting body, where to-be-cooled electronic components electrically contact contacting connector or component of plates
US9445526B2 (en) * 2014-12-22 2016-09-13 Toyota Motor Engineering & Manufacturing North America, Inc. Modular jet impingement assemblies with passive and active flow control for electronics cooling
EP3843512A1 (en) * 2019-12-23 2021-06-30 Aptiv Technologies Limited Cooling system for cooling an electronic component, method for assembling a cooling system, electronic control unit and vehicle

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US4967832A (en) * 1989-12-27 1990-11-06 Nrc Corporation Cooling method and apparatus for integrated circuit chips
US5070936A (en) * 1991-02-15 1991-12-10 United States Of America As Represented By The Secretary Of The Air Force High intensity heat exchanger system

Also Published As

Publication number Publication date
FR2715773A1 (en) 1995-08-04

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Legal Events

Date Code Title Description
TQ Partial transmission of property
ST Notification of lapse

Effective date: 20101029