FR2698876A1 - Adhesive product for joints in electrical and electronic circuits - contains particles of solid material, e.g. glass beads or metals - Google Patents
Adhesive product for joints in electrical and electronic circuits - contains particles of solid material, e.g. glass beads or metals Download PDFInfo
- Publication number
- FR2698876A1 FR2698876A1 FR9214772A FR9214772A FR2698876A1 FR 2698876 A1 FR2698876 A1 FR 2698876A1 FR 9214772 A FR9214772 A FR 9214772A FR 9214772 A FR9214772 A FR 9214772A FR 2698876 A1 FR2698876 A1 FR 2698876A1
- Authority
- FR
- France
- Prior art keywords
- particles
- joints
- glass beads
- electrical
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 title claims abstract description 20
- 239000000853 adhesive Substances 0.000 title claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 14
- 239000011324 bead Substances 0.000 title claims abstract description 5
- 239000011521 glass Substances 0.000 title claims abstract description 5
- 239000002184 metal Substances 0.000 title abstract description 4
- 229910052751 metal Inorganic materials 0.000 title abstract description 4
- 239000011343 solid material Substances 0.000 title abstract 2
- 150000002739 metals Chemical class 0.000 title 1
- 239000007787 solid Substances 0.000 claims abstract description 11
- 239000000126 substance Substances 0.000 claims description 7
- 239000013528 metallic particle Substances 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 13
- 239000003054 catalyst Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
"Produit de collage pour l'assemblage d'éléments"
L'invention est caractérisée en ce que ce produit de collage se compose d'une substance constituant un adhésif permanent mélangée à des particules solides."Bonding product for assembling elements"
The invention is characterized in that this bonding product consists of a substance constituting a permanent adhesive mixed with solid particles.
Suivant une autre caractéristique de l'invention, les particules solides sont des billes de verre. According to another characteristic of the invention, the solid particles are glass beads.
Suivant une autre caractéristique de l'invention, les particules solides sont des particules métalliques. According to another characteristic of the invention, the solid particles are metallic particles.
La présente invention a en conséquence pour but la réalisation d'un produit de collage qui ne perde pas ses propriétés de collage après qu'il ait été étalé sur un élément à assembler, l'assemblage par collage pouvant s'effectuer ultérieurement à une époque plus ou moins lointaine mais uniquement avec un élément également pourvu d'une couche de ce type de produit de collage. The present invention therefore aims to achieve a bonding product which does not lose its bonding properties after it has been spread on an element to be assembled, the assembly by bonding can be done later at a time more or less distant but only with an element also provided with a layer of this type of bonding product.
Ce produit de collage constitue donc un adhésif permanent qui n'est collant que vis-à-vis de lui-même ou d'un adhésif du même type. This bonding product therefore constitutes a permanent adhesive which is only sticky with respect to itself or of an adhesive of the same type.
Suivant l'invention, il est prévu de mettre en oeuvre une substance adhésive et, par exemple, à base de silicone, qui constitue un produit adhésif permanent et de mélanger cette substance visqueuse à des particules solides de dimensions suffisamment faibles et en quantités suffisamment importantes pour que le produit de collage obtenu, après avoir été étalé sur un élément, ne soit pas collant au toucher ou par contact avec un élément de nature quelconque, lui-même dépourvu de ce produit de collage. According to the invention, provision is made to use an adhesive substance, for example based on silicone, which constitutes a permanent adhesive product and to mix this viscous substance with solid particles of sufficiently small dimensions and in sufficiently large quantities. so that the bonding product obtained, after being spread on an element, is not sticky to the touch or by contact with an element of any kind, itself devoid of this bonding product.
Les particules de la charge pourront être de dimensions et de nature identiques ou non, les dimensions variant de 1 à 50 microns. The particles of the filler can be of identical dimensions and nature or not, the dimensions varying from 1 to 50 microns.
La quantité de particules mises en oeuvre variera de 30 à 70 % en volume par rapport au volume de la substance adhésive utilisée, la valeur exacte de ces proportions dépendant d'ailleurs plus de la forme des particules que de leurs dimensions. Cette quantité dépend bien entendu également de la viscosité de la substance adhésive mise en oeuvre et du fait qu'elle devra toujours être d'une consistance telle qu'elle puisse être étalée à la manière d'une peinture ou d'un produit semi-pâteux sur un support. The quantity of particles used will vary from 30 to 70% by volume relative to the volume of the adhesive substance used, the exact value of these proportions depending moreover more on the shape of the particles than on their dimensions. This quantity naturally also depends on the viscosity of the adhesive substance used and on the fact that it must always be of a consistency such that it can be spread in the manner of a paint or a semi-finished product. pasty on a support.
Bien entendu, différents produits dont les propriétés physiques et chimiques sont connues en elles-mêmes, pourront être ajoutés au produit de collage de base ci-dessus, afin d'aboutir à un effet ou à une action particulière. Ainsi par exemple, ce produit de collage pourra comporter un colorant, un solvant ou un catalyseur, ce dernier ayant pour but d'assurer la polymérisation de l'adhésif au bout d'un laps de temps plus ou moins long, après qu'il ait été étalé sur un support. Of course, different products, the physical and chemical properties of which are known in themselves, can be added to the basic bonding product above, in order to achieve a particular effect or action. Thus, for example, this bonding product may include a dye, a solvent or a catalyst, the latter having the aim of ensuring the polymerization of the adhesive after a more or less long period of time, after it has been spread on a support.
Les particules solides pourront, par exemple, être constituées par des billes de verre. The solid particles could, for example, consist of glass beads.
Elles pourront également être constituées par des particules métalliques ou métallisées, de façon à rendre conducteur ce produit de collage. They may also be formed by metallic or metallized particles, so as to make this bonding product conductive.
Ce produit peut alors être utilisé comme moyen de liaison électrique, de composants électriques ou électroniques avec un circuit quelconque ou encore pour réaliser la liaison électrique simple et rapide de parties métalliques et, notamment, des parties métalliques d'un ensemble de blindage électrique. This product can then be used as a means of electrical connection, of electrical or electronic components with any circuit, or even to make the simple and rapid electrical connection of metal parts and, in particular, metal parts of an electrical shielding assembly.
Les deux surfaces à assembler préalablement recouvertes aux endroits désirés de la substance adhésive définie ci-dessus seront, lors de l'assemblage, pressées l'une contre l'autre, étant entendu qu'une pression manuelle suffit pour obtenir cet assemblage. The two surfaces to be assembled previously covered at the desired locations with the adhesive substance defined above will, during assembly, be pressed against each other, it being understood that manual pressure is sufficient to obtain this assembly.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9214772A FR2698876B1 (en) | 1992-12-08 | 1992-12-08 | Bonding product for assembling elements. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9214772A FR2698876B1 (en) | 1992-12-08 | 1992-12-08 | Bonding product for assembling elements. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2698876A1 true FR2698876A1 (en) | 1994-06-10 |
| FR2698876B1 FR2698876B1 (en) | 1995-02-03 |
Family
ID=9436343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9214772A Expired - Fee Related FR2698876B1 (en) | 1992-12-08 | 1992-12-08 | Bonding product for assembling elements. |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2698876B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2457496A1 (en) * | 2010-11-25 | 2012-05-30 | Fujifilm Corporation | Illumination optical unit for endoscope, method of manufacturing the same, and adhesive for endoscope optical member |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3314838A (en) * | 1964-08-26 | 1967-04-18 | Minnesota Mining & Mfg | Pressure sensitive adhesives containing hollow spheroidal particles |
| JPS59227966A (en) * | 1983-06-08 | 1984-12-21 | Hitachi Chem Co Ltd | Production of electrically conductive pressure-sensitive adhesive |
| JPH01144478A (en) * | 1987-11-30 | 1989-06-06 | Matsushita Electric Ind Co Ltd | Electrically conductive adhesive |
-
1992
- 1992-12-08 FR FR9214772A patent/FR2698876B1/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3314838A (en) * | 1964-08-26 | 1967-04-18 | Minnesota Mining & Mfg | Pressure sensitive adhesives containing hollow spheroidal particles |
| JPS59227966A (en) * | 1983-06-08 | 1984-12-21 | Hitachi Chem Co Ltd | Production of electrically conductive pressure-sensitive adhesive |
| JPH01144478A (en) * | 1987-11-30 | 1989-06-06 | Matsushita Electric Ind Co Ltd | Electrically conductive adhesive |
Non-Patent Citations (4)
| Title |
|---|
| DATABASE WPI Week 7135, Derwent Publications Ltd., London, GB; AN 71-572518 & JP-B-46 030 953 (TOKYO SHIBAURA ELECTRIC C.) 1971 * |
| DATABASE WPI Week 8534, Derwent Publications Ltd., London, GB; AN 85-207847 * |
| DATABASE WPI Week 8928, Derwent Publications Ltd., London, GB; AN 89-204348 & JP-A-1 144 478 (MATSUSHITA ELEC IND K.K.) 6 Juin 1989 * |
| PATENT ABSTRACTS OF JAPAN vol. 9, no. 96 (C-278)(1819) 25 Avril 1985 & JP-A-59 227 966 ( HITACHI KASEI KOGYO K.K. ) 21 Décembre 1984 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2457496A1 (en) * | 2010-11-25 | 2012-05-30 | Fujifilm Corporation | Illumination optical unit for endoscope, method of manufacturing the same, and adhesive for endoscope optical member |
| CN102551641A (en) * | 2010-11-25 | 2012-07-11 | 富士胶片株式会社 | Illumination optical unit for endoscope, method of manufacturing the same, and adhesive for endoscope optical member |
| CN102551641B (en) * | 2010-11-25 | 2016-05-18 | 富士胶片株式会社 | Lighting optical system unit for endoscope and manufacture method thereof and endoscope optical component bonding agent |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2698876B1 (en) | 1995-02-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR910005533B1 (en) | Electrical interconnection means and connection method | |
| US3141238A (en) | Method of low temperature bonding for subsequent high temperature use | |
| TR24326A (en) | PROPERTIES TO REALIZE A DECORATION ON A POLITETROLUORETHYLED COATING | |
| KR950702463A (en) | Tin Bismuth Solder Paste, And Method Using Paste To Form Connection Having Improved High Temperature Properties | |
| FR2497054A1 (en) | SHIELDING MATERIAL AGAINST ELECTROMAGNETIC PARASITES | |
| KR970008513A (en) | Submount | |
| FR2475302A1 (en) | ELECTRIC INTERCONNECTION AND METHOD FOR PRODUCING THE SAME | |
| KR970023482A (en) | Rare Earth Bond Magnets and Compositions for Rare Earth Bond Magnets | |
| FR2533764A1 (en) | ||
| RU2207353C2 (en) | Conducting synthetic material and conducting shielding profile | |
| FR2698876A1 (en) | Adhesive product for joints in electrical and electronic circuits - contains particles of solid material, e.g. glass beads or metals | |
| FR2480488A1 (en) | Heat conducting and electrically insulating binder - comprising e.g. metal oxide particles in adhesive matrix e.g. silicone used for heat transfer | |
| CN1173244A (en) | Electrical connection method | |
| CA2283867A1 (en) | Method for producing a shielding case | |
| US4557857A (en) | High conducting polymer-metal alloy blends | |
| US3558800A (en) | Sealing pigtail connector construction | |
| US4093563A (en) | Resilient material which is electrically conductive under pressure | |
| US3385922A (en) | Electrical connector with hermetic sealing utilizing polymerization | |
| EP1256267B1 (en) | Method for producing an electromagnetic shield | |
| JPS57111366A (en) | Electrically conductive adhesive | |
| CN1310219A (en) | Electric conducting binder using for through-hole filling | |
| US4654475A (en) | Elastomeric electro-conductive devices | |
| EP2019579A1 (en) | High performance semiconductor module with connected substrate carrier and corresponding production method | |
| US862248A (en) | Metallic packing. | |
| DE3150337C1 (en) | Process for the manufacture of a substrate coated with a protective layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| CA | Change of address | ||
| CD | Change of name or company name | ||
| CJ | Change in legal form | ||
| ST | Notification of lapse |
Effective date: 20060831 |