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FR2657490A1 - Method for putting a substrate fitted with a printed circuit into a sealed encapsulation - Google Patents

Method for putting a substrate fitted with a printed circuit into a sealed encapsulation Download PDF

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Publication number
FR2657490A1
FR2657490A1 FR9000631A FR9000631A FR2657490A1 FR 2657490 A1 FR2657490 A1 FR 2657490A1 FR 9000631 A FR9000631 A FR 9000631A FR 9000631 A FR9000631 A FR 9000631A FR 2657490 A1 FR2657490 A1 FR 2657490A1
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France
Prior art keywords
substrate
housing
projections
parts
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR9000631A
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French (fr)
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FR2657490B1 (en
Inventor
Genillon Bernard
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Vape SA
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Vape SA
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Publication date
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Priority to FR9000631A priority Critical patent/FR2657490B1/en
Publication of FR2657490A1 publication Critical patent/FR2657490A1/en
Application granted granted Critical
Publication of FR2657490B1 publication Critical patent/FR2657490B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/066—Hermetically-sealed casings sealed by fusion of the joining parts without bringing material; sealed by brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/782—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined
    • B29C65/7823—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint
    • B29C65/7829—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint said distance pieces being integral with at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/006—Preventing damaging, e.g. of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/124—Tongue and groove joints
    • B29C66/1244—Tongue and groove joints characterised by the male part, i.e. the part comprising the tongue
    • B29C66/12449—Tongue and groove joints characterised by the male part, i.e. the part comprising the tongue being asymmetric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/124—Tongue and groove joints
    • B29C66/1246—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove
    • B29C66/12469—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove being asymmetric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/302—Particular design of joint configurations the area to be joined comprising melt initiators
    • B29C66/3022—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
    • B29C66/30223—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined said melt initiators being rib-like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/541—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms
    • B29C66/5414—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms said substantially flat extra element being rigid, e.g. a plate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

Method for putting a substrate (9) fitted with a printed circuit and with its components into a sealed encapsulation, the plastic encapsulation consisting of two parts (1, 2) welded together by ultrasound. One of the parts (1) of the encapsulation is equipped with means for support (5) and lateral retention (16) of the substrate (9). The other part (2) is equipped with projections (10) the distance d of which before welding is substantially equal to the weld height h1 and less than the height h2 measured between the level of the support means (5) of the substrate and the upper edge of the lateral retention (16), a lateral play e is moreover provided for between the substrate and the part of the encapsulation which supports it. During the ultrasound welding, the upper part (2) of the encapsulation descends and the application of ultrasounds is interrupted when the projections (10) come into contact with the substrate. At that point, the welding is carried out without the substrate having been subjected to vibrations.

Description

L'invention concerne un procédé de mise en boîtier scellé d'un substrat muni d'un circuit imprimé et de ses composants dans un boîtier en matière plastique constitué de deux parties réunies par leur pourtour et conformées de manière à maintenir en place ledit substrat.The invention relates to a method of sealing a substrate provided with a printed circuit and its components in a plastic housing consisting of two parts joined by their periphery and shaped so as to hold said substrate in place.

De plus en plus de petits appareils électroniques comprennent un circuit imprimé logé dans un boîtier. A titre d'exemple, on peut citer les calculatrices de poche et les télécommandes. Le substrat portant le circuit imprimé et ses composants est maintenu entre les deux parties du boîtier.More and more small electronic devices include a printed circuit housed in a housing. Examples include pocket calculators and remote controls. The substrate carrying the printed circuit and its components is held between the two parts of the housing.

Jusqu'ici, les deux parties du boîtier ont été fixées par clippage, par collage ou au moyen de vis, l'étanchéité pouvant être assurée au moyen d'un joint de colle. Il serait intéressant de souder les deux parties du boîtier par ultrasons, car un tel procédé est avantageux sur le plan économique et permet en outre d'obtenir une fermeture parfaitement étanche et inviolable du boîtier. Ce procédé n'a toutefois pas pu être utilisé jusqu'ici car il présentait l'inconvénient de soumettre le circuit imprimé, ses composants, notamment les circuits intégrés, et les liaisons de ces composants à des vibrations ultrasoniques capables de les détériorer et de provoquer des ruptures des soudures, des liaisons et des fils extrêmement fins qui sont utilisés pour les connexions. On a dès Lors été amenés à renoncer jusqu'ici au soudage par ultrasons, malgré ses avantages.So far, the two parts of the housing have been fixed by clipping, by gluing or by means of screws, the sealing being able to be ensured by means of an adhesive joint. It would be interesting to weld the two parts of the housing by ultrasound, because such a method is advantageous from an economic standpoint and also makes it possible to obtain a perfectly sealed and tamper-proof closure of the housing. However, this method has not been able to be used so far because it had the drawback of subjecting the printed circuit, its components, in particular the integrated circuits, and the connections of these components to ultrasonic vibrations capable of damaging them and causing ruptures in the solder joints, connections and extremely fine wires that are used for connections. We have therefore been led to give up hitherto ultrasonic welding, despite its advantages.

La présente invention a pour but de permettre l'application du soudage par ultrasons sans que le circuit imprimé et ses composants soient soumis à une vibration ultrasonique.The present invention aims to allow the application of ultrasonic welding without the printed circuit and its components being subjected to ultrasonic vibration.

Le procédé selon l'invention est caractérisé en ce qu'on confectionne deux parties de boîtier destinées à être soudées par ultrasons, soit une première partie de boîtier munie d'un rebord pour son soudage et de moyens de soutien et de retenue latérale dudit substrat et une seconde partie de boîtier munie d'un rebord de soudure définissant une hauteur de soudure et de saillies sur sa face intérieure destinées à maintenir en place ledit substrat, qu'on applique la seconde partie du boîtier sur la première partie, rebord contre rebord, de telle manière que la distance entre lesdites saillies et le substrat placé dans la première partie soit sensiblement égale à la hauteur de soudure et inférieure à la hauteur mesurée entre le niveau des moyens de soutien du substrat et le bord supérieur desdits moyens de retenue latérale du substrat et qu'un jeu latéral subsiste entre le substrat et les moyens de retenue latérale, et qu'on soumet le joint ainsi réalisé entre les deux parties du boîtier à des vibrations ultrasoniques jusqu'à ce que lesdites saillies viennent en contact avec le substrat, l'application des vibrations ultrasoniques étant interrompue aussitôt que le contact est réalisé.The method according to the invention is characterized in that two housing parts intended to be welded by ultrasound are made, that is to say a first housing part provided with a flange for its welding and with means for supporting and lateral retention of said substrate. and a second housing part provided with a weld rim defining a weld height and protrusions on its inner face intended to hold said substrate in place, that the second part of the housing is applied to the first part, rim against rim , so that the distance between said projections and the substrate placed in the first part is substantially equal to the weld height and less than the height measured between the level of the support means of the substrate and the upper edge of said lateral retaining means of the substrate and that a lateral clearance remains between the substrate and the lateral retaining means, and that the joint thus produced is subjected to re the two parts of the housing to ultrasonic vibrations until said projections come into contact with the substrate, the application of ultrasonic vibrations being interrupted as soon as contact is made.

Sous l'effet des vibrations ultrasoniques, le joint de soudure ou directeur d'énergie s'écrase sous la pression exercée sur le boîtier en permettant aux deux parties du boîtier de se rapprocher L'une de L'autre jusqu'à ce que les saillies viennent en contact avec le substrat. Durant tout le temps pendant lequel des vibrations ultrasoniques sont appliquées au joint des deux parties du boîtier, le substrat n'est pas pincé, ni maintenu rigidement latéralement et il n'est par conséquent pas entraîné en vibrations à la fréquence ultrasonique. Lorsque les saillies atteignent le substrat, c'est-à-dire ont parcouru une distance égale à la hauteur de soudage, l'application de vibrations ultrasoniques est immédiatement interrompue. Le substrat est alors maintenu entre Les deux parties du boîtier, parfaitement soudées entres elles.Under the effect of ultrasonic vibrations, the solder joint or energy director is crushed under the pressure exerted on the housing, allowing the two parts of the housing to move towards each other until the protrusions come into contact with the substrate. During all the time during which ultrasonic vibrations are applied to the joint of the two parts of the housing, the substrate is not pinched or rigidly held laterally and it is therefore not driven into vibrations at the ultrasonic frequency. When the projections reach the substrate, that is to say have traveled a distance equal to the welding height, the application of ultrasonic vibrations is immediately interrupted. The substrate is then held between the two parts of the housing, perfectly welded together.

IL est possible de supprimer toutes vibrations du substrat en posant celui-ci sur un matelas amortisseur dans L'une des parties du boîtier, de manière à éviter tout contact du substrat avec le boîtier pendant la phase de soudage par ultrasons.It is possible to suppress all vibrations of the substrate by placing it on a damping mat in one of the parts of the housing, so as to avoid any contact of the substrate with the housing during the ultrasonic welding phase.

L'invention est bien entendu applicable à un boîtier contenant plusieurs circuits imprimés empilés.The invention is of course applicable to a box containing several stacked printed circuits.

Un exemple de mise en oeuvre du procédé sera maintenant décrit en relation avec le dessin annexé dans lequel : la figure 1 est une vue en coupe d'un boîtier avant soudure aux ultrasons ; la figure 2 représente un détail de la figure 1 ; et la figure 3 représente le même boîtier après soudure aux ultrasons.An example of implementation of the method will now be described in relation to the appended drawing in which: FIG. 1 is a sectional view of a housing before ultrasonic welding; Figure 2 shows a detail of Figure 1; and Figure 3 shows the same housing after ultrasonic welding.

La figure 1 représente un boîtier en matière plastique, de préférence thermoplastique, constitué de deux parties 1 et 2 en forme de cuvette de faible profondeur présentant respectivement un rebord 3 et 4. Le fond de
La partie 1 présente des saillies telles que 5, 6, 7 et 8 destinées à supporter un substrat 9 portant un circuit imprimé sur lequel sont montés des composants non représentés. La face interne de la partie 2 du boîtier est également munie de saillies telles que les saillies 10, 11, 12 et 13, toutes de même hauteur.Le rebord 4 de la partie 2 du boîtier est conformé de manière à permettre son soudage par ultrasons et présente une hauteur de soudage hi. La tranche du rebord 3 de la partie 1 du boîtier présente une gorge 14 destinée à recevoir la partie amincie 41 du rebord 4 de la partie 2 du boîtier, constituant le directeur d'énergie pour le soudage aux ultrasons.Figure 1 shows a plastic housing, preferably thermoplastic, consisting of two parts 1 and 2 in the shape of a shallow bowl having respectively a rim 3 and 4. The bottom of
Part 1 has projections such as 5, 6, 7 and 8 intended to support a substrate 9 carrying a printed circuit on which are mounted components not shown. The internal face of part 2 of the housing is also provided with projections such as projections 10, 11, 12 and 13, all of the same height. The rim 4 of part 2 of the housing is shaped so as to allow it to be ultrasonically welded. and has a welding height hi. The edge of the rim 3 of the part 1 of the housing has a groove 14 intended to receive the thinned part 41 of the rim 4 of the part 2 of the housing, constituting the energy director for ultrasonic welding.

Le substrat 9 est placé dans la partie 1 du boîtier sur les saillies 5 à 8, avec un jeu latéral e, de façon qu'il soit centré fonctionnellement dans la partie 1 sans être maintenu rigidement.The substrate 9 is placed in the part 1 of the housing on the projections 5 to 8, with a lateral clearance e, so that it is functionally centered in the part 1 without being rigidly held.

On place ensuite la partie 2 du boîtier sur la partie 1, en appui sur le directeur d'énergie du joint de soudure 41. Dans cette position, la distance d entre les saillies 10 à 13 et le substrat 9 est sensiblement égale à la hauteur de soudage hl. D'autre part, la hauteur h2 entre le niveau des saillies de soutien 5 à 8 et le bord supérieur des moyens de retenue latérale 16 est supérieure à la distance d, de telle sorte que le substrat 9 ne peut pas s'échapper de son logement et venir s'appuyer sur le bord supérieur des moyens de retenue latérale. La hauteur h2 est donc également toujours supérieure à la hauteur de soudure hl qui est également la cote d'écrasement du directeur d'énergie ou joint de soudure 41.Part 2 of the housing is then placed on part 1, bearing on the energy director of the solder joint 41. In this position, the distance d between the projections 10 to 13 and the substrate 9 is substantially equal to the height hl welding. On the other hand, the height h2 between the level of the support projections 5 to 8 and the upper edge of the lateral retaining means 16 is greater than the distance d, so that the substrate 9 cannot escape from its housing and come to rest on the upper edge of the lateral retaining means. The height h2 is therefore also always greater than the welding height hl which is also the crushing dimension of the energy director or weld joint 41.

Au moyen d'une sonotrode 15, montée sur la machine à souder aux ultrasons, de forme et de dimensions adaptées à celles du boîtier, on applique ensuite une vibration ultrasonique au joint des deux parties du boîtier, en exerçant une Légère pression. La partie 2 du boîtier descend progressivement et lorsque la cote d'écrasement du directeur d'énergie atteint 0, c'est-àdire que la partie 2 du boîtier est descendue d'une hauteur hl, la soudure des deux parties du boîtier est parfaitement réalisée et l'application d'ultrasons peut cesser. Le substrat 9 est finalement parfaitement maintenu dans le boîtier, sans qu'il ait été entraîné en vibrations.Il convient en effet de considérer que seule la partie 2 est pratiquement entraînée en vibrations ultrasonique, le ramollissement quasi immédiat du directeur d'énergie 41 empêchant une transmission des vibrations ultrasoniques de la partie 2 du boîtier à la partie 1.By means of a sonotrode 15, mounted on the ultrasonic welding machine, of shape and dimensions adapted to those of the housing, an ultrasonic vibration is then applied to the joint of the two parts of the housing, exerting a slight pressure. Part 2 of the housing descends gradually and when the crushing dimension of the energy director reaches 0, that is to say that part 2 of the housing is lowered by a height hl, the welding of the two parts of the housing is perfectly performed and the ultrasound application may stop. The substrate 9 is finally perfectly maintained in the housing, without it having been driven in vibrations. It should indeed be considered that only the part 2 is practically driven in ultrasonic vibrations, the almost immediate softening of the energy director 41 preventing transmission of ultrasonic vibrations from part 2 of the housing to part 1.

Il serait possible d'éviter toutes vibrations du substrat 9 en interposant entre celui-ci et le fond de la partie 1 du boîtier un matelas amortisseur. Ce matelas pourrait être entre les saillies 5 à 8 ou à la place de ces saillies. Dans le cas où le matelas est disposé entre les saillies il est finalement comprimé et le substrat est finalement pincé entre les saillies des deux parties du boîtier. Le directeur d'énergie ou joint de soudure 41 et la gorge 14, c'est-à-dire l'ensemble des formes permettant de réaliser une soudure aux ultrasons, pourraient être de conceptions différentes.It would be possible to avoid any vibration of the substrate 9 by interposing between it and the bottom of the part 1 of the housing a damping mattress. This mattress could be between projections 5 to 8 or in place of these projections. In the case where the mattress is disposed between the projections it is finally compressed and the substrate is finally pinched between the projections of the two parts of the housing. The energy director or weld joint 41 and the groove 14, that is to say all of the shapes making it possible to carry out an ultrasonic weld, could be of different designs.

Les relations entre hl, h2 et d étant respectées, la hauteur des saillies 10 à 12 pourrait bien entendu être supérieure à la hauteur du rebord 4. Les moyens de retenue latérale du substrat 9 pourraient être constitués directement par le rebord 3. Le substrat 9 pourrait reposer directement sur le fond de la partie 1 du boîtier.  The relationships between hl, h2 and d being respected, the height of the projections 10 to 12 could of course be greater than the height of the rim 4. The lateral retaining means of the substrate 9 could be formed directly by the rim 3. The substrate 9 could rest directly on the bottom of part 1 of the housing.

Claims (3)

REVENDICATIONS 1. Procédé de mise en boîtier scellé d'un substrat (9) muni d'un circuit imprimé et de ses composants dans un boîtier en matière plastique constitué de deux parties CI, 2) réunies par Leur pourtour et conformées de manière à maintenir en place ledit substrat, caractérisé en ce qu'on confectionne deux parties de boîtier (1, 2) destinées à être soudées par ultrasons, soit une première partie (1) munie d'un rebord (3) pour son soudage et de moyens de soutien (5 à 8) et de retenue latérale (16) dudit substrat et une seconde partie (2) munie d'une rebord de soudure (4) définissant une hauteur de soudure (hl) et de saillies (10 à 13) sur sa face interne destinée à maintenir en place ledit substrat, qu'on applique la seconde partie (2) sur la première partie (1), rebord contre rebord, de telle manière que la distance (d) entre lesdites saillies et le substrat placé dans la première partie du boîtier soit sensiblement égale à la hauteur de soudure (hl) et inférieure à la hauteur (h2) mesurée entre le niveau desdits moyens de soutien du substrat et le bord supérieur desdits moyens de retenue latérale du substrat et qu'un jeu latéral (e) subsiste entre le substrat et le moyen de retenue latérale, et qu'on soumet le joint ainsi réalisé entre les deux parties du boîtier à des vibrations ultrasoniques jusqu a ce que lesdites saillies (10 à 13) viennent en contact avec le substrat (9), l'application des vibrations ultrasoniques étant interrompue aussitôt que le contact est réalisé.1. Method for placing in a sealed box a substrate (9) provided with a printed circuit and its components in a plastic box made up of two parts CI, 2) joined by their periphery and shaped so as to maintain in places said substrate, characterized in that two housing parts (1, 2) are designed to be welded by ultrasound, that is to say a first part (1) provided with a flange (3) for its welding and support means (5 to 8) and lateral retention (16) of said substrate and a second part (2) provided with a weld rim (4) defining a weld height (hl) and projections (10 to 13) on its face internal intended to hold in place said substrate, that the second part (2) is applied to the first part (1), edge against edge, so that the distance (d) between said projections and the substrate placed in the first part of the housing is substantially equal to the welding height (hl) and less lower than the height (h2) measured between the level of said substrate support means and the upper edge of said lateral substrate retaining means and that a lateral clearance (e) remains between the substrate and the lateral retaining means, and that 'The joint thus produced between the two parts of the housing is subjected to ultrasonic vibrations until said projections (10 to 13) come into contact with the substrate (9), the application of ultrasonic vibrations being interrupted as soon as contact is realised. 2. Boîtier pour la mise en oeuvre du procédé selon la revendication 1, caractérisé en ce que lesdits moyens de soutien du substrat sont constitués par des saillies ou nervures (5 à 8). 2. Housing for implementing the method according to claim 1, characterized in that said substrate support means are constituted by projections or ribs (5 to 8). 3. Boîtier pour la mise en oeuvre du procédé selon la revendication 1, caractérisé par le fait que lesdits moyens de soutien du substrat sont constitués par un matelas amortisseur. 3. Housing for the implementation of the method according to claim 1, characterized in that said support means of the substrate consist of a damping mat.
FR9000631A 1990-01-19 1990-01-19 PROCESS FOR SEALED PACKAGING OF A SUBSTRATE PROVIDED WITH A PRINTED CIRCUIT. Expired - Fee Related FR2657490B1 (en)

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Cited By (11)

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WO2006120107A3 (en) * 2005-05-13 2007-03-22 Bosch Gmbh Robert Fixing device
FR2897750A1 (en) * 2006-02-21 2007-08-24 Valeo Sys Controle Moteur Sas Logic controller, e.g. board, case assembly for motor vehicle, involves placing shell, cover and plate according to assembling position, and welding portions with respect to plate by fusion of thermoweldable plastic material layers
EP1898684A1 (en) * 2006-09-06 2008-03-12 Delphi Technologies, Inc. Sealed electronic component
EP1753280A3 (en) * 2005-07-18 2009-06-17 Helmut Prager Printed circuit board/sheathing bond structure
WO2011035771A1 (en) * 2009-09-26 2011-03-31 Continental Automotive Gmbh Method for welding a plastic housing
WO2011035770A1 (en) * 2009-09-26 2011-03-31 Continental Automotive Gmbh Method for welding a plastic housing
US20130189024A1 (en) * 2012-01-25 2013-07-25 Omron Corporation Connection structure of housing of electronic apparatus and connection method of forming housing
US8549913B2 (en) 2010-02-02 2013-10-08 Zf Friedrichshafen Ag Method for fixing a component in a casing and assembly hereof
EP2731202B1 (en) * 2012-11-13 2019-09-18 Gjm, S.A. Method for manufacturing a tight connector and sealed connector obtained
CN110274372A (en) * 2019-05-10 2019-09-24 珠海格力电器股份有限公司 Assembly component, water tank, air conditioner and water leakage prevention sealing method
DE10256254B4 (en) * 2002-12-03 2021-07-01 Robert Bosch Gmbh Method of welding

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DE8814890U1 (en) * 1988-11-30 1989-02-09 Rolec-Gehäusesysteme Rose + Rose GmbH & Co. KG, 3260 Rinteln Waterproof housing, especially for the encapsulation of electrical and electronic components

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DE3712275A1 (en) * 1987-04-10 1988-10-27 Alois Ferch Plastic hollow article parts joinable by ultrasonic welding to form a hollow article
DE8814890U1 (en) * 1988-11-30 1989-02-09 Rolec-Gehäusesysteme Rose + Rose GmbH & Co. KG, 3260 Rinteln Waterproof housing, especially for the encapsulation of electrical and electronic components

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10256254B4 (en) * 2002-12-03 2021-07-01 Robert Bosch Gmbh Method of welding
WO2006120107A3 (en) * 2005-05-13 2007-03-22 Bosch Gmbh Robert Fixing device
EP1753280A3 (en) * 2005-07-18 2009-06-17 Helmut Prager Printed circuit board/sheathing bond structure
FR2897750A1 (en) * 2006-02-21 2007-08-24 Valeo Sys Controle Moteur Sas Logic controller, e.g. board, case assembly for motor vehicle, involves placing shell, cover and plate according to assembling position, and welding portions with respect to plate by fusion of thermoweldable plastic material layers
WO2007096515A1 (en) * 2006-02-21 2007-08-30 Valeo Systemes De Controle Moteur Method for assembling a package comprising metallic parts and resulting package
EP1898684A1 (en) * 2006-09-06 2008-03-12 Delphi Technologies, Inc. Sealed electronic component
WO2011035770A1 (en) * 2009-09-26 2011-03-31 Continental Automotive Gmbh Method for welding a plastic housing
US9030835B2 (en) 2009-09-26 2015-05-12 Continental Automotive Gmbh Method for welding a plastic housing
WO2011035771A1 (en) * 2009-09-26 2011-03-31 Continental Automotive Gmbh Method for welding a plastic housing
US8549913B2 (en) 2010-02-02 2013-10-08 Zf Friedrichshafen Ag Method for fixing a component in a casing and assembly hereof
US9073149B2 (en) 2010-02-02 2015-07-07 Zf Friedrichshafen Ag Method for fixing a component in a casing and assembly hereof
US20130189024A1 (en) * 2012-01-25 2013-07-25 Omron Corporation Connection structure of housing of electronic apparatus and connection method of forming housing
EP2731202B1 (en) * 2012-11-13 2019-09-18 Gjm, S.A. Method for manufacturing a tight connector and sealed connector obtained
CN110274372A (en) * 2019-05-10 2019-09-24 珠海格力电器股份有限公司 Assembly component, water tank, air conditioner and water leakage prevention sealing method

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