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FR2613536B1 - Substrat pour circuit conducteur multicouche - Google Patents

Substrat pour circuit conducteur multicouche

Info

Publication number
FR2613536B1
FR2613536B1 FR888804433A FR8804433A FR2613536B1 FR 2613536 B1 FR2613536 B1 FR 2613536B1 FR 888804433 A FR888804433 A FR 888804433A FR 8804433 A FR8804433 A FR 8804433A FR 2613536 B1 FR2613536 B1 FR 2613536B1
Authority
FR
France
Prior art keywords
substrate
conductive circuit
layer conductive
layer
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR888804433A
Other languages
English (en)
Other versions
FR2613536A1 (fr
Inventor
Akihiro Dohya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of FR2613536A1 publication Critical patent/FR2613536A1/fr
Application granted granted Critical
Publication of FR2613536B1 publication Critical patent/FR2613536B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR888804433A 1987-04-06 1988-04-05 Substrat pour circuit conducteur multicouche Expired - Lifetime FR2613536B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62082845A JPS63249394A (ja) 1987-04-06 1987-04-06 多層回路基板

Publications (2)

Publication Number Publication Date
FR2613536A1 FR2613536A1 (fr) 1988-10-07
FR2613536B1 true FR2613536B1 (fr) 1992-09-11

Family

ID=13785722

Family Applications (1)

Application Number Title Priority Date Filing Date
FR888804433A Expired - Lifetime FR2613536B1 (fr) 1987-04-06 1988-04-05 Substrat pour circuit conducteur multicouche

Country Status (3)

Country Link
US (1) US5012047A (fr)
JP (1) JPS63249394A (fr)
FR (1) FR2613536B1 (fr)

Families Citing this family (35)

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Publication number Priority date Publication date Assignee Title
US5134247A (en) * 1989-02-21 1992-07-28 Cray Research Inc. Reduced capacitance chip carrier
US5369059A (en) * 1989-12-08 1994-11-29 Cray Research, Inc. Method for constructing a reduced capacitance chip carrier
WO1991009423A1 (fr) * 1989-12-08 1991-06-27 Cray Research, Inc. Boitier a puces ameliore a capacitance reduite
US5191174A (en) * 1990-08-01 1993-03-02 International Business Machines Corporation High density circuit board and method of making same
DE4100238A1 (de) * 1991-01-07 1992-07-09 Philips Patentverwaltung Viellagenplatine, insbesondere fuer hochfrequenz
FR2674078B1 (fr) * 1991-03-12 1994-10-07 Thomson Trt Defense Emetteur-recepteur hyperfrequence utilisant la technique des circuits imprimes multicouches.
JPH0653652A (ja) * 1991-03-14 1994-02-25 Nec Corp 多層セラミック配線基板とその製造方法
EP0550910A1 (fr) * 1991-12-31 1993-07-14 Texas Instruments Incorporated Technique d'interconnection multi-niveaux à basse valeur RC pour circuits intégrés à haute performance
JP2898814B2 (ja) * 1992-02-25 1999-06-02 株式会社日立製作所 印刷インダクタ付き多層配線板
US5259110A (en) * 1992-04-03 1993-11-09 International Business Machines Corporation Method for forming a multilayer microelectronic wiring module
JPH0770837B2 (ja) * 1992-05-20 1995-07-31 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層配線を有する電子パッケージ基板及び方法
US5360948A (en) * 1992-08-14 1994-11-01 Ncr Corporation Via programming for multichip modules
JP3338527B2 (ja) * 1992-10-07 2002-10-28 富士通株式会社 高密度積層形のコネクタ、及び、コネクタの設計方法
JP2513443B2 (ja) * 1993-06-11 1996-07-03 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層回路基板組立体
US6939173B1 (en) 1995-06-12 2005-09-06 Fci Americas Technology, Inc. Low cross talk and impedance controlled electrical connector with solder masses
US5817973A (en) 1995-06-12 1998-10-06 Berg Technology, Inc. Low cross talk and impedance controlled electrical cable assembly
DE69636779T2 (de) * 1995-06-12 2007-10-18 Fci Elektrischer verbinder mit niedrigem übersprechen und gesteuertem impedanzverhalten
TW267265B (en) * 1995-06-12 1996-01-01 Connector Systems Tech Nv Low cross talk and impedance controlled electrical connector
JPH09214076A (ja) * 1996-02-05 1997-08-15 Fujitsu Ltd プリント配線基板
US5929375A (en) * 1996-05-10 1999-07-27 Ford Motor Company EMI protection and CTE control of three-dimensional circuitized substrates
US5644276A (en) * 1996-05-29 1997-07-01 The United States Of America As Represented By The Secretary Of The Army Multi-layer controllable impedance transition device for microwaves/millimeter waves
US5774340A (en) * 1996-08-28 1998-06-30 International Business Machines Corporation Planar redistribution structure and printed wiring device
US6730541B2 (en) * 1997-11-20 2004-05-04 Texas Instruments Incorporated Wafer-scale assembly of chip-size packages
TW415722U (en) * 1998-04-02 2000-12-11 Hon Hai Prec Ind Co Ltd Flexible printed cable with ground plane and required impedance
US6084779A (en) * 1998-10-02 2000-07-04 Sigrity, Inc. Ground and power patches on printed circuit board signal planes in the areas of integrated circuit chips
US6239485B1 (en) 1998-11-13 2001-05-29 Fujitsu Limited Reduced cross-talk noise high density signal interposer with power and ground wrap
US6081026A (en) * 1998-11-13 2000-06-27 Fujitsu Limited High density signal interposer with power and ground wrap
TW434821B (en) * 2000-02-03 2001-05-16 United Microelectronics Corp Allocation structure of via plug to connect different metal layers
US6477057B1 (en) * 2000-08-17 2002-11-05 International Business Machines Corporation High frequency de-coupling via short circuits
US6750403B2 (en) * 2002-04-18 2004-06-15 Hewlett-Packard Development Company, L.P. Reconfigurable multilayer printed circuit board
US6876163B2 (en) * 2002-10-03 2005-04-05 Visteon Global Technologies, Inc. DC motor having a braking circuit
US7015869B2 (en) * 2002-11-18 2006-03-21 Visteon Global Technologies, Inc. High frequency antenna disposed on the surface of a three dimensional substrate
JP4844080B2 (ja) * 2005-10-18 2011-12-21 日本電気株式会社 印刷配線板及びその電源雑音抑制方法
US8927879B2 (en) 2010-11-22 2015-01-06 International Business Machines Corporation Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
WO2017117153A1 (fr) * 2015-12-27 2017-07-06 Massachusetts Institute Of Technology Conception et fabrication de structures de kirigami en trois dimensions à propriétés ajustables

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2721312A (en) * 1951-06-30 1955-10-18 Itt Microwave cable
US2919441A (en) * 1955-04-15 1959-12-29 Chu Lan Jen Radio-frequency-energy transmission line and antenna
US2952579A (en) * 1955-07-14 1960-09-13 Martin Co Honeycomb sandwich panel structure and method of making same
FR1578326A (fr) * 1967-08-02 1969-08-14
US3581243A (en) * 1969-03-21 1971-05-25 Andrew Alford Directional coupler wherein dielectric media surrounding main line is different from dielectric media surrounding coupled line
US3575674A (en) * 1969-05-09 1971-04-20 Microwave Ass Microstrip iris directional coupler
GB1324023A (en) * 1970-10-01 1973-07-18 Int Computers Ltd Circuit interconnecting cables and methods of making such cables
US3777221A (en) * 1972-12-18 1973-12-04 Ibm Multi-layer circuit package
US3834960A (en) * 1973-08-31 1974-09-10 Us Navy Method of making fusible and electrical conductive coating
US4234367A (en) * 1979-03-23 1980-11-18 International Business Machines Corporation Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4322778A (en) * 1980-01-25 1982-03-30 International Business Machines Corp. High performance semiconductor package assembly
JPS60214941A (ja) * 1984-04-10 1985-10-28 株式会社　潤工社 プリント基板
JPS60168214U (ja) * 1984-04-18 1985-11-08 株式会社　潤工社 伝送線路
JPS6156493A (ja) * 1984-08-28 1986-03-22 日本電気株式会社 多層回路基板の電源配線構造
GB2177851A (en) * 1985-06-05 1987-01-28 Spence Bate Laminated low power circuitry components
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
US4766671A (en) * 1985-10-29 1988-08-30 Nec Corporation Method of manufacturing ceramic electronic device
JPS62188399A (ja) * 1986-02-14 1987-08-17 日本電気株式会社 セラミツク配線基板
US4721831A (en) * 1987-01-28 1988-01-26 Unisys Corporation Module for packaging and electrically interconnecting integrated circuit chips on a porous substrate, and method of fabricating same

Also Published As

Publication number Publication date
FR2613536A1 (fr) 1988-10-07
US5012047A (en) 1991-04-30
JPS63249394A (ja) 1988-10-17

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