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FR2565408B1 - DEVICE COMPRISING A PELLET OF AN INTEGRATED CIRCUIT WITH A INSULATED SLAB ON THE HOUSING - Google Patents

DEVICE COMPRISING A PELLET OF AN INTEGRATED CIRCUIT WITH A INSULATED SLAB ON THE HOUSING

Info

Publication number
FR2565408B1
FR2565408B1 FR8408492A FR8408492A FR2565408B1 FR 2565408 B1 FR2565408 B1 FR 2565408B1 FR 8408492 A FR8408492 A FR 8408492A FR 8408492 A FR8408492 A FR 8408492A FR 2565408 B1 FR2565408 B1 FR 2565408B1
Authority
FR
France
Prior art keywords
pellet
housing
integrated circuit
insulated slab
slab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8408492A
Other languages
French (fr)
Other versions
FR2565408A1 (en
Inventor
Alain Astier
Pierre Esteve
Daniel Woehrn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8408492A priority Critical patent/FR2565408B1/en
Publication of FR2565408A1 publication Critical patent/FR2565408A1/en
Application granted granted Critical
Publication of FR2565408B1 publication Critical patent/FR2565408B1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR8408492A 1984-05-30 1984-05-30 DEVICE COMPRISING A PELLET OF AN INTEGRATED CIRCUIT WITH A INSULATED SLAB ON THE HOUSING Expired FR2565408B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8408492A FR2565408B1 (en) 1984-05-30 1984-05-30 DEVICE COMPRISING A PELLET OF AN INTEGRATED CIRCUIT WITH A INSULATED SLAB ON THE HOUSING

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8408492A FR2565408B1 (en) 1984-05-30 1984-05-30 DEVICE COMPRISING A PELLET OF AN INTEGRATED CIRCUIT WITH A INSULATED SLAB ON THE HOUSING

Publications (2)

Publication Number Publication Date
FR2565408A1 FR2565408A1 (en) 1985-12-06
FR2565408B1 true FR2565408B1 (en) 1987-04-10

Family

ID=9304544

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8408492A Expired FR2565408B1 (en) 1984-05-30 1984-05-30 DEVICE COMPRISING A PELLET OF AN INTEGRATED CIRCUIT WITH A INSULATED SLAB ON THE HOUSING

Country Status (1)

Country Link
FR (1) FR2565408B1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2626408B1 (en) * 1988-01-22 1990-05-11 Thomson Csf LOW-SIZE IMAGE SENSOR
JPH03291947A (en) * 1990-04-09 1991-12-24 Mitsubishi Electric Corp Hybrid device
FR2667982B1 (en) * 1990-10-15 1997-07-25 Sgs Thomson Microelectronics INTEGRATED WINDOW CIRCUIT MOLD HOUSING AND MOLDING METHOD.

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5171792A (en) * 1974-12-19 1976-06-21 Minolta Camera Kk
US4005457A (en) * 1975-07-10 1977-01-25 Semimetals, Inc. Semiconductor assembly, method of manufacturing same, and bonding agent therefor
US4262161A (en) * 1980-01-16 1981-04-14 Shell Oil Company Covered solar cell assembly
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
DE3123198C2 (en) * 1980-12-08 1993-10-07 Gao Ges Automation Org Carrier elements for an IC chip
FR2501414A1 (en) * 1981-03-06 1982-09-10 Thomson Csf MICROBOITIER FOR ENCAPSULATION OF SEMICONDUCTOR PELLETS, TESTABLE AFTER WELDING ON A SUBSTRATE

Also Published As

Publication number Publication date
FR2565408A1 (en) 1985-12-06

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Legal Events

Date Code Title Description
ST Notification of lapse