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FR2515917B3 - Liaison electrique de circuits imprimes et son procede d'etablissement - Google Patents

Liaison electrique de circuits imprimes et son procede d'etablissement

Info

Publication number
FR2515917B3
FR2515917B3 FR8120326A FR8120326A FR2515917B3 FR 2515917 B3 FR2515917 B3 FR 2515917B3 FR 8120326 A FR8120326 A FR 8120326A FR 8120326 A FR8120326 A FR 8120326A FR 2515917 B3 FR2515917 B3 FR 2515917B3
Authority
FR
France
Prior art keywords
establishment
electrical connection
printed circuits
printed
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8120326A
Other languages
English (en)
Other versions
FR2515917A3 (fr
Inventor
Jean-Claude Dureau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard France SAS
Original Assignee
Hewlett Packard France SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard France SAS filed Critical Hewlett Packard France SAS
Priority to FR8120326A priority Critical patent/FR2515917B3/fr
Publication of FR2515917A3 publication Critical patent/FR2515917A3/fr
Application granted granted Critical
Publication of FR2515917B3 publication Critical patent/FR2515917B3/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
FR8120326A 1981-10-29 1981-10-29 Liaison electrique de circuits imprimes et son procede d'etablissement Expired FR2515917B3 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8120326A FR2515917B3 (fr) 1981-10-29 1981-10-29 Liaison electrique de circuits imprimes et son procede d'etablissement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8120326A FR2515917B3 (fr) 1981-10-29 1981-10-29 Liaison electrique de circuits imprimes et son procede d'etablissement

Publications (2)

Publication Number Publication Date
FR2515917A3 FR2515917A3 (fr) 1983-05-06
FR2515917B3 true FR2515917B3 (fr) 1986-05-23

Family

ID=9263530

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8120326A Expired FR2515917B3 (fr) 1981-10-29 1981-10-29 Liaison electrique de circuits imprimes et son procede d'etablissement

Country Status (1)

Country Link
FR (1) FR2515917B3 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052084A (ja) * 1983-08-31 1985-03-23 株式会社東芝 印刷配線基板
US4583800A (en) * 1984-08-20 1986-04-22 Advanced Circuit Technology, Inc. Self-aligning electrical connection assembly
US4589584A (en) * 1985-01-31 1986-05-20 International Business Machines Corporation Electrical connection for polymeric conductive material
US5418691A (en) * 1990-02-07 1995-05-23 Canon Kabushiki Kaisha Two printed circuit boards superiposed on one another both having position registry marks
US5194010A (en) * 1992-01-22 1993-03-16 Molex Incorporated Surface mount electrical connector assembly
JPH09331126A (ja) * 1996-06-07 1997-12-22 Asahi Optical Co Ltd 可撓性回路基板
DE69919822T2 (de) * 1998-12-10 2005-09-15 Ultex Corp. Ultraschallschwingungsschweissverfahren
US6867132B2 (en) 2002-09-17 2005-03-15 Hewlett-Packard Development Company, L.P. Large line conductive pads for interconnection of stackable circuitry
DE102004012098B3 (de) * 2004-03-08 2005-08-18 Volkswagen Bordnetze Gmbh Verfahren und Schaltungsanordnung zur Qualitätskontrolle beim Ultraschallschweißen von kunststoffisolierten, metallischen Folienleitern
WO2007135604A2 (fr) * 2006-05-22 2007-11-29 Philips Intellectual Property & Standards Gmbh Structure d'interconnexion et procÉdÉ d'interconnexion d'un cÂble transportant un courant d'intensitÉ ÉlevÉe avec un mince FILM mÉtallique

Also Published As

Publication number Publication date
FR2515917A3 (fr) 1983-05-06

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