FR2497402B1 - METHOD OF MANUFACTURING P-N JUNCTIONS BY ELECTROMIGRATION - Google Patents
METHOD OF MANUFACTURING P-N JUNCTIONS BY ELECTROMIGRATIONInfo
- Publication number
- FR2497402B1 FR2497402B1 FR8124386A FR8124386A FR2497402B1 FR 2497402 B1 FR2497402 B1 FR 2497402B1 FR 8124386 A FR8124386 A FR 8124386A FR 8124386 A FR8124386 A FR 8124386A FR 2497402 B1 FR2497402 B1 FR 2497402B1
- Authority
- FR
- France
- Prior art keywords
- electromigration
- junctions
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
- H01L21/40—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22114280A | 1980-12-29 | 1980-12-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2497402A1 FR2497402A1 (en) | 1982-07-02 |
FR2497402B1 true FR2497402B1 (en) | 1986-09-26 |
Family
ID=22826530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8124386A Expired FR2497402B1 (en) | 1980-12-29 | 1981-12-29 | METHOD OF MANUFACTURING P-N JUNCTIONS BY ELECTROMIGRATION |
Country Status (5)
Country | Link |
---|---|
US (1) | US4377423A (en) |
JP (1) | JPS57133627A (en) |
DE (1) | DE3150748A1 (en) |
FR (1) | FR2497402B1 (en) |
GB (1) | GB2090465B (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4549912A (en) * | 1981-06-11 | 1985-10-29 | General Electric Company | Anode and cathode connections for the practice of electromigration |
US4534100A (en) * | 1982-06-28 | 1985-08-13 | The United States Of America As Represented By The Secretary Of The Air Force | Electrical method of making conductive paths in silicon |
US4595428A (en) * | 1984-01-03 | 1986-06-17 | General Electric Company | Method for producing high-aspect ratio hollow diffused regions in a semiconductor body |
US4683442A (en) * | 1984-10-18 | 1987-07-28 | Motorola, Inc. | Operational amplifier circuit utilizing resistors trimmed by metal migration |
US4606781A (en) * | 1984-10-18 | 1986-08-19 | Motorola, Inc. | Method for resistor trimming by metal migration |
DE3503264A1 (en) * | 1985-01-31 | 1986-08-07 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen | METHOD FOR MODIFYING THE LOCAL, ATOMARIC COMPOSITION OF SOLID BODIES, IN PARTICULAR SEMICONDUCTORS |
JPH03102083U (en) * | 1989-10-05 | 1991-10-24 | ||
US5167888A (en) * | 1989-11-30 | 1992-12-01 | The British Petroleum Company P.L.C. | Polymer composites |
US5382812A (en) * | 1993-04-14 | 1995-01-17 | Kobe Development Corporation | Diamond and II-VI heterojunction semiconductor light emitting device |
US7170001B2 (en) * | 2003-06-26 | 2007-01-30 | Advent Solar, Inc. | Fabrication of back-contacted silicon solar cells using thermomigration to create conductive vias |
US20060128147A1 (en) * | 2004-12-09 | 2006-06-15 | Honeywell International Inc. | Method of fabricating electrically conducting vias in a silicon wafer |
FR2880193A1 (en) * | 2004-12-23 | 2006-06-30 | St Microelectronics Sa | SCHOTTKY DIODE WITH VERTICAL BARRIER |
US7804175B2 (en) * | 2007-01-31 | 2010-09-28 | Hewlett-Packard Development Company, L.P. | Semiconductor structures including conductive vias continuously extending therethrough and methods of making the same |
TW201310690A (en) * | 2011-08-05 | 2013-03-01 | Imec | Back contact solar cell manufacturing method |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2813048A (en) * | 1954-06-24 | 1957-11-12 | Bell Telephone Labor Inc | Temperature gradient zone-melting |
US3188244A (en) * | 1961-04-24 | 1965-06-08 | Tektronix Inc | Method of forming pn junction in semiconductor material |
GB1034503A (en) * | 1963-05-14 | 1966-06-29 | Nat Res Dev | Improvements in or relating to the production of crystalline material |
US4012242A (en) * | 1973-11-14 | 1977-03-15 | International Rectifier Corporation | Liquid epitaxy technique |
US4049505A (en) * | 1974-10-14 | 1977-09-20 | Chatterji Arun K | Photoconductors for electrostatic imaging systems |
US4159215A (en) * | 1978-09-21 | 1979-06-26 | General Electric Company | Droplet migration doping using reactive carriers and dopants |
-
1981
- 1981-11-19 GB GB8134866A patent/GB2090465B/en not_active Expired
- 1981-12-22 DE DE19813150748 patent/DE3150748A1/en not_active Withdrawn
- 1981-12-28 JP JP56210092A patent/JPS57133627A/en active Granted
- 1981-12-29 FR FR8124386A patent/FR2497402B1/en not_active Expired
-
1982
- 1982-04-28 US US06/372,857 patent/US4377423A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4377423A (en) | 1983-03-22 |
FR2497402A1 (en) | 1982-07-02 |
DE3150748A1 (en) | 1982-07-15 |
GB2090465B (en) | 1985-11-13 |
JPS6342851B2 (en) | 1988-08-25 |
JPS57133627A (en) | 1982-08-18 |
GB2090465A (en) | 1982-07-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |