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FR2471725A1 - Printed circuit board manufacture using distance soldering - has pins with insulating outer tube used to isolate selected holes during soldering - Google Patents

Printed circuit board manufacture using distance soldering - has pins with insulating outer tube used to isolate selected holes during soldering Download PDF

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Publication number
FR2471725A1
FR2471725A1 FR7930496A FR7930496A FR2471725A1 FR 2471725 A1 FR2471725 A1 FR 2471725A1 FR 7930496 A FR7930496 A FR 7930496A FR 7930496 A FR7930496 A FR 7930496A FR 2471725 A1 FR2471725 A1 FR 2471725A1
Authority
FR
France
Prior art keywords
pins
connections
printed circuit
holes
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7930496A
Other languages
French (fr)
Other versions
FR2471725B1 (en
Inventor
Theophile Hasseveldt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Industrielle et Commerciale SA
Original Assignee
Philips Industrielle et Commerciale SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Industrielle et Commerciale SA filed Critical Philips Industrielle et Commerciale SA
Priority to FR7930496A priority Critical patent/FR2471725A1/en
Publication of FR2471725A1 publication Critical patent/FR2471725A1/en
Application granted granted Critical
Publication of FR2471725B1 publication Critical patent/FR2471725B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The printed circuit board mfr. includes insulating the particular metallised holes of those formed in the surface of the board, where the normal component connections are formed by distance soldering. Instead of using a mask to cover the particular holes, each hole has a pin with a surrounding insulating tube inserted in it before the soldering procedure. The pins are subsequently removed to allow the particular connections to be made. Pref. the tubes of these pins are colour coded in accordance with the dia. of the wire required to form the connections. The method of insulating selected holes is flexible and applicable to various printed circuit boards, with the problems involved in removal of the mask avoided.

Description

TECHNIQUE D'ISOLEMENT DES TROUS METALLISES DANS DES CARTES DE CIRCUITS
IMPRIMES.TECHNIQUE FOR ISOLATING METALLIZED HOLES IN CIRCUIT BOARDS
PRINTS.

La présente invention concerne un procédé pour isoler les trous métallisés dans une carte de circuit imprimé ou les connexions normales des composants sont effectuées par une technique standard de soudure è la vague. Dans l'art antérieur, comme décrit dans les brevets américains n0 2 916 805 et n0 3 152 388, une méthode est utilisée, qui consiste à isoler l'envers de ladite carte de circuit imprimé avec une planche de matière isolante (masque) comprenant des ouvertures de telle façon que seuls les trous nécessaires pour effectuer les connexions normales soient exposés. Donc, les trous métallisés qui doivent être maintenus sans soudure pour les connexions particulières sont isolés. The present invention relates to a method for isolating metallized holes in a printed circuit board where normal component connections are made by a standard wave soldering technique. In the prior art, as described in American patents Nos. 2,916,805 and 3,152,388, a method is used which consists in isolating the back of said printed circuit board with a board of insulating material (mask) comprising openings so that only the holes needed to make normal connections are exposed. Therefore, the metallized holes which must be kept seamless for the particular connections are insulated.

Dans la fabrication des cartes de circuits imprimés, uti- lisant cette technique de soudure à la vague, il y a des occasions ou les connexions non standard sont nécessaires, par exemple les liaisons croisées entre composants, via les fils, lorsque le nombre de connexions dépasse la capacité de connexion de la carte de circuit imprimé, ou lorsqu'il faut garder les trous libres pour les composants ou connexions ultérieurs. Dans ce cas, les trous de connexion concernés doivent être isolés, soit comme décrit ci-dessus pour être sans soudure, soit si ladite méthode d'isolement n'est pas utilisée les trous concernés doivent être dégagés de la soudure par d'autres moyens (une technique mécanique par exemple), après la phase de soudure à la vague. In the manufacture of printed circuit boards, using this wave soldering technique, there are occasions when non-standard connections are necessary, for example cross connections between components, via wires, when the number of connections exceeds the connection capacity of the printed circuit board, or when it is necessary to keep the holes free for subsequent components or connections. In this case, the connection holes concerned must be isolated, either as described above to be seamless, or if the said isolation method is not used, the holes concerned must be released from the weld by other means (a mechanical technique for example), after the wave soldering phase.

Dans le premier cas, la production des masques pour les différentes cartes de circuits imprimés est coûteuse et dans le deuxième cas, les moyens pour dégager les trous peuvent prendre beaucoup de temps et-par conséquent être onéreux.  In the first case, the production of the masks for the various printed circuit boards is expensive and in the second case, the means for clearing the holes can take a long time and therefore be expensive.

La présente invention est caractérisée en ce que lesdits trous métallisés à maintenir sans soudure sont isolés par un procédé où - premièrement, des épingles de diamètre et de longueur appropriés sont
enfoncées dans lesdits trous métallisés à isoler, le corps desdites
épingles étant lui-même isolé desdits trous métallisés au moyen de tu
bes en matériau isolant de diamètres et longueurs appropriés - deuxièmement, lesdites connexions désirées sont effectuées par ladite
technique de soudure à la vague - et troisièmement, lesdites connexions particulières sont effectuées en
enlevant lesdites épingles desdits trous métallisés isolés.The present invention is characterized in that said metallized holes to be kept seamless are isolated by a process where - firstly, pins of suitable diameter and length are
sunk into said metallized holes to be insulated, the body of said
pins being itself insulated from said metallized holes by means of tu
bes made of insulating material of appropriate diameters and lengths - secondly, said desired connections are made by said
wave soldering technique - and thirdly, said particular connections are made in
removing said pins from said insulated metallized holes.

Le but principal de la présente invention est de réduire le coût des connexions non standard par un procédé d'isolement des trous concernés et par la sélection des fils nécessaires, qui est efficace et souple pour une variété de cartes de circuits imprimés. The main object of the present invention is to reduce the cost of non-standard connections by a method of isolating the holes concerned and by selecting the necessary wires, which is efficient and flexible for a variety of printed circuit boards.

L'invention est maintenant décrite. Lorsque les trous métallisés à utiliser pour les connexions particulières sont identifiés, ils sont obstrués avec des épingles isolées. Chaque épingle utilisée a un diamètre et une longueur appropriés pour une variété de trous de diamètres différents. Le corps de chaque épingle est isolé de son trou métallisé par un tube en matériau isolant, de téflon par exemple, les diamètres et longueurs des tubes de téflon étant choisis en fonction de la taille des épingles. L'ensemble de l'épingle et du tube de téflon doit bien remplir le trou métallisé pour que la soudure ne puisse pas entrer dans le trou métallisé. The invention is now described. When the metallic holes to be used for the particular connections are identified, they are obstructed with insulated pins. Each pin used has a diameter and length suitable for a variety of different diameter holes. The body of each pin is isolated from its metallized hole by a tube made of insulating material, of teflon for example, the diameters and lengths of the teflon tubes being chosen as a function of the size of the pins. The assembly of the pin and the teflon tube must fill the metallized hole well so that the weld cannot enter the metallized hole.

Le tube de téflon qui isole chaque épingle est codé en couleur afin de définir le diamètre du fil nécessaire pour la connexion. The teflon tube which isolates each pin is color coded to define the diameter of the wire required for connection.

De plus, ce code permet aux deux points de chaque connexion d'être rapidement identifiés. Par exemple, les couleurs différentes peuvent définir les diamètres de fils de 0,8 mm, 1 mm, 1,2 mm. Donc, après les connexions normales des composants sur la carte, effectuées par la technique de soudure à la vague, le code en couleur des épingles permet aux connexions particulières d'être rapidement faites, en remplaçant les épingles par les fils de diamètre approprié et en effectuant les connexions avec un fer à souder par exemple. In addition, this code allows the two points of each connection to be quickly identified. For example, different colors can define wire diameters of 0.8mm, 1mm, 1.2mm. So, after the normal connections of the components to the board, made by the wave soldering technique, the color code of the pins allows the particular connections to be quickly made, replacing the pins with the wires of appropriate diameter and making the connections with a soldering iron for example.

Claims (2)

REVENDICATIONS 1. Procédé pour isoler des trous métallisés particuliers dans une carte de circuit imprimé oh les connexions normales des composants sont effectuées par une technique de soudure à la vague, ledit procédé comprenant les moyens d'isoler l'envers de ladite carte de circuit imprimé avec une planche de matière isolante comprenant des ouvertures, de telle façon que seuls les trous nécessaires pour effectuer les connexions normales soient exposés, lesdits trous métallisés particuliers étant isolés, caractérisé en ce que lesdits trous métallisés à maintenir sans soudure sont isolés par un procédé où - premièrement, des épingles de diamètre et de longueur appropriés sont1. Method for isolating particular metallized holes in a printed circuit board where the normal connections of the components are made by a wave soldering technique, said method comprising the means of isolating the back of said printed circuit board with a board of insulating material comprising openings, so that only the holes necessary to make the normal connections are exposed, said particular metallized holes being insulated, characterized in that said metallized holes to be kept seamless are insulated by a process where - first, pins of appropriate diameter and length are enfoncées dans lesdits trous métallisés à isoler, le corps desdites sunk into said metallized holes to be insulated, the body of said épingles étant lui-méme isolé desdits trous métallisés au moyen de tu pins being itself insulated from said metallized holes by means of tu bes en matériau isolant de diamètres et longueurs appropriés -; - deuxièmement, lesdites connexions désirées sont effectuées par ladite bes made of insulating material of appropriate diameters and lengths; - secondly, said desired connections are made by said technique de soudure à la vague - et troisièmement, lesdites connexions particulières sont effectuées en wave soldering technique - and thirdly, said particular connections are made in enlevant lesdites épingles desdits trous métallisés isolés. removing said pins from said insulated metallized holes. 2. Procédé selon la revendication 1, caractérisé en ce que ledit procédé comprend, en outre, les moyens de coder en couleur les tubes isolants desdites épingles en fonction du diamètre des fils nécessaires pour effectuer lesdites connexions particulières. 2. Method according to claim 1, characterized in that said method further comprises the means of color coding the insulating tubes of said pins as a function of the diameter of the wires necessary to make said particular connections.
FR7930496A 1979-12-12 1979-12-12 Printed circuit board manufacture using distance soldering - has pins with insulating outer tube used to isolate selected holes during soldering Granted FR2471725A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7930496A FR2471725A1 (en) 1979-12-12 1979-12-12 Printed circuit board manufacture using distance soldering - has pins with insulating outer tube used to isolate selected holes during soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7930496A FR2471725A1 (en) 1979-12-12 1979-12-12 Printed circuit board manufacture using distance soldering - has pins with insulating outer tube used to isolate selected holes during soldering

Publications (2)

Publication Number Publication Date
FR2471725A1 true FR2471725A1 (en) 1981-06-19
FR2471725B1 FR2471725B1 (en) 1982-03-05

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ID=9232700

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7930496A Granted FR2471725A1 (en) 1979-12-12 1979-12-12 Printed circuit board manufacture using distance soldering - has pins with insulating outer tube used to isolate selected holes during soldering

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Country Link
FR (1) FR2471725A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0043224A2 (en) * 1980-06-26 1982-01-06 McKenzie, Joseph A., Jr. Component mask for printed circuit boards
FR2587575A1 (en) * 1985-09-18 1987-03-20 Eat Etude Assistance Tech PROCESS FOR THE MANUFACTURE OF ELECTRIC CIRCUIT SUPPORTS

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3576669A (en) * 1968-08-15 1971-04-27 Nasa Method for coating through-holes
GB1456378A (en) * 1973-12-21 1976-11-24 Post Office Electrical circuit artwork

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3576669A (en) * 1968-08-15 1971-04-27 Nasa Method for coating through-holes
GB1456378A (en) * 1973-12-21 1976-11-24 Post Office Electrical circuit artwork

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0043224A2 (en) * 1980-06-26 1982-01-06 McKenzie, Joseph A., Jr. Component mask for printed circuit boards
EP0043224A3 (en) * 1980-06-26 1982-10-13 Joseph A. Mckenzie, Jr. Component mask for printed circuit boards
FR2587575A1 (en) * 1985-09-18 1987-03-20 Eat Etude Assistance Tech PROCESS FOR THE MANUFACTURE OF ELECTRIC CIRCUIT SUPPORTS
EP0219394A1 (en) * 1985-09-18 1987-04-22 Société Anonyme E A T Société d'Etude et d'Assistance Technique Method of manufacturing electrical circuit boards

Also Published As

Publication number Publication date
FR2471725B1 (en) 1982-03-05

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