FR2468278A1 - METHOD AND APPARATUS FOR CONNECTING CONDUCTIVE ELEMENTS BETWEEN A MAIN CIRCUIT PANEL AND ADJACENT CIRCUIT PANELS - Google Patents
METHOD AND APPARATUS FOR CONNECTING CONDUCTIVE ELEMENTS BETWEEN A MAIN CIRCUIT PANEL AND ADJACENT CIRCUIT PANELS Download PDFInfo
- Publication number
- FR2468278A1 FR2468278A1 FR8022890A FR8022890A FR2468278A1 FR 2468278 A1 FR2468278 A1 FR 2468278A1 FR 8022890 A FR8022890 A FR 8022890A FR 8022890 A FR8022890 A FR 8022890A FR 2468278 A1 FR2468278 A1 FR 2468278A1
- Authority
- FR
- France
- Prior art keywords
- elements
- circuit
- panel
- openings
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 8
- 238000012360 testing method Methods 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10848—Thinned leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Procédé et appareil pour relier entre eux les éléments conducteurs d'un panneau principal de circuit et d'un ou plusieurs panneaux secondaires adjacents. Le panneau principal 10 fait initialement partie intégrante du ou des panneaux secondaires 10b, 10c dont il n'est séparé que par des ouvertures allongées 12 entre lesquelles subsistent des zones 14; le panneau comprend des éléments de circuit 16 qui relient entre eux des composants électriques 18 et se terminent sur un côté desdites ouvertures que franchissent des éléments de connexion 20 en U ayant une partie médiane affaiblie 22 et qui servent à relier entre elles des extrémités de ces éléments de circuit; on supprime les zones entre les ouvertures et on coude les éléments de connexion pour donner aux panneaux secondaires la position angulaire désirée par rapport au panneau principal. Application aux instruments ou appareils électroniques tels que oscilloscopes, multimètres, etc.A method and apparatus for interconnecting the conductive elements of a main circuit board and one or more adjacent sub boards. The main panel 10 initially forms an integral part of the secondary panel or panels 10b, 10c from which it is separated only by elongated openings 12 between which zones 14 remain; the panel comprises circuit elements 16 which interconnect electrical components 18 and terminate on one side of said openings through which U-shaped connection elements 20 having a weakened middle part 22 pass and which serve to interconnect ends of these circuit elements; the areas between the openings are removed and the connection elements are bent to give the secondary panels the desired angular position relative to the main panel. Application to electronic instruments or devices such as oscilloscopes, multimeters, etc.
Description
La présente invention a trait à un procédé et un appareil pour relierThe present invention relates to a method and apparatus for connecting
entre eux des éléments conducteurs et plus particulièrement à un between them conductive elements and more particularly to a
procédé et un appareil pour relier des éléments conducteurs entre un pan- method and apparatus for connecting conductive elements between a
neau principal de circuit et des panneaux adjacents de circuit. main circuit board and adjacent circuit boards.
On a déjà utilisé plusieurs systèmes pour relier entre eux des éléments conducteurs de panneaux adjacents de circuit, lorsque ceux-ci sont disposés parallèlement entre eux, ou forment un certain angle les Several systems have already been used to connect together conductive elements of adjacent circuit panels, when these are arranged parallel to each other, or form a certain angle.
uns par rapport aux autres. Ces systèmes de liaison font l'objet notam- one against another. These linkage systems are particularly
ment des brevets américains nos 2 740 097, 3 184 645, 3 362 005, US Pat. Nos. 2,740,097, 3,184,645, 3,362,005, US Pat.
l1 3 772 776, 4 109 299, et du brevet français no 1 239 226. Nos. 3 772 776, 4 109 299 and French Patent No. 1 239 226.
Ces systèmes sont basés sur des concepts particuliers de réali- These systems are based on particular concepts of reali-
sation de connexions entre des éléments conducteurs de panneaux de cir- connections between conductive elements of
cuit adjacents, après que l'on a ajouté des composants à ces panneaux, cooked adjacent, after adding components to these panels,
que ces composants ont été soudés en place et testés. C'est là la mé- that these components were welded in place and tested. This is the
thode usuelle, mais elle exige beaucoup de temps et par conséquent d'ar- the usual method, but it requires a lot of time and therefore
gent pour traiter séparément les divers panneaux de circuit qui, après avoir été reliés ou connectés entre eux, doivent être soumis à des essais to treat separately the various circuit boards which, after being connected or connected to each other, must be tested
pour s'assurer que les circuits qu'ils portent ont été correctement re- to ensure that the circuits they carry have been correctly
liés entre eux comme l'exige le schéma. interrelated as required by the scheme.
Dans la présente invention, on utilise un panneau de circuit relativement grand que l'on divise en un panneau principal de circuit et au moins un panneau secondaire de circuit. Des ouvertures de forme allongée séparent le panneau principal de circuit du panneau secondaire In the present invention, a relatively large circuit board is used which is divided into a main circuit board and at least one secondary circuit board. Elongated openings separate the main circuit board from the secondary panel
de circuit, et les panneaux comportent des zones réduites entre ces ou- circuit boards, and the panels have small areas between them.
vertures allongées pour maintenir les panneaux les uns par rapport aux autres afin d'y ajouter des composants électriques ou électroniques, elongated vertices for maintaining the panels relative to one another in order to add electrical or electronic components thereto,
de disposer des connexions électriques en travers de ces ouvertures al- to have electrical connections across these openings
longées, o se trouvent les extrémités des éléments conducteurs de chaque panneau, afin d'assurer les connexions entre ces éléments conducteurs de circuits, après quoi on soude par fusion les composants et les connexions ainsi mis en place, on soumet les panneaux aux essais nécessaires, on supprime les zones qui se trouvent entre les ouvertures allongées, et the ends of the conductive elements of each panel, in order to ensure the connections between these circuit-conducting elements, after which the components and the connections thus merged by fusion are fused, the panels subjected to the necessary tests. the areas between the elongate openings are eliminated, and
on plie les connexions électriques afin que la ou les panneaux secon- the electrical connections are folded so that the secondary panel or panels
daires forment un certain angle par rapport au panneau principal. daries form a certain angle to the main panel.
Un but essentiel de la présente invention consiste à faire d'un grand panneau de circuit un panneau principal de circuit et au moins un panneau secondaire de circuit, à relier les éléRuents conducteurs entre eux, à l'aide d'éléments de connexion alignés entre euxà souder par An essential object of the present invention is to make a large circuit board a circuit main panel and at least one secondary circuit board, to connect the conductive elements to each other, using connecting elements aligned between they solder by
2468278-2468278-
fusion les composants et les éléments de connexion, et finalement à merging components and connection elements, and finally to
tester le panneau.test the panel.
Un autre but de l'invention consiste à prévoir l'application d'é- Another object of the invention is to provide for the application of
léments de connexion aux extrémités d'éléments conducteurs d'un panneau de circuit qui comportent des composants électriques intérieurs, à sou- der les composants et les éléments de connexion au panneau, à soumettre ce dernier à des essais et à le diviser en panneaux distincts de circuits connection elements at the ends of conductive elements of a circuit board which have internal electrical components, to weld the components and the connection elements to the panel, to test it and to divide it into separate panels circuits
le long des éléments de connexion. along the connection elements.
Un but complémentaire de l'invention consiste à prévoir un cir- A complementary object of the invention is to provide a circuit
cuit qui assure la liaison entre des extrémités d'éléments de circuit à travers des ouvertures prévues à cet effet dans le panneau, à souder les composants et les éléments de connexion audit panneau, à soumettre ce dernier à des essais, à supprimer des zones du panneau entre lesdites ouvertures pour diviser le panneau en panneaux distincts de circuits, reliés entre eux par les éléments de connexion, et à couder les éléments baked which connects ends of circuit elements through apertures provided for this purpose in the panel, soldering the components and connection elements to said panel, subjecting it to testing, removing areas of the panel, panel between said openings for dividing the panel into separate panels of circuits, interconnected by the connecting elements, and bending the elements
de connexion électrique pour que les panneaux distincts forment un cer- electrical connection so that the separate panels form a
tain angle par rapport les uns aux autres. angle relative to each other.
Enfin, l'invention a pour but de prévoir un panneau de circuit sur lequel sont formés des éléments de circuits qui servent à relier entre eux des composants électriques, des ouvertures alignées pratiquées Finally, an object of the invention is to provide a circuit board on which circuit elements are formed which serve to interconnect electrical components, aligned openings made between them.
dans ce panneau et séparées par des zones de surface, des parties ter- in this panel and separated by surface areas,
minales d'éléments de circuit disposées de part et d'autres desdites ouvertures pour recevoir des éléments de connexion afin de relier les éléments de circuit entre eux, les zones qui séparent les ouvertures alignées pouvant être enlevées afin de séparer le panneau en panneaux distincts de circuits, les panneaux de circuits ainsi séparés pouvant être disposés de façon qu'ils forment un certain angle par rapport les of circuit elements disposed on either side of said openings for receiving connecting elements to connect the circuit elements to each other, the zones separating the aligned openings which can be removed to separate the panel into separate panels of circuits, the circuit boards thus separated being able to be arranged so that they form a certain angle with respect to the
uns aux autres en coudant les éléments de connexion. to each other by bending the connecting elements.
Les buts, caractéristiques et avantages décrits ci-dessus de l'invention, ainsi que d'autres encore, ressortiront clairement au cours The above-mentioned objects, features and advantages of the invention, as well as others, will become apparent during
de la description qui suit d'un mode particulier de réalisation de l'in- of the following description of a particular embodiment of the invention.
vention que montre le dessin annexé, sur lequel: shown in the attached drawing, in which:
La FIGURE 1 est une vue en plan du dessus d'un panneau de cir- FIGURE 1 is a top plan view of a traffic sign.
cuit soudé en position; La FIGURE 2 est une vue en perspective du panneau de la Figure 1, montrant la séparation du panneau en plusieurs panneaux distincts de circuits formant un certain angle entre eux; La FIGURE 3 est une coupe transversale faite à une échelle agrandie suivant la ligne 3-3 de la Figure 1, et La FIGURE 4 est une vue en coupe faite suivant les flèches 4-4 baked welded in position; FIGURE 2 is a perspective view of the panel of Figure 1, showing the separation of the panel into several distinct panels of circuits forming a certain angle between them; FIGURE 3 is a cross-section taken on an enlarged scale taken along the line 3-3 of FIGURE 1, and FIGURE 4 is a sectional view taken along arrows 4-4.
de la Figure 2.of Figure 2.
Sur le dessin, on voit qu'un panneau principal de circuit im- In the drawing, we see that a main circuit board im-
primé ou gravé 10 est réalisé en matière isolante appropriée et présente des ouvertures allongées 12 séparées par des zones pleines 14. Ainsi, le panneau est divisé en un panneau principal proprement dit 10a et des panneaux secondaires lob, loc, et des éléments de circuit 16 en matériau conducteur sont déposés ou formés sur le panneau 10, tandis que les extrémités de certains éléments de circuit 16 entourent des trous qui traversent les panneaux 10a, 10b, 10c et dans lesquels on introduit les conducteurs de composants électriques 18. Le panneau de circuit 10 peut éventuellement comporter des éléments conducteurs sur ses deux faces principales, ou alternativement constituer un circuit multi-couches, suivant le cas envisagé. Les éléments conducteurs relient entre eux les composants électriques pour constituer des circuits électroniques sur The winning or engraved 10 is made of suitable insulating material and has elongate openings 12 separated by solid areas 14. Thus, the panel is divided into a main panel 10a and lob side panels, loc, and circuit elements 16 in conductive material are deposited or formed on the panel 10, while the ends of some circuit elements 16 surround holes that pass through the panels 10a, 10b, 10c and into which the electrical component conductors 18 are introduced. The circuit board 10 may optionally comprise conductive elements on its two main faces, or alternatively constitute a multi-layer circuit, depending on the case envisaged. The conductive elements connect the electrical components together to form electronic circuits on
chacun des panneaux lOa, lob, et loc. each of the panels 10a, lob, and loc.
Certaines extrémités d'éléments de circuits 16 se terminent au voisinage d'ouvertures allongées 12 sur une rangée alignée de part et Some ends of circuit elements 16 terminate in the vicinity of elongate openings 12 on an aligned array of
d'autre de ces ouvertures, et à travers celles-ci, ces extrémités en- other of these openings, and through these, these ends
tourant des trous récepteurs d'éléments de connexion qui traversent les turning receiving holes of connecting elements that pass through
panneaux 10a, l0b et loc. Les extrémités d'éléments de connexion élec- panels 10a, 10b and loc. The ends of electrical connection elements
trique 20, en forme de crampons ou d'U inversé, sont engagées dans des trous alignés respectifs et transversalement par rapport aux ouvertures allongées 12 afin de relier entre eux les éléments de circuits entre les panneaux 10a, l0b et loc. Ainsi, on réalise l'interconnexion d'éléments In the form of studs or inverted U, they are engaged in respective aligned holes and transversely to the elongate openings 12 to interconnect the circuit elements between the panels 10a, 10b and loc. Thus, the interconnection of elements
de circuits portés par chaque panneau loa, l0b et 10c. Les pontets for- circuits carried by each panel loa, l0b and 10c. The bridges
més par les éléments de connexion électrique 20 sont emboutis sur leur by the electrical connection elements 20 are stamped on their
milieu de façon à être déformés et à constituer des points de pliage 22. medium so as to be deformed and to form folding points 22.
Les éléments de connexion sont façonnés puis introduits dans les trous alignés aux extrémités des éléments de circuit en utilisant pour cela une machine qui opère en coupant à la longueur désirée du fil de cuivre étamé dont l'alimentation s'effectue de manière continue, le tronçon ainsi coupé étant ensuite replié en U, la partie intermédiaire étant emboutie pour y former la partie à plier ou point de pliage, après quoi on introduit l'élément de connexion en U dans les trous alignés correspondants. Dans la pratique, on équipe le panneau 10 de composants électri-s The connection elements are shaped and then introduced into the holes aligned at the ends of the circuit elements, using for this purpose a machine which operates by cutting to the desired length of the tinned copper wire which feeds continuously, the section thus cut being then folded U, the intermediate portion being stamped to form the portion to bend or folding point, after which the U-shaped connecting element is introduced into the corresponding aligned holes. In practice, we equip the panel 10 of electrical components
ques, ceux-ci formant avec les éléments de circuit des circuits électro- which, together with the circuit elements, form
niques sur les panneaux 10a, lob et loc, après quoi on introduit das éléments de connexion dans les trous alignés transversalement par rapport aux ouvertures allongées 12, afin de relier lntre eux les éléments de circuit. Les conducteurs des composants et les extrémités des éléments de connexion peuvent être introduits dans-la machine soit manuellement, soit par l'usage de machines commandées par des opérateurs, soit encore 10a, lob and loc, after which connection elements are introduced into the holes aligned transversely with respect to the elongated openings 12, in order to connect the circuit elements to each other. The conductors of the components and the ends of the connection elements can be introduced into the machine either manually, or by the use of machines controlled by operators, or
par des machines entièrement commandées par ordinateur. by fully computer controlled machines.
Après l'introduction des composants et des éléments de connexion dans le panneau 10, on en effectue le soudage par des procédés classiques, tels que le procédé dit "par fusion". Ensuite, on soumet le panneau à des essais en utilisant pour cela un appareillage traditionnel d'essai de circuits, et dès que ces essais sont achevés, on enlève les zones 14 qui séparent les ouvertures 12 en coupant ou par toute autre opération équivalente. Les panneaux lob et loc sont alors disposés suivant un certain angle par rapport au panneau principal loa en pliant les éléments de connexion 22. Ainsi, ces éléments de connexion électrique 20 servent de charnière et aussi de moyen pour supporter mécaniquement les panneaux After the components and connection elements are introduced into the panel 10, the welding is carried out by conventional methods, such as the "fusion" method. Then, the panel is tested using conventional circuit test equipment for this purpose, and as soon as these tests are completed, the zones 14 separating the openings 12 are removed by cutting or any other equivalent operation. The lob and loc panels are then arranged at an angle to the main panel loa by folding the connection elements 22. Thus, these electrical connection elements 20 serve as a hinge and also means to mechanically support the panels
par rapport les uns aux autres. Les panneaux lOb et loc peuvent être pla- relative to each other. The panels 10b and loc can be placed
cés dans n'importe quelle position angulaire afin d'épouser une configu- in any angular position in order to fit a configuration
ration quelconque. De cette façon, le panneau complet 10, avec les panneaux any ration. In this way, the complete panel 10, with the panels
secondaires lob et 10c disposés à angle droit par rapport au panneau prin- lob and 10c are arranged at right angles to the main panel
cipal 10a, peuvent constituer un ensemble complet de circuit pour un ins- 10a, can constitute a complete set of circuits for a
trument ou appareil électronique, et l'on peut placer l'ensemble du pan- trument or electronic device, and the whole of the
neau dans un coffret ou ébénisterie pour appareillage électronique qui peut être celle d'un appareil ou instrument électronique quelconque, par exemple un oscilloscope, un compteur, un multimètre à affichage numérique, etc. La présente invention permet donc de charger un panneau unique avec des composants devant être reliés entre eux par des éléments de in a box or cabinet for electronic equipment which may be that of any electronic instrument or instrument, for example an oscilloscope, a meter, a digital display multimeter, etc. The present invention thus makes it possible to load a single panel with components to be connected together by elements of
circuit pour constituer un circuit électronique et des éléments de conne- circuit to constitute an electronic circuit and connectivity elements.
xion électriques que l'on enfonce dans le panneau suivant des rangées alignées afin de relier entre eux les éléments de circuit. Le panneau xion that are pressed in the following panel rows aligned to connect the circuit elements. The panel
est ensuite soumis à une opération de soudage des composants et des élé- is then subjected to a welding operation of the components and elements
ments de connexion, de manière que le panneau soit transformé en un pan- connections, so that the panel is transformed into a panel.
neau principal et un ou plusieurs panneaux secondaires de circuit, les éléments de connexion étant ensuite pliés afin de disposer les panneaux main board and one or more secondary circuit panels, the connection elements then being folded to arrange the panels
secondaires suivant un certain angle par rapport au panneau principal. secondary at a certain angle to the main panel.
Bien que l'invention ait été décrite et représentée en se ré- Although the invention has been described and
férant plus particulièrement à un mode préféré de réalisation, il est more particularly to a preferred embodiment, it is
évident pour tout homme de l'art que l'on peut apporter différents chan- obvious to any person skilled in the art that it is possible to bring different
gements de forme et de détail à ce mode de réalisation sans s'écarter des principes de base de l'invention. form and detail in this embodiment without departing from the basic principles of the invention.
Claims (4)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8728479A | 1979-10-23 | 1979-10-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2468278A1 true FR2468278A1 (en) | 1981-04-30 |
Family
ID=22204256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8022890A Withdrawn FR2468278A1 (en) | 1979-10-23 | 1980-10-22 | METHOD AND APPARATUS FOR CONNECTING CONDUCTIVE ELEMENTS BETWEEN A MAIN CIRCUIT PANEL AND ADJACENT CIRCUIT PANELS |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5673490A (en) |
DE (1) | DE3040054A1 (en) |
FR (1) | FR2468278A1 (en) |
GB (1) | GB2061623A (en) |
NL (1) | NL8005739A (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4502098A (en) * | 1981-02-10 | 1985-02-26 | Brown David F | Circuit assembly |
US4520339A (en) * | 1982-04-26 | 1985-05-28 | Kabushiki Kaisha Ishida Koki Seisakusho | Load cell with adjustable bridge circuit |
FR2536624A1 (en) * | 1982-11-24 | 1984-05-25 | Sev Alternateurs | Method for mounting an electrical and/or electronic circuit inside a case, and circuit and case which are obtained by the method. |
DE3346461A1 (en) * | 1983-12-22 | 1985-07-04 | Siemens AG, 1000 Berlin und 8000 München | Method for manufacturing a telephone station |
DE3500554C1 (en) * | 1985-01-10 | 1986-01-09 | Degussa Ag, 6000 Frankfurt | Use of nickel alloys for glasses frames |
FR2591054B1 (en) * | 1985-08-29 | 1989-05-12 | Merlin Gerin | MOUNTING PRINTED CIRCUIT BOARDS |
US4742183A (en) * | 1986-10-24 | 1988-05-03 | Napco Security Systems, Inc. | Methods and techniques for fabricating foldable printed circuit boards |
DE3743163A1 (en) * | 1987-12-19 | 1989-06-29 | Olympia Aeg | Printed circuit board for an electrical circuit, especially in an office machine |
DE3836033A1 (en) * | 1988-10-22 | 1990-04-26 | Hella Kg Hueck & Co | Electrical apparatus, especially for motor vehicles |
FR2670352B1 (en) * | 1990-12-06 | 1994-04-01 | Moulinex | METHOD FOR ORIENTATION OF AT LEAST ONE ELECTRONIC COMPONENT PLACED ON A PRINTED CIRCUIT BOARD. |
JP2606177B2 (en) * | 1995-04-26 | 1997-04-30 | 日本電気株式会社 | Printed wiring board |
US20020078560A1 (en) * | 2000-12-21 | 2002-06-27 | Xerox Corporation | Process for contemporaneous manufacture and interconnection between adjoining printed wiring boards |
US6801436B2 (en) | 2001-09-28 | 2004-10-05 | Intel Corporation | Extension mechanism and method for assembling overhanging components |
DE202004021564U1 (en) * | 2004-08-02 | 2009-03-12 | Neuschäfer Elektronik GmbH | Connecting element for printed circuit boards |
FR2878401B1 (en) * | 2004-11-22 | 2007-01-19 | Valeo Vision Sa | METHOD FOR MANUFACTURING SUPPORT OF INTERCONNECTED LIGHT EMITTING DIODES IN A THREE DIMENSIONAL ENVIRONMENT |
DE202007005076U1 (en) * | 2007-04-05 | 2007-08-02 | Kiekert Ag | Component carrier for locking systems |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1239226A (en) * | 1958-10-30 | 1960-08-19 | Philips Nv | Device chassis with wiring formed by metal layers, and method of manufacture thereof |
GB1142627A (en) * | 1965-06-01 | 1969-02-12 | Philips Electronic Associated | Improvements relating to printed circuit boards |
US3427715A (en) * | 1966-06-13 | 1969-02-18 | Motorola Inc | Printed circuit fabrication |
US4085433A (en) * | 1976-11-22 | 1978-04-18 | Baranowski Conrad J | Method and apparatus for improving packaging density of discrete electronic components |
CH607543A5 (en) * | 1976-11-15 | 1978-12-29 | Zbinden & Co | Two dimensional printed circuit board |
US4227238A (en) * | 1977-09-28 | 1980-10-07 | Nippon Gakki Seizo Kabushiki Kaisha | Mounting and electrical connection means for operation unit for electric devices |
-
1980
- 1980-09-16 GB GB8029845A patent/GB2061623A/en not_active Withdrawn
- 1980-10-17 NL NL8005739A patent/NL8005739A/en not_active Application Discontinuation
- 1980-10-22 FR FR8022890A patent/FR2468278A1/en not_active Withdrawn
- 1980-10-23 JP JP14886280A patent/JPS5673490A/en active Pending
- 1980-10-23 DE DE19803040054 patent/DE3040054A1/en not_active Ceased
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1239226A (en) * | 1958-10-30 | 1960-08-19 | Philips Nv | Device chassis with wiring formed by metal layers, and method of manufacture thereof |
GB1142627A (en) * | 1965-06-01 | 1969-02-12 | Philips Electronic Associated | Improvements relating to printed circuit boards |
US3427715A (en) * | 1966-06-13 | 1969-02-18 | Motorola Inc | Printed circuit fabrication |
CH607543A5 (en) * | 1976-11-15 | 1978-12-29 | Zbinden & Co | Two dimensional printed circuit board |
US4085433A (en) * | 1976-11-22 | 1978-04-18 | Baranowski Conrad J | Method and apparatus for improving packaging density of discrete electronic components |
US4227238A (en) * | 1977-09-28 | 1980-10-07 | Nippon Gakki Seizo Kabushiki Kaisha | Mounting and electrical connection means for operation unit for electric devices |
Also Published As
Publication number | Publication date |
---|---|
NL8005739A (en) | 1981-04-27 |
GB2061623A (en) | 1981-05-13 |
JPS5673490A (en) | 1981-06-18 |
DE3040054A1 (en) | 1981-05-07 |
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