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FR2454742A1 - Assemblage pour le montage de composants electriques - Google Patents

Assemblage pour le montage de composants electriques

Info

Publication number
FR2454742A1
FR2454742A1 FR8008731A FR8008731A FR2454742A1 FR 2454742 A1 FR2454742 A1 FR 2454742A1 FR 8008731 A FR8008731 A FR 8008731A FR 8008731 A FR8008731 A FR 8008731A FR 2454742 A1 FR2454742 A1 FR 2454742A1
Authority
FR
France
Prior art keywords
assembly
radiators
components
electrical components
mounting electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8008731A
Other languages
English (en)
Other versions
FR2454742B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AEI Semiconductors Ltd
Original Assignee
AEI Semiconductors Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AEI Semiconductors Ltd filed Critical AEI Semiconductors Ltd
Publication of FR2454742A1 publication Critical patent/FR2454742A1/fr
Application granted granted Critical
Publication of FR2454742B1 publication Critical patent/FR2454742B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/115—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Rectifiers (AREA)

Abstract

L'INVENTION CONCERNE UN ASSEMBLAGE POUR LE MONTAGE DE COMPOSANTS ELECTRIQUES TELS QUE DES THYRISTORS ET DES DIODES. IL COMPREND DES RADIATEURS DE REFROIDISSEMENT 1, 2 SUR LA SURFACE SUPERIEURE 8, 9 DESQUELS LES COMPOSANTS SONT DESTINES A ETRE MONTES. LES RADIATEURS 1, 2 SONT FIXES L'UN A L'AUTRE ET A DES CONSOLES LATERALES 3, 4 A L'AIDE DE BLOCS ISOLANTS 5, 6, 7 FIXES A LA SURFACE SUPERIEURE DES RADIATEURS PAR DES BOULONS 10 POUVANT ETRE DEPLACES DANS DES CANAUX EN FORME DE T 11. LES BLOCS ISOLANTS 5, 6, 7 PORTENT EGALEMENT DES CONNECTEURS ELECTRIQUES 12, 13, 14 GRACE AUXQUELS ON PEUT INTERCONNECTER LES COMPOSANTS DU CIRCUIT ELECTRIQUE. L'ASSEMBLAGE TROUVE SON APPLICATION DANS LA REALISATION DE PONTS DE REDRESSEMENT DE PUISSANCE.
FR8008731A 1979-04-19 1980-04-18 Assemblage pour le montage de composants electriques Granted FR2454742A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7913561A GB2047473B (en) 1979-04-19 1979-04-19 Mounting assemblies for electrical components

Publications (2)

Publication Number Publication Date
FR2454742A1 true FR2454742A1 (fr) 1980-11-14
FR2454742B1 FR2454742B1 (fr) 1985-02-08

Family

ID=10504633

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8008731A Granted FR2454742A1 (fr) 1979-04-19 1980-04-18 Assemblage pour le montage de composants electriques

Country Status (2)

Country Link
FR (1) FR2454742A1 (fr)
GB (1) GB2047473B (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3205650C2 (de) * 1982-02-17 1986-04-24 Siemens AG, 1000 Berlin und 8000 München Leistungsgleichrichteranordnung
GB2178243B (en) * 1985-06-07 1989-01-18 Hitachi Ltd A power unit assembly
GB8700843D0 (en) * 1987-01-15 1987-02-18 Marston Palmer Ltd Heat sink
GB8700844D0 (en) * 1987-01-15 1987-02-18 Marston Palmer Ltd Heat sink assembly

Also Published As

Publication number Publication date
GB2047473B (en) 1983-01-26
FR2454742B1 (fr) 1985-02-08
GB2047473A (en) 1980-11-26

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Legal Events

Date Code Title Description
ST Notification of lapse