FR2414281A1 - Semiconductor with dielectric substrate in housing - has contact zone connected to capacitor with coatings separated by dielectric - Google Patents
Semiconductor with dielectric substrate in housing - has contact zone connected to capacitor with coatings separated by dielectricInfo
- Publication number
- FR2414281A1 FR2414281A1 FR7800230A FR7800230A FR2414281A1 FR 2414281 A1 FR2414281 A1 FR 2414281A1 FR 7800230 A FR7800230 A FR 7800230A FR 7800230 A FR7800230 A FR 7800230A FR 2414281 A1 FR2414281 A1 FR 2414281A1
- Authority
- FR
- France
- Prior art keywords
- housing
- dielectric
- capacitor
- contact zone
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 239000003990 capacitor Substances 0.000 title abstract 2
- 238000000576 coating method Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000010408 film Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Clocks (AREA)
Abstract
The semiconductor device, can be used in an electronic calculator, electronic watch radio or TV receiver and a measuring instrument. It consists of a housing and a dielectric substrate, which contains a thin film integrated micro-circuit. The housing (1) contains the substrate (2) made from extruded anodised oxide film. The film is obtained from the metal of the housing, which is aluminium. The microcircuit (3) has a contact zone (4). It is connected to a capacitor (6) with coatings (7, 8), which are separated by the dielectric layer (9). The cover of the housing is of the same metal and held in position by slots (18).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7800230A FR2414281A1 (en) | 1978-01-05 | 1978-01-05 | Semiconductor with dielectric substrate in housing - has contact zone connected to capacitor with coatings separated by dielectric |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7800230A FR2414281A1 (en) | 1978-01-05 | 1978-01-05 | Semiconductor with dielectric substrate in housing - has contact zone connected to capacitor with coatings separated by dielectric |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2414281A1 true FR2414281A1 (en) | 1979-08-03 |
FR2414281B1 FR2414281B1 (en) | 1981-05-29 |
Family
ID=9203156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7800230A Granted FR2414281A1 (en) | 1978-01-05 | 1978-01-05 | Semiconductor with dielectric substrate in housing - has contact zone connected to capacitor with coatings separated by dielectric |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2414281A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2459557A1 (en) * | 1979-06-15 | 1981-01-09 | Lerouzix Jean | METAL SUPPORT FOR ELECTRONIC COMPONENT INTERCONNECTION NETWORK AND METHOD OF MANUFACTURING THE SAME |
EP0100144A3 (en) * | 1982-07-22 | 1987-09-02 | Texas Instruments Incorporated | Low cost electronic apparatus construction method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1243254B (en) * | 1964-08-07 | 1967-06-29 | Telefunken Patent | Support body for microcircuits |
FR1507224A (en) * | 1966-11-14 | 1967-12-29 | Cit Alcatel | Partially insulating metal partition |
-
1978
- 1978-01-05 FR FR7800230A patent/FR2414281A1/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1243254B (en) * | 1964-08-07 | 1967-06-29 | Telefunken Patent | Support body for microcircuits |
FR1507224A (en) * | 1966-11-14 | 1967-12-29 | Cit Alcatel | Partially insulating metal partition |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2459557A1 (en) * | 1979-06-15 | 1981-01-09 | Lerouzix Jean | METAL SUPPORT FOR ELECTRONIC COMPONENT INTERCONNECTION NETWORK AND METHOD OF MANUFACTURING THE SAME |
EP0100144A3 (en) * | 1982-07-22 | 1987-09-02 | Texas Instruments Incorporated | Low cost electronic apparatus construction method |
Also Published As
Publication number | Publication date |
---|---|
FR2414281B1 (en) | 1981-05-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |