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FR2414281A1 - Semiconductor with dielectric substrate in housing - has contact zone connected to capacitor with coatings separated by dielectric - Google Patents

Semiconductor with dielectric substrate in housing - has contact zone connected to capacitor with coatings separated by dielectric

Info

Publication number
FR2414281A1
FR2414281A1 FR7800230A FR7800230A FR2414281A1 FR 2414281 A1 FR2414281 A1 FR 2414281A1 FR 7800230 A FR7800230 A FR 7800230A FR 7800230 A FR7800230 A FR 7800230A FR 2414281 A1 FR2414281 A1 FR 2414281A1
Authority
FR
France
Prior art keywords
housing
dielectric
capacitor
contact zone
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7800230A
Other languages
French (fr)
Other versions
FR2414281B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SMOLKO GENNADY
Original Assignee
SMOLKO GENNADY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SMOLKO GENNADY filed Critical SMOLKO GENNADY
Priority to FR7800230A priority Critical patent/FR2414281A1/en
Publication of FR2414281A1 publication Critical patent/FR2414281A1/en
Application granted granted Critical
Publication of FR2414281B1 publication Critical patent/FR2414281B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/165Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142Metallic substrates having insulating layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0091Housing specially adapted for small components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Clocks (AREA)

Abstract

The semiconductor device, can be used in an electronic calculator, electronic watch radio or TV receiver and a measuring instrument. It consists of a housing and a dielectric substrate, which contains a thin film integrated micro-circuit. The housing (1) contains the substrate (2) made from extruded anodised oxide film. The film is obtained from the metal of the housing, which is aluminium. The microcircuit (3) has a contact zone (4). It is connected to a capacitor (6) with coatings (7, 8), which are separated by the dielectric layer (9). The cover of the housing is of the same metal and held in position by slots (18).
FR7800230A 1978-01-05 1978-01-05 Semiconductor with dielectric substrate in housing - has contact zone connected to capacitor with coatings separated by dielectric Granted FR2414281A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7800230A FR2414281A1 (en) 1978-01-05 1978-01-05 Semiconductor with dielectric substrate in housing - has contact zone connected to capacitor with coatings separated by dielectric

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7800230A FR2414281A1 (en) 1978-01-05 1978-01-05 Semiconductor with dielectric substrate in housing - has contact zone connected to capacitor with coatings separated by dielectric

Publications (2)

Publication Number Publication Date
FR2414281A1 true FR2414281A1 (en) 1979-08-03
FR2414281B1 FR2414281B1 (en) 1981-05-29

Family

ID=9203156

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7800230A Granted FR2414281A1 (en) 1978-01-05 1978-01-05 Semiconductor with dielectric substrate in housing - has contact zone connected to capacitor with coatings separated by dielectric

Country Status (1)

Country Link
FR (1) FR2414281A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2459557A1 (en) * 1979-06-15 1981-01-09 Lerouzix Jean METAL SUPPORT FOR ELECTRONIC COMPONENT INTERCONNECTION NETWORK AND METHOD OF MANUFACTURING THE SAME
EP0100144A3 (en) * 1982-07-22 1987-09-02 Texas Instruments Incorporated Low cost electronic apparatus construction method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1243254B (en) * 1964-08-07 1967-06-29 Telefunken Patent Support body for microcircuits
FR1507224A (en) * 1966-11-14 1967-12-29 Cit Alcatel Partially insulating metal partition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1243254B (en) * 1964-08-07 1967-06-29 Telefunken Patent Support body for microcircuits
FR1507224A (en) * 1966-11-14 1967-12-29 Cit Alcatel Partially insulating metal partition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2459557A1 (en) * 1979-06-15 1981-01-09 Lerouzix Jean METAL SUPPORT FOR ELECTRONIC COMPONENT INTERCONNECTION NETWORK AND METHOD OF MANUFACTURING THE SAME
EP0100144A3 (en) * 1982-07-22 1987-09-02 Texas Instruments Incorporated Low cost electronic apparatus construction method

Also Published As

Publication number Publication date
FR2414281B1 (en) 1981-05-29

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Legal Events

Date Code Title Description
ST Notification of lapse