[go: up one dir, main page]

FR2379370A1 - PROCESS FOR THE REALIZATION OF OBJECTS AT LEAST PARTLY IN THERMOPLASTIC MATERIAL FOAM, OBJECTS THUS REALIZED AND DEVICE FOR THE IMPLEMENTATION OF THIS PROCESS - Google Patents

PROCESS FOR THE REALIZATION OF OBJECTS AT LEAST PARTLY IN THERMOPLASTIC MATERIAL FOAM, OBJECTS THUS REALIZED AND DEVICE FOR THE IMPLEMENTATION OF THIS PROCESS

Info

Publication number
FR2379370A1
FR2379370A1 FR7803221A FR7803221A FR2379370A1 FR 2379370 A1 FR2379370 A1 FR 2379370A1 FR 7803221 A FR7803221 A FR 7803221A FR 7803221 A FR7803221 A FR 7803221A FR 2379370 A1 FR2379370 A1 FR 2379370A1
Authority
FR
France
Prior art keywords
objects
mold
thermoplastic material
mixture
realization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
FR7803221A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2379370A1 publication Critical patent/FR2379370A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/0408—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
    • C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C2045/0475—Injection moulding apparatus using movable moulds or mould halves continuously movable moulds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/04—Polysulfides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Molding Of Porous Articles (AREA)

Abstract

Procédé et dispositif pour la réalisation d'objets au moins partiellement en mousse de matériau thermoplastique, selon lequel un mélange de matériau thermoplastique à expanser et d'un agent moussant est porté, dans un dispositif de mélange et de moulage, à une température et sous une pression telles que le mélange se liquéfie, mélange qui est pressé ensuite dans la cavité de moulage par l'intermédiaire d'un orifice d'écoulement raccordé de façon directe à au moins un orifice de remplissage situé dans le même plan du moule. Le moule et l'orifice d'écoulement sont ensuite déplacés, l'un par rapport à l'autre, parallèlement au plan dans lequel se situe l'orifice d'écoulement. Vu dans la direction du déplacement, le moule est muni à l'avant et l'arrière des orifices de remplissage de surfaces qui sont glissées, pendant le déplacement du moule au ras de l'ouverture d'écoulement de façon à couper le courant de matériau. Application : moulage de composants électroniques.Method and device for producing objects at least partially made of foam of thermoplastic material, according to which a mixture of thermoplastic material to be expanded and of a foaming agent is brought, in a mixing and molding device, to a temperature and under a pressure such that the mixture liquefies, which mixture is then pressed into the mold cavity by means of a flow orifice directly connected to at least one filling orifice situated in the same plane of the mold. The mold and the flow orifice are then moved, relative to each other, parallel to the plane in which the flow orifice is located. Seen in the direction of travel, the mold is provided at the front and rear with filling holes with surfaces which are slid, during the movement of the mold flush with the flow opening so as to cut off the current of material. Application: molding of electronic components.

FR7803221A 1977-02-08 1978-02-06 PROCESS FOR THE REALIZATION OF OBJECTS AT LEAST PARTLY IN THERMOPLASTIC MATERIAL FOAM, OBJECTS THUS REALIZED AND DEVICE FOR THE IMPLEMENTATION OF THIS PROCESS Pending FR2379370A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7701283A NL7701283A (en) 1977-02-08 1977-02-08 PROCESS FOR THE MANUFACTURE OF WHOLLY OR PARTLY OF FOAMED THERMOPLASTIC MATERIALS, OBJECTS MANUFACTURED IN ACCORDANCE WITH THIS PROCEDURE AND DEVICE FOR PERFORMING THE PROCEDURE.

Publications (1)

Publication Number Publication Date
FR2379370A1 true FR2379370A1 (en) 1978-09-01

Family

ID=19827940

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7803221A Pending FR2379370A1 (en) 1977-02-08 1978-02-06 PROCESS FOR THE REALIZATION OF OBJECTS AT LEAST PARTLY IN THERMOPLASTIC MATERIAL FOAM, OBJECTS THUS REALIZED AND DEVICE FOR THE IMPLEMENTATION OF THIS PROCESS

Country Status (14)

Country Link
JP (1) JPS5398368A (en)
AR (1) AR216935A1 (en)
AU (1) AU3303978A (en)
BE (1) BE863694A (en)
BR (1) BR7800707A (en)
CH (1) CH626565A5 (en)
DE (1) DE2803571A1 (en)
ES (2) ES466674A1 (en)
FR (1) FR2379370A1 (en)
GB (1) GB1600427A (en)
IN (1) IN147437B (en)
IT (1) IT1092397B (en)
NL (1) NL7701283A (en)
SE (1) SE7801324L (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2545653A1 (en) * 1983-05-04 1984-11-09 Pichot Michel Method and device for encapsulating integrated circuits
EP0406634A1 (en) * 1989-07-05 1991-01-09 Bayer Ag Process for the preparation of high temperature resistant foams of polyarylensulphides for thermoplastic injection molding processes

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2545653A1 (en) * 1983-05-04 1984-11-09 Pichot Michel Method and device for encapsulating integrated circuits
EP0406634A1 (en) * 1989-07-05 1991-01-09 Bayer Ag Process for the preparation of high temperature resistant foams of polyarylensulphides for thermoplastic injection molding processes
US5114983A (en) * 1989-07-05 1992-05-19 Bayer Aktiengesellschaft Use of polyarylene sulphides for the production of a structural foam resistant to high temperatures, process for the preparation of this foam, and moldings obtainable by this process
US5126380A (en) * 1989-07-05 1992-06-30 Stahlke Kurt Rainer Use of polyarylene sulphides for the production of a structural foam resistant to high temperatures, process for the preparation of this foam, and mouldings obtainable by this process

Also Published As

Publication number Publication date
CH626565A5 (en) 1981-11-30
ES470079A1 (en) 1979-02-01
ES466674A1 (en) 1978-10-16
BR7800707A (en) 1978-10-03
AR216935A1 (en) 1980-02-15
BE863694A (en) 1978-08-07
SE7801324L (en) 1978-08-09
DE2803571A1 (en) 1978-08-10
JPS5398368A (en) 1978-08-28
AU3303978A (en) 1979-08-16
IT7819996A0 (en) 1978-02-03
GB1600427A (en) 1981-10-14
NL7701283A (en) 1978-08-10
IT1092397B (en) 1985-07-12
IN147437B (en) 1980-02-23

Similar Documents

Publication Publication Date Title
BE902657A (en) MACHINE FOR THE MANUFACTURE OF MOLDED ARTICLES OF PLASTIC MATERIAL, PARTICULARLY HELMETS FOR MOTORCYCLISTS.
ZA81433B (en) Injection moulding die with heavy-duty sprue bush
DE3276539D1 (en) Method for making thixotropic materials
ES439232A1 (en) Process for producing molded structural foam article having a surface that reproducibly and faithfully replicates the surface of the mold
FR2425317A2 (en) INJECTION MOLDING PROCESS OF PARTS IN PLASTIC MATERIAL
BE901682A (en) PROCESS FOR THE MANUFACTURE OF PLASTIC FOAM MOLDED PARTS.
FR2379370A1 (en) PROCESS FOR THE REALIZATION OF OBJECTS AT LEAST PARTLY IN THERMOPLASTIC MATERIAL FOAM, OBJECTS THUS REALIZED AND DEVICE FOR THE IMPLEMENTATION OF THIS PROCESS
US3086245A (en) Mold for making an indicia-bearing article
SE7700622L (en) KITS AND APPLIANCES FOR THE MANUFACTURE OF BLIXTLAS
JPS55139240A (en) Resin molding method
FR2392794A1 (en) PROCESS AND MOLD FOR FORMING PLATES WITH EXPECTED SURFACE FAULTS
KR920700806A (en) Molding production process and apparatus
CA2354332A1 (en) Method of attaching mold releasing agent to molding die, molding apparatus and molding die
SU703354A2 (en) Apparatus for continuous making of articles from forming materials
US702194A (en) Casting apparatus.
JPS56118832A (en) Injection molding of perforated product
JPS55117303A (en) Curved surface panel
JPS6430724A (en) Mold assembly of resin
JPS63107531A (en) Injection molding equipment
JPS5782060A (en) Method and apparatus for molding guide member
JPS5516712A (en) Apparatus for producing metallic mold cast product
JPS55100133A (en) Manufacture of polystyrene beads foam-formed body
JPH0644105Y2 (en) Lead frame of resin mold type semiconductor device
GB2123327A (en) Production of sand moulds
JPS57106444A (en) Quick freezing method for frozen mold