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FR2251984A1 - Insulation of circuit links through printed circuit boards - by simultaneous moulding of insulating plugs in all holes - Google Patents

Insulation of circuit links through printed circuit boards - by simultaneous moulding of insulating plugs in all holes

Info

Publication number
FR2251984A1
FR2251984A1 FR7438275A FR7438275A FR2251984A1 FR 2251984 A1 FR2251984 A1 FR 2251984A1 FR 7438275 A FR7438275 A FR 7438275A FR 7438275 A FR7438275 A FR 7438275A FR 2251984 A1 FR2251984 A1 FR 2251984A1
Authority
FR
France
Prior art keywords
holes
boards
drilling
insulating
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7438275A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Litton Industries Inc
Original Assignee
Litton Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Litton Industries Inc filed Critical Litton Industries Inc
Publication of FR2251984A1 publication Critical patent/FR2251984A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Printed circuit boards incorporating >=1 internal layer of metal sheet or foil to assist heat dissipation, where the layer is isolated electrically from circuit jump leads passing through the board by drilling the required pattern of connections as oversize holes, simultaneously filling all holes with insulating resin which is fused in a common moulding cycle, and subsequently drilling through the middle of the insulating plugs to allow conductive links to be established between opposite faces of the board. For mfr. of boards with surface circuits obtained either by chemical etching or by localised deposition of metals. Esp. for boards with cores of anodisd aluminium sheet sandwiched between layers of epoxy resin reinforced with glass fibres. Simultaneous plugging and subsequent jig drilling of all connection holes is quicker and cheaper than lining individual holes with prefabricated insulating grommets and does not locally increase board thickness.
FR7438275A 1973-11-21 1974-11-21 Insulation of circuit links through printed circuit boards - by simultaneous moulding of insulating plugs in all holes Withdrawn FR2251984A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US41810573A 1973-11-21 1973-11-21

Publications (1)

Publication Number Publication Date
FR2251984A1 true FR2251984A1 (en) 1975-06-13

Family

ID=23656731

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7438275A Withdrawn FR2251984A1 (en) 1973-11-21 1974-11-21 Insulation of circuit links through printed circuit boards - by simultaneous moulding of insulating plugs in all holes

Country Status (6)

Country Link
JP (1) JPS5083757A (en)
BE (1) BE822462A (en)
DE (1) DE2453788A1 (en)
FR (1) FR2251984A1 (en)
NL (1) NL7415185A (en)
NO (1) NO744158L (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2558328A1 (en) * 1984-01-17 1985-07-19 O Key Printed Wiring Co Ltd PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
EP0260483A2 (en) * 1986-09-16 1988-03-23 Kollmorgen Corporation Circuit board with a sheet-like metallic core, and method of making it
EP0351034A2 (en) * 1988-07-15 1990-01-17 Hitachi Chemical Co., Ltd. Process and film for producing printed wiring boards
EP0528311A2 (en) * 1991-08-19 1993-02-24 Spectrolab, Inc. Electrical feedthrough structure and fabrication method
EP1111971A1 (en) * 1999-06-21 2001-06-27 Mitsubishi Denki Kabushiki Kaisha Method for producing circuit-forming board, circuit-forming board, and carbon sheet

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336666A (en) * 1976-09-17 1978-04-05 Fujitsu Ltd Method of producing composite substrate
JPS5350970A (en) * 1976-10-21 1978-05-09 Fujitsu Ltd Patterning method for fluorescent substance of plasma display panel
JPS5365966A (en) * 1976-11-25 1978-06-12 Fujitsu Ltd Method of producing shielding layer contained multilayer printed board
JPS5413968A (en) * 1977-07-04 1979-02-01 Fujitsu Ltd Method of manufacturing wiring board
JPS6055316B2 (en) * 1977-11-08 1985-12-04 日立化成工業株式会社 Manufacturing method of thermal recording head
JPS5472462A (en) * 1977-11-22 1979-06-09 Hitachi Chemical Co Ltd Preparation of substrate for metallic core print plug board
JPS54150677A (en) * 1978-05-19 1979-11-27 Hitachi Ltd Method of producing metal coreereinforced copperrwired circuit board
JPS5784766U (en) * 1980-11-13 1982-05-25
DE3517796A1 (en) * 1985-05-17 1986-11-20 Hoechst Ag, 6230 Frankfurt METHOD FOR PRODUCING ELECTRICALLY INSULATING BASE MATERIAL FOR THE PRODUCTION OF CONTACTED CIRCUIT BOARDS
EP0373363A3 (en) * 1988-12-15 1991-09-11 International Business Machines Corporation Filling of vias in a metallic plane
US5487218A (en) * 1994-11-21 1996-01-30 International Business Machines Corporation Method for making printed circuit boards with selectivity filled plated through holes
CN107548244B (en) * 2017-08-30 2020-02-28 景旺电子科技(龙川)有限公司 Manufacturing method for insulation between copper bases in double-sided sandwich copper substrate

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2558328A1 (en) * 1984-01-17 1985-07-19 O Key Printed Wiring Co Ltd PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
EP0260483A2 (en) * 1986-09-16 1988-03-23 Kollmorgen Corporation Circuit board with a sheet-like metallic core, and method of making it
EP0260483A3 (en) * 1986-09-16 1988-07-20 Kollmorgen Corporation Circuit board with a sheet-like metallic core, and method of making it
EP0351034A2 (en) * 1988-07-15 1990-01-17 Hitachi Chemical Co., Ltd. Process and film for producing printed wiring boards
EP0351034A3 (en) * 1988-07-15 1990-03-21 Hitachi Chemical Co., Ltd. Process for producing printed wiring boards
EP0528311A2 (en) * 1991-08-19 1993-02-24 Spectrolab, Inc. Electrical feedthrough structure and fabrication method
EP0528311A3 (en) * 1991-08-19 1993-03-03 Spectrolab, Inc. Electrical feedthrough structure and fabrication method
US5425816A (en) * 1991-08-19 1995-06-20 Spectrolab, Inc. Electrical feedthrough structure and fabrication method
EP1111971A1 (en) * 1999-06-21 2001-06-27 Mitsubishi Denki Kabushiki Kaisha Method for producing circuit-forming board, circuit-forming board, and carbon sheet
EP1111971A4 (en) * 1999-06-21 2006-03-22 Mitsubishi Electric Corp Method for producing circuit-forming board, circuit-forming board, and carbon sheet

Also Published As

Publication number Publication date
NO744158L (en) 1975-06-16
DE2453788A1 (en) 1975-05-22
NL7415185A (en) 1975-05-23
JPS5083757A (en) 1975-07-07
BE822462A (en) 1975-03-14

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Legal Events

Date Code Title Description
ST Notification of lapse