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FR2046933A1 - - Google Patents

Info

Publication number
FR2046933A1
FR2046933A1 FR7020961A FR7020961A FR2046933A1 FR 2046933 A1 FR2046933 A1 FR 2046933A1 FR 7020961 A FR7020961 A FR 7020961A FR 7020961 A FR7020961 A FR 7020961A FR 2046933 A1 FR2046933 A1 FR 2046933A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7020961A
Other languages
French (fr)
Other versions
FR2046933B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of FR2046933A1 publication Critical patent/FR2046933A1/fr
Application granted granted Critical
Publication of FR2046933B1 publication Critical patent/FR2046933B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)
FR7020961A 1969-06-20 1970-06-08 Expired FR2046933B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691931245 DE1931245A1 (en) 1969-06-20 1969-06-20 Process for dividing Mg-Al spinel substrate disks coated with semiconductor material and provided with components

Publications (2)

Publication Number Publication Date
FR2046933A1 true FR2046933A1 (en) 1971-03-12
FR2046933B1 FR2046933B1 (en) 1974-09-20

Family

ID=5737496

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7020961A Expired FR2046933B1 (en) 1969-06-20 1970-06-08

Country Status (8)

Country Link
JP (1) JPS4827491B1 (en)
AT (1) AT317301B (en)
CH (1) CH507589A (en)
DE (1) DE1931245A1 (en)
FR (1) FR2046933B1 (en)
GB (1) GB1313003A (en)
NL (1) NL7006367A (en)
SE (1) SE351522B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0402230A1 (en) * 1989-06-07 1990-12-12 Commissariat A L'energie Atomique Process and device for marking and cleaving mono-crystalline semiconductor wafers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169837A (en) * 1963-07-31 1965-02-16 Int Rectifier Corp Method of dicing semiconductor wafers
FR1514985A (en) * 1965-08-27 1968-03-01 Philips Nv Process for separating electrical components formed on the same support
FR1566090A (en) * 1967-05-29 1969-05-02

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169837A (en) * 1963-07-31 1965-02-16 Int Rectifier Corp Method of dicing semiconductor wafers
FR1514985A (en) * 1965-08-27 1968-03-01 Philips Nv Process for separating electrical components formed on the same support
FR1566090A (en) * 1967-05-29 1969-05-02

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0402230A1 (en) * 1989-06-07 1990-12-12 Commissariat A L'energie Atomique Process and device for marking and cleaving mono-crystalline semiconductor wafers
FR2648274A1 (en) * 1989-06-07 1990-12-14 Commissariat Energie Atomique METHOD AND DEVICE FOR LABELING AND DIVIDING WAFERS OF SINGLE-CRYSTAL SEMICONDUCTOR MATERIALS
US5174188A (en) * 1989-06-07 1992-12-29 Commissariat A L'energie Atomique Process and device for marking and cleaving plaquettes of monocrystalline semiconductor materials

Also Published As

Publication number Publication date
CH507589A (en) 1971-05-15
AT317301B (en) 1974-08-26
JPS4827491B1 (en) 1973-08-23
GB1313003A (en) 1973-04-11
SE351522B (en) 1972-11-27
FR2046933B1 (en) 1974-09-20
DE1931245A1 (en) 1971-07-08
NL7006367A (en) 1970-12-22

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Legal Events

Date Code Title Description
ST Notification of lapse