FR1599998A - - Google Patents
Info
- Publication number
- FR1599998A FR1599998A FR1599998DA FR1599998A FR 1599998 A FR1599998 A FR 1599998A FR 1599998D A FR1599998D A FR 1599998DA FR 1599998 A FR1599998 A FR 1599998A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/02—Contacts, special
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Die Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP467 | 1967-12-28 | ||
| JP468 | 1967-12-28 | ||
| JP46867 | 1967-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1599998A true FR1599998A (fr) | 1970-07-20 |
Family
ID=27274263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1599998D Expired FR1599998A (fr) | 1967-12-28 | 1968-12-27 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3591838A (fr) |
| DE (1) | DE1816748C3 (fr) |
| FR (1) | FR1599998A (fr) |
| GB (1) | GB1258580A (fr) |
| NL (1) | NL151845B (fr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3909319A (en) * | 1971-02-23 | 1975-09-30 | Shohei Fujiwara | Planar structure semiconductor device and method of making the same |
| JPS5950212B2 (ja) * | 1978-07-28 | 1984-12-07 | 富士電機株式会社 | 半導体素子の電極の製造方法 |
| US5422513A (en) * | 1992-10-16 | 1995-06-06 | Martin Marietta Corporation | Integrated circuit chip placement in a high density interconnect structure |
| JPH10509025A (ja) * | 1994-08-26 | 1998-09-08 | アイジェン， インコーポレイテッド | 固体表面に吸着された核酸の電気的に発生した化学ルミネッセンス性検出のためのバイオセンサーおよび方法 |
| WO1997030480A1 (fr) * | 1996-02-16 | 1997-08-21 | Alliedsignal Inc. | Conducteur a couche mince de faible resistivite pour equipement electronique a circuit integre haute temperature |
| US6150262A (en) * | 1996-03-27 | 2000-11-21 | Texas Instruments Incorporated | Silver-gold wire for wire bonding |
| US6873020B2 (en) * | 2002-02-22 | 2005-03-29 | North Carolina State University | High/low work function metal alloys for integrated circuit electrodes |
| JP7271166B2 (ja) * | 2018-12-21 | 2023-05-11 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL298258A (fr) * | 1962-05-25 | 1900-01-01 | ||
| NL297607A (fr) * | 1962-09-07 | |||
| US3432913A (en) * | 1962-12-26 | 1969-03-18 | Philips Corp | Method of joining a semi-conductor to a base |
| US3324357A (en) * | 1964-01-29 | 1967-06-06 | Int Standard Electric Corp | Multi-terminal semiconductor device having active element directly mounted on terminal leads |
-
1968
- 1968-12-17 GB GB1258580D patent/GB1258580A/en not_active Expired
- 1968-12-23 DE DE1816748A patent/DE1816748C3/de not_active Expired
- 1968-12-23 US US786005A patent/US3591838A/en not_active Expired - Lifetime
- 1968-12-27 NL NL686818715A patent/NL151845B/xx not_active IP Right Cessation
- 1968-12-27 FR FR1599998D patent/FR1599998A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL151845B (nl) | 1976-12-15 |
| NL6818715A (fr) | 1969-07-01 |
| US3591838A (en) | 1971-07-06 |
| GB1258580A (fr) | 1971-12-30 |
| DE1816748C3 (de) | 1979-02-22 |
| DE1816748A1 (de) | 1969-07-24 |
| DE1816748B2 (de) | 1972-01-27 |