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FR1442535A - Selective etching process for silicon - Google Patents

Selective etching process for silicon

Info

Publication number
FR1442535A
FR1442535A FR16295A FR16295A FR1442535A FR 1442535 A FR1442535 A FR 1442535A FR 16295 A FR16295 A FR 16295A FR 16295 A FR16295 A FR 16295A FR 1442535 A FR1442535 A FR 1442535A
Authority
FR
France
Prior art keywords
silicon
etching process
selective etching
selective
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR16295A
Other languages
French (fr)
Inventor
Francois Kover
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Original Assignee
Compagnie Generale dElectricite SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Generale dElectricite SA filed Critical Compagnie Generale dElectricite SA
Priority to FR16295A priority Critical patent/FR1442535A/en
Priority to CH563866A priority patent/CH450856A/en
Priority to BE679812D priority patent/BE679812A/xx
Priority to LU50965A priority patent/LU50965A1/xx
Priority to NL6605960A priority patent/NL6605960A/xx
Priority to DE19661496764 priority patent/DE1496764A1/en
Priority to GB2029266A priority patent/GB1145876A/en
Application granted granted Critical
Publication of FR1442535A publication Critical patent/FR1442535A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
    • C25F1/02—Pickling; Descaling
    • C25F1/12—Pickling; Descaling in melts
    • C25F1/14—Iron or steel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3063—Electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Weting (AREA)
FR16295A 1965-05-07 1965-05-07 Selective etching process for silicon Expired FR1442535A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR16295A FR1442535A (en) 1965-05-07 1965-05-07 Selective etching process for silicon
CH563866A CH450856A (en) 1965-05-07 1966-04-18 Selective etching process for silicon
BE679812D BE679812A (en) 1965-05-07 1966-04-21
LU50965A LU50965A1 (en) 1965-05-07 1966-04-25
NL6605960A NL6605960A (en) 1965-05-07 1966-05-03
DE19661496764 DE1496764A1 (en) 1965-05-07 1966-05-04 Process for the selective etching of silicon
GB2029266A GB1145876A (en) 1965-05-07 1966-05-06 Method of electrochemically etching silicon

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR16295A FR1442535A (en) 1965-05-07 1965-05-07 Selective etching process for silicon

Publications (1)

Publication Number Publication Date
FR1442535A true FR1442535A (en) 1966-06-17

Family

ID=8578284

Family Applications (1)

Application Number Title Priority Date Filing Date
FR16295A Expired FR1442535A (en) 1965-05-07 1965-05-07 Selective etching process for silicon

Country Status (7)

Country Link
BE (1) BE679812A (en)
CH (1) CH450856A (en)
DE (1) DE1496764A1 (en)
FR (1) FR1442535A (en)
GB (1) GB1145876A (en)
LU (1) LU50965A1 (en)
NL (1) NL6605960A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9184364B2 (en) 2005-03-02 2015-11-10 Rosemount Inc. Pipeline thermoelectric generator assembly
TWI406971B (en) * 2005-10-28 2013-09-01 Kanto Kagaku Palladium selective etching solution and method of controlling etching selectivity

Also Published As

Publication number Publication date
DE1496764A1 (en) 1969-04-10
BE679812A (en) 1966-10-21
CH450856A (en) 1968-04-30
GB1145876A (en) 1969-03-19
LU50965A1 (en) 1966-10-25
NL6605960A (en) 1966-11-08

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