FR1231538A - Procédé pour la fabrication de dispositifs semi-conducteurs avec électrodes contenant de l'aluminium - Google Patents
Procédé pour la fabrication de dispositifs semi-conducteurs avec électrodes contenant de l'aluminiumInfo
- Publication number
- FR1231538A FR1231538A FR801644A FR801644A FR1231538A FR 1231538 A FR1231538 A FR 1231538A FR 801644 A FR801644 A FR 801644A FR 801644 A FR801644 A FR 801644A FR 1231538 A FR1231538 A FR 1231538A
- Authority
- FR
- France
- Prior art keywords
- manufacture
- semiconductor devices
- containing aluminum
- electrodes containing
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title 1
- 229910052782 aluminium Inorganic materials 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/914—Doping
- Y10S438/915—Amphoteric doping
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Processing (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL230165 | 1958-08-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1231538A true FR1231538A (fr) | 1960-09-29 |
Family
ID=19751298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR801644A Expired FR1231538A (fr) | 1958-08-01 | 1959-07-31 | Procédé pour la fabrication de dispositifs semi-conducteurs avec électrodes contenant de l'aluminium |
Country Status (6)
Country | Link |
---|---|
US (1) | US3181226A (de) |
CH (1) | CH374428A (de) |
DE (1) | DE1103468B (de) |
FR (1) | FR1231538A (de) |
GB (1) | GB926482A (de) |
NL (2) | NL230165A (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3154437A (en) * | 1961-01-17 | 1964-10-27 | Philco Corp | Method for introducing an activator impurity substance into a portion of a body of crystalline semiconductive material and for bonding a lead member to said portion |
DE1180852B (de) * | 1961-10-09 | 1964-11-05 | Siemens Ag | Verfahren zur Herstellung von Halbleiter-anordnungen mit wenigstens einem durch Legieren erzeugten pn-UEbergang |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6108164B2 (ja) * | 2012-11-07 | 2017-04-05 | 日本電産株式会社 | 半田接合構造および半田接合方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT181629B (de) * | 1950-09-14 | 1955-04-12 | Western Electric Co | Einrichtung zur Signalumsetzung mit einem Körper aus halbleitendem Material und Verfahren zur Herstellung derselben |
BE532794A (de) * | 1953-10-26 | |||
US2918719A (en) * | 1953-12-30 | 1959-12-29 | Rca Corp | Semi-conductor devices and methods of making them |
BE537167A (de) * | 1954-04-07 | |||
US2788432A (en) * | 1955-05-19 | 1957-04-09 | Hughes Aircraft Co | Continuous fusion furnace |
US2909715A (en) * | 1955-05-23 | 1959-10-20 | Texas Instruments Inc | Base contacts for transistors |
US2833678A (en) * | 1955-09-27 | 1958-05-06 | Rca Corp | Methods of surface alloying with aluminum-containing solder |
US2862840A (en) * | 1956-09-26 | 1958-12-02 | Gen Electric | Semiconductor devices |
DE1073110B (de) * | 1957-08-16 | 1960-01-14 | General Electric Company, Schenectady, N Y (V St A) | Verfahren zur Herstellung gleichrichtender oder ohmscher Anschlußkontakte an Siliziumkarbidkorpern |
NL113333C (de) * | 1957-09-19 | |||
US2947925A (en) * | 1958-02-21 | 1960-08-02 | Motorola Inc | Transistor and method of making the same |
-
0
- NL NL110945D patent/NL110945C/xx active
- NL NL230165D patent/NL230165A/xx unknown
-
1959
- 1959-06-26 US US823037A patent/US3181226A/en not_active Expired - Lifetime
- 1959-07-28 DE DEN17029A patent/DE1103468B/de active Pending
- 1959-07-29 CH CH7635059A patent/CH374428A/de unknown
- 1959-07-29 GB GB26025/59A patent/GB926482A/en not_active Expired
- 1959-07-31 FR FR801644A patent/FR1231538A/fr not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3154437A (en) * | 1961-01-17 | 1964-10-27 | Philco Corp | Method for introducing an activator impurity substance into a portion of a body of crystalline semiconductive material and for bonding a lead member to said portion |
DE1180852B (de) * | 1961-10-09 | 1964-11-05 | Siemens Ag | Verfahren zur Herstellung von Halbleiter-anordnungen mit wenigstens einem durch Legieren erzeugten pn-UEbergang |
Also Published As
Publication number | Publication date |
---|---|
NL230165A (de) | 1900-01-01 |
DE1103468B (de) | 1961-03-30 |
CH374428A (de) | 1964-01-15 |
NL110945C (de) | 1900-01-01 |
GB926482A (en) | 1963-05-22 |
US3181226A (en) | 1965-05-04 |
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