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FR1118229A - Cooling system for electrical devices - Google Patents

Cooling system for electrical devices

Info

Publication number
FR1118229A
FR1118229A FR1118229DA FR1118229A FR 1118229 A FR1118229 A FR 1118229A FR 1118229D A FR1118229D A FR 1118229DA FR 1118229 A FR1118229 A FR 1118229A
Authority
FR
France
Prior art keywords
cooling system
electrical devices
electrical
devices
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Francaise Thomson Houston SA
Original Assignee
Compagnie Francaise Thomson Houston SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Francaise Thomson Houston SA filed Critical Compagnie Francaise Thomson Houston SA
Application granted granted Critical
Publication of FR1118229A publication Critical patent/FR1118229A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
FR1118229D 1954-01-26 1955-01-25 Cooling system for electrical devices Expired FR1118229A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1118229XA 1954-01-26 1954-01-26

Publications (1)

Publication Number Publication Date
FR1118229A true FR1118229A (en) 1956-06-01

Family

ID=22340622

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1118229D Expired FR1118229A (en) 1954-01-26 1955-01-25 Cooling system for electrical devices

Country Status (1)

Country Link
FR (1) FR1118229A (en)

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