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FI955477A0 - Automatisoitu tiivisteen kiinnityslaite ja menetelmä sen käyttämiseksi - Google Patents

Automatisoitu tiivisteen kiinnityslaite ja menetelmä sen käyttämiseksi

Info

Publication number
FI955477A0
FI955477A0 FI955477A FI955477A FI955477A0 FI 955477 A0 FI955477 A0 FI 955477A0 FI 955477 A FI955477 A FI 955477A FI 955477 A FI955477 A FI 955477A FI 955477 A0 FI955477 A0 FI 955477A0
Authority
FI
Finland
Prior art keywords
attachment device
seal attachment
automated seal
automated
seal
Prior art date
Application number
FI955477A
Other languages
English (en)
Swedish (sv)
Other versions
FI955477L (fi
Inventor
Brandley E Reis
Allan D Pincus
William G Lytle
Robert C Rudolph
Charles R Geese
Keith D Adkins
Original Assignee
Gore & Ass
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gore & Ass filed Critical Gore & Ass
Publication of FI955477A0 publication Critical patent/FI955477A0/fi
Publication of FI955477L publication Critical patent/FI955477L/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y10T156/1077—Applying plural cut laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Coating Apparatus (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
FI955477A 1994-03-18 1995-11-14 Automatisoitu tiivisteen kiinnityslaite ja menetelmä sen käyttämiseksi FI955477L (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/215,124 US5536342A (en) 1994-03-18 1994-03-18 Automated gasket applicator and method of using same
PCT/US1994/014645 WO1995026126A1 (en) 1994-03-18 1994-12-13 Automated gasket applicator and method of using same

Publications (2)

Publication Number Publication Date
FI955477A0 true FI955477A0 (fi) 1995-11-14
FI955477L FI955477L (fi) 1995-11-14

Family

ID=22801762

Family Applications (1)

Application Number Title Priority Date Filing Date
FI955477A FI955477L (fi) 1994-03-18 1995-11-14 Automatisoitu tiivisteen kiinnityslaite ja menetelmä sen käyttämiseksi

Country Status (8)

Country Link
US (1) US5536342A (fi)
EP (1) EP0699376A1 (fi)
JP (1) JPH08510711A (fi)
KR (1) KR960702729A (fi)
AU (1) AU673119B2 (fi)
CA (1) CA2159502A1 (fi)
FI (1) FI955477L (fi)
WO (1) WO1995026126A1 (fi)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5660380A (en) * 1995-08-15 1997-08-26 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials
US5779830A (en) * 1995-10-24 1998-07-14 Truseal Technologies, Inc. Flexible tape applicator and method of operation
US6358212B1 (en) 1998-04-20 2002-03-19 Matsushita Electric Industrial Co., Ltd. Noninvasive continuous blood pressure measuring apparatus and a method of noninvasively measuring continuous blood pressure
KR100542567B1 (ko) * 1999-02-01 2006-01-11 삼성전자주식회사 가스켓 접착 보호지 분리장치 및 이 장치를 이용한 분리방법
US6615890B1 (en) * 2000-06-09 2003-09-09 Venture Tape Corp. Tape applicator for glazing applications
US6773537B2 (en) * 2001-01-12 2004-08-10 3M Innovative Properties Company Method for applying designs to a substrate
US20050016671A1 (en) * 2001-03-05 2005-01-27 Sharp Terrance M. Robotic tape applicator and method
US7093641B2 (en) * 2001-03-05 2006-08-22 Henkel Corporation Robotic tape applicator and method
US6634401B2 (en) * 2001-09-27 2003-10-21 3M Innovative Properties Company Tape applicator and methods of applying tape to a surface
US20030109946A1 (en) * 2001-12-10 2003-06-12 Erickson Leif O. Computer-aided layout and application of tape
US7093642B2 (en) * 2002-03-05 2006-08-22 Henkel Corporation Systems and methods for a robotic tape applicator
US20040042789A1 (en) * 2002-08-30 2004-03-04 Celanese Ventures Gmbh Method and apparatus for transferring thin films from a source position to a target position
US7001686B2 (en) * 2002-09-27 2006-02-21 Delphi Technologies, Inc. Process for forming an integral gasket on a bipolar plate for a PEM fuel cell
US7016262B2 (en) * 2003-09-11 2006-03-21 General Phosphorix, Llc Seismic sensor
KR100620972B1 (ko) * 2004-06-14 2006-09-08 (주)메인일렉콤 도전성 폼 가스켓의 제조방법 및 이의 방법으로 제조된도전성 폼 가스켓
US20060022081A1 (en) * 2004-07-30 2006-02-02 Pemeas Gmbh Cartridge and method for handling thin film membranes
US7374625B2 (en) * 2004-08-13 2008-05-20 Henkel Corporation Systems and methods for a robotic tape applicator
JP4491823B2 (ja) * 2006-03-17 2010-06-30 日本ジッパーチュービング株式会社 電磁波シールドガスケットの製造方法
EP2548828A1 (de) * 2011-07-20 2013-01-23 Mikron Berlin GmbH Vorrichtung und Verfahren zum positionsgenauen Belegen eines ebenen Flächenelementes mit einem ein Abdeckband aufweisenden doppelseitigen Klebeband
EP3287673B1 (en) * 2015-04-24 2021-05-05 NOK Corporation Gasket molding and manufacturing method therefor
US10626993B2 (en) * 2015-06-04 2020-04-21 Nok Corporation Gasket and method of manufacturing the same
JP6795349B2 (ja) * 2015-11-10 2020-12-02 Nok株式会社 キャリアフィルム付きガスケットの取り扱い方法
DE102015224188B4 (de) * 2015-12-03 2020-03-05 Airbus Operations Gmbh Dichtungsapplikationsvorrichtung und Verfahren für das Abdichten eines Vakuumaufbaus bei der Herstellung eines faserverstärkten Bauteils
CN105936361B (zh) * 2016-07-19 2019-02-12 国网山东省电力公司威海供电公司 一种安全警示线胶带粘贴装置
KR102454256B1 (ko) * 2018-02-22 2022-10-17 삼성디스플레이 주식회사 기판 절단 장치
KR102374368B1 (ko) * 2021-09-14 2022-03-15 (주)에이이엠테크 테이프 자동공급 장치

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4255218A (en) * 1979-02-28 1981-03-10 Minnesota Mining And Manufacturing Company Method and apparatus for applying adhesive strip
US4448626A (en) * 1980-07-21 1984-05-15 Haggar Company Method and apparatus for applying a welt to a garment panel
US4591402A (en) * 1981-06-22 1986-05-27 Ltv Aerospace And Defense Company Apparatus and method for manufacturing composite structures
US4588466A (en) * 1983-04-08 1986-05-13 Vektronics Manufacturing, Inc. Tape laying method and apparatus
JPS602570A (ja) * 1983-06-20 1985-01-08 Dainippon Printing Co Ltd 両面接着テ−プ自動貼着装置
US4548493A (en) * 1984-04-10 1985-10-22 Mayfield William C Mask transference and alignment apparatus
US4557790A (en) * 1984-07-12 1985-12-10 Cincinnati Milacron Inc. Tape laminator
DE3500924A1 (de) * 1985-01-12 1986-07-17 Henkel KGaA, 4000 Düsseldorf Plastische dichtung und verfahren zum herstellen der dichtung
US4759810A (en) * 1987-05-01 1988-07-26 Libbey-Owens-Ford Co. Method and apparatus for applying a gasket to an object
FR2623745B1 (fr) * 1987-11-26 1990-05-11 Valois Procede de fabrication de joints souples resistant aux agents chimiques et joints ainsi obtenus
JPH01281247A (ja) * 1988-05-07 1989-11-13 Shin Nippon Koki Kk テープの自動貼付装置におけるテープの張力制御装置
JPH0776068B2 (ja) * 1988-05-18 1995-08-16 新日本工機株式会社 テープの自動貼付装置
CA2016769A1 (en) * 1989-05-24 1990-11-24 Charles F. Lang Composite emi shield having clean, highly conductive surfaces for conductive bonding
US4978417A (en) * 1989-07-17 1990-12-18 Cincinnati Milacron Inc. Composite tape laying machine having scrap removal and method
US5106450A (en) * 1990-12-20 1992-04-21 International Business Machines Corporation Dry film resist transport and lamination system for semiconductor wafers
US5261996A (en) * 1991-01-25 1993-11-16 Minnesota Mining And Manufacturing Company Guiding system for a vacuum wheel applicator
AU672499B2 (en) * 1993-06-14 1996-10-03 Emi-Tec Elektronische Materialien Gmbh A process for producing a casing providing a screen against electromagnetic radiation
DE4319965C3 (de) * 1993-06-14 2000-09-14 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung

Also Published As

Publication number Publication date
JPH08510711A (ja) 1996-11-12
WO1995026126A1 (en) 1995-09-28
AU673119B2 (en) 1996-10-24
FI955477L (fi) 1995-11-14
AU1553195A (en) 1995-10-09
KR960702729A (ko) 1996-04-27
CA2159502A1 (en) 1995-09-28
EP0699376A1 (en) 1996-03-06
US5536342A (en) 1996-07-16

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