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FI885350A - Mjukloedbart tunnskikt i en- eller flerskiktig metallisering. - Google Patents

Mjukloedbart tunnskikt i en- eller flerskiktig metallisering. Download PDF

Info

Publication number
FI885350A
FI885350A FI885350A FI885350A FI885350A FI 885350 A FI885350 A FI 885350A FI 885350 A FI885350 A FI 885350A FI 885350 A FI885350 A FI 885350A FI 885350 A FI885350 A FI 885350A
Authority
FI
Finland
Prior art keywords
tunnskikt
mjukloedbart
metallisering
flerskiktig
eller
Prior art date
Application number
FI885350A
Other languages
English (en)
Other versions
FI885350A0 (fi
Inventor
Wilfried Hinueber
Joachim Schumann
Armin Heinrich
Bernd Mueller
Wolfgang Jarcak
Lutz Bierbrauer
Ullrich Heisig
Rolf Pfannkuchen
Karl-Heinz Baether
Original Assignee
Teltow Elektron Bauelemente
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teltow Elektron Bauelemente filed Critical Teltow Elektron Bauelemente
Publication of FI885350A0 publication Critical patent/FI885350A0/fi
Publication of FI885350A publication Critical patent/FI885350A/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Photovoltaic Devices (AREA)
FI885350A 1987-11-18 1988-11-18 Mjukloedbart tunnskikt i en- eller flerskiktig metallisering. FI885350A (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD30916687A DD274967A3 (de) 1987-11-18 1987-11-18 Weichlötbare Dünnschicht in einer ein- oder mehrschichtigen Metallisierung

Publications (2)

Publication Number Publication Date
FI885350A0 FI885350A0 (fi) 1988-11-18
FI885350A true FI885350A (fi) 1989-05-19

Family

ID=5594019

Family Applications (1)

Application Number Title Priority Date Filing Date
FI885350A FI885350A (fi) 1987-11-18 1988-11-18 Mjukloedbart tunnskikt i en- eller flerskiktig metallisering.

Country Status (4)

Country Link
EP (1) EP0316950A3 (fi)
DD (1) DD274967A3 (fi)
DK (1) DK643688A (fi)
FI (1) FI885350A (fi)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476726A (en) * 1992-01-22 1995-12-19 Hitachi, Ltd. Circuit board with metal layer for solder bonding and electronic circuit device employing the same
US6222271B1 (en) 1997-07-15 2001-04-24 Micron Technology, Inc. Method of using hydrogen gas in sputter deposition of aluminum-containing films and aluminum-containing films derived therefrom
US5969423A (en) 1997-07-15 1999-10-19 Micron Technology, Inc. Aluminum-containing films derived from using hydrogen and oxygen gas in sputter deposition

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4463059A (en) * 1982-06-30 1984-07-31 International Business Machines Corporation Layered metal film structures for LSI chip carriers adapted for solder bonding and wire bonding
JPS60214544A (ja) * 1984-04-06 1985-10-26 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 絶縁材料に金属を密着して付着させる方法

Also Published As

Publication number Publication date
DK643688A (da) 1989-05-19
DD274967A3 (de) 1990-01-10
EP0316950A3 (de) 1990-12-05
EP0316950A2 (de) 1989-05-24
DK643688D0 (da) 1988-11-17
FI885350A0 (fi) 1988-11-18

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Legal Events

Date Code Title Description
MM Patent lapsed

Owner name: VEB ELEKTRONISCHE BAUELEMENTE " CARL VON