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FI20095340A0 - Värähtelyjä mittaavan anturin kotelointi, ja anturi värähtelyjen mittaamiseksi - Google Patents

Värähtelyjä mittaavan anturin kotelointi, ja anturi värähtelyjen mittaamiseksi

Info

Publication number
FI20095340A0
FI20095340A0 FI20095340A FI20095340A FI20095340A0 FI 20095340 A0 FI20095340 A0 FI 20095340A0 FI 20095340 A FI20095340 A FI 20095340A FI 20095340 A FI20095340 A FI 20095340A FI 20095340 A0 FI20095340 A0 FI 20095340A0
Authority
FI
Finland
Prior art keywords
sensor
vibration
enclosure
measurement
vibration measurement
Prior art date
Application number
FI20095340A
Other languages
English (en)
Swedish (sv)
Inventor
Teuvo Sillanpaeae
Anu Kaerkkaeinen
Panu Pekko
Original Assignee
Valtion Teknillinen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valtion Teknillinen filed Critical Valtion Teknillinen
Priority to FI20095340A priority Critical patent/FI20095340A0/fi
Publication of FI20095340A0 publication Critical patent/FI20095340A0/fi
Priority to PCT/FI2010/050247 priority patent/WO2010112676A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0285—Vibration sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/092—Buried interconnects in the substrate or in the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/095—Feed-through, via through the lid

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Fluid Pressure (AREA)
FI20095340A 2009-03-30 2009-03-30 Värähtelyjä mittaavan anturin kotelointi, ja anturi värähtelyjen mittaamiseksi FI20095340A0 (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20095340A FI20095340A0 (fi) 2009-03-30 2009-03-30 Värähtelyjä mittaavan anturin kotelointi, ja anturi värähtelyjen mittaamiseksi
PCT/FI2010/050247 WO2010112676A1 (en) 2009-03-30 2010-03-29 A casing of a sensor measuring oscillations, and a sensor for measuring oscillations

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20095340A FI20095340A0 (fi) 2009-03-30 2009-03-30 Värähtelyjä mittaavan anturin kotelointi, ja anturi värähtelyjen mittaamiseksi

Publications (1)

Publication Number Publication Date
FI20095340A0 true FI20095340A0 (fi) 2009-03-30

Family

ID=40510337

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20095340A FI20095340A0 (fi) 2009-03-30 2009-03-30 Värähtelyjä mittaavan anturin kotelointi, ja anturi värähtelyjen mittaamiseksi

Country Status (2)

Country Link
FI (1) FI20095340A0 (fi)
WO (1) WO2010112676A1 (fi)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2514713B1 (en) * 2011-04-20 2013-10-02 Tronics Microsystems S.A. A micro-electromechanical system (MEMS) device
EP2736071B8 (en) 2012-11-22 2017-04-19 Tronic's Microsystems S.A. Wafer level package with getter
DE102013100197A1 (de) * 2013-01-10 2014-07-10 Continental Automotive Gmbh Sensoreinheit für ein Kraftfahrzeug zur Montage auf einer Leiterplatte und Mitteln zum Dämpfen der Übertragung hochfrequenter Störungen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004364041A (ja) * 2003-06-05 2004-12-24 Fujitsu Media Device Kk 弾性表面波デバイス及びその製造方法
EP1802938B1 (en) * 2004-10-07 2015-09-09 Metis Design Corporation Sensor infrastructure with embedded electronics
JP2006156513A (ja) * 2004-11-26 2006-06-15 Sohki:Kk パッケージ用リッド及びその製造方法
JP2008244244A (ja) * 2007-03-28 2008-10-09 Sony Corp 電気機械装置および電気・電子機器
CN101796374A (zh) * 2007-09-03 2010-08-04 松下电器产业株式会社 惯性力传感器

Also Published As

Publication number Publication date
WO2010112676A1 (en) 2010-10-07

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