FI20070846L - Releliitin - Google Patents
Releliitin Download PDFInfo
- Publication number
- FI20070846L FI20070846L FI20070846A FI20070846A FI20070846L FI 20070846 L FI20070846 L FI 20070846L FI 20070846 A FI20070846 A FI 20070846A FI 20070846 A FI20070846 A FI 20070846A FI 20070846 L FI20070846 L FI 20070846L
- Authority
- FI
- Finland
- Prior art keywords
- relay connector
- relay
- connector
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
- G01R31/70—Testing of connections between components and printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006305363 | 2006-11-10 | ||
JP2006305363 | 2006-11-10 | ||
JP2007265372A JP4906666B2 (ja) | 2006-11-10 | 2007-10-11 | 中継コネクター |
JP2007265372 | 2007-10-11 |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20070846A0 FI20070846A0 (fi) | 2007-11-08 |
FI20070846L true FI20070846L (fi) | 2008-05-11 |
FI121100B FI121100B (fi) | 2010-06-30 |
Family
ID=38786633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20070846A FI121100B (fi) | 2006-11-10 | 2007-11-08 | Releliitin |
Country Status (2)
Country | Link |
---|---|
US (1) | US7656179B2 (fi) |
FI (1) | FI121100B (fi) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM354211U (en) * | 2008-09-08 | 2009-04-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
JP5393498B2 (ja) * | 2010-01-19 | 2014-01-22 | 株式会社ヨコオ | 中継コネクタ |
JP5579547B2 (ja) * | 2010-09-07 | 2014-08-27 | 株式会社ヨコオ | コネクタ接続用検査治具 |
US9113781B2 (en) | 2013-02-07 | 2015-08-25 | Siemens Aktiengesellschaft | Method and system for on-site learning of landmark detection models for end user-specific diagnostic medical image reading |
US9459312B2 (en) * | 2013-04-10 | 2016-10-04 | Teradyne, Inc. | Electronic assembly test system |
US20140340107A1 (en) * | 2013-05-17 | 2014-11-20 | Expert International Mercantile Corporation | Bga test socket |
KR101444774B1 (ko) * | 2014-03-11 | 2014-09-26 | 주식회사 티씨에스 | 전자부품 테스트용 소켓 |
CN107782923A (zh) * | 2016-08-24 | 2018-03-09 | 神讯电脑(昆山)有限公司 | 测试板对接装置 |
CN107834254B (zh) * | 2017-11-20 | 2023-09-22 | 河南思维轨道交通技术研究院有限公司 | 一种连接器后出线定位结构 |
KR102698227B1 (ko) * | 2019-05-16 | 2024-08-27 | 삼성디스플레이 주식회사 | 커넥터 |
CN110815095B (zh) * | 2019-12-13 | 2024-04-26 | 深圳奥维德机电有限公司 | 一种薄板通用加工治具 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3787768A (en) * | 1970-12-25 | 1974-01-22 | Matsushita Electric Ind Co Ltd | Inspection apparatus for printed circuit boards |
US4225819A (en) * | 1978-10-12 | 1980-09-30 | Bell Telephone Laboratories, Incorporated | Circuit board contact contamination probe |
US5572144A (en) * | 1993-02-22 | 1996-11-05 | Seagate Technology | Test jig and method for probing a printed circuit board |
GB2276281B (en) | 1993-03-03 | 1995-04-12 | Centalic Tech Dev Ltd | Testing apparatus for printed circuit boards and the like |
JPH08213128A (ja) * | 1995-02-08 | 1996-08-20 | Texas Instr Japan Ltd | ソケット |
US6046597A (en) * | 1995-10-04 | 2000-04-04 | Oz Technologies, Inc. | Test socket for an IC device |
US5788526A (en) * | 1996-07-17 | 1998-08-04 | Minnesota Mining And Manufacturing Company | Integrated circuit test socket having compliant lid and mechanical advantage latch |
JPH11183521A (ja) | 1997-12-22 | 1999-07-09 | Yokowo Co Ltd | クリップ式中継コネクタ |
US6734690B1 (en) * | 2000-04-29 | 2004-05-11 | Hewlett-Packard Development Company, L.P. | Back pressure test fixture to allow probing of integrated circuit package signals |
JP2003059602A (ja) * | 2001-08-08 | 2003-02-28 | Yamaichi Electronics Co Ltd | 半導体装置用ソケット |
US6844749B2 (en) * | 2002-07-18 | 2005-01-18 | Aries Electronics, Inc. | Integrated circuit test probe |
JP2004309441A (ja) * | 2003-02-18 | 2004-11-04 | Yamaha Corp | プローブヘッド及びその組立方法並びにプローブカード |
JP2004273192A (ja) | 2003-03-06 | 2004-09-30 | Yokowo Co Ltd | コネクタ検査用治具 |
US6856156B2 (en) * | 2003-03-26 | 2005-02-15 | Taiwan Semiconductor Manufacturing Co., Ltd | Automatically adjustable wafer probe card |
WO2005106512A1 (ja) * | 2004-04-30 | 2005-11-10 | Advantest Corporation | マニュアル試験用器具 |
JP2007294146A (ja) | 2006-04-21 | 2007-11-08 | Yamaichi Electronics Co Ltd | 位置決め治具 |
TWM312105U (en) * | 2006-05-02 | 2007-05-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
JP2008145248A (ja) * | 2006-12-08 | 2008-06-26 | Yokowo Co Ltd | 中継コネクタ |
-
2007
- 2007-11-08 US US11/979,851 patent/US7656179B2/en active Active
- 2007-11-08 FI FI20070846A patent/FI121100B/fi active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
FI121100B (fi) | 2010-06-30 |
US20080129321A1 (en) | 2008-06-05 |
US7656179B2 (en) | 2010-02-02 |
FI20070846A0 (fi) | 2007-11-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Patent granted |
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