FI20070415L - Skyddsgrundläggning - Google Patents

Skyddsgrundläggning Download PDF

Info

Publication number: FI20070415L
Authority: FI; Finland
Prior art keywords: protective earthing; earthing; protective
Prior art date: 2007-05-25

Application number

FI20070415A

Other languages

English (en)

Finnish (fi)

Other versions

FI20070415A0 (sv

Inventor

Kaija Lehtimaeki

Greta Maakangas

Mikko Heikonen

Original Assignee

Elcoteq Se

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-05-25

Filing date

2007-05-25

Publication date

2008-11-26

2007-05-25 Application filed by Elcoteq Se filed Critical Elcoteq Se

2007-05-25 Priority to FI20070415A priority Critical patent/FI20070415L/sv

2007-05-25 Publication of FI20070415A0 publication Critical patent/FI20070415A0/sv

2007-11-30 Priority to FI20070468U priority patent/FIU20070468U0/sv

2008-05-26 Priority to US12/601,716 priority patent/US20100157545A1/en

2008-05-26 Priority to CA002688334A priority patent/CA2688334A1/en

2008-05-26 Priority to BRPI0810939-7A2A priority patent/BRPI0810939A2/pt

2008-05-26 Priority to PCT/FI2008/000059 priority patent/WO2008145804A2/en

2008-05-26 Priority to MX2009012821A priority patent/MX2009012821A/es

2008-05-26 Priority to RU2009145643/07A priority patent/RU2009145643A/ru

2008-05-26 Priority to CN200880020036A priority patent/CN101755496A/zh

2008-05-26 Priority to JP2010509854A priority patent/JP2010528482A/ja

2008-11-26 Publication of FI20070415L publication Critical patent/FI20070415L/sv

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0064—Earth or grounding circuit
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Electromagnetism (AREA)
Manufacturing & Machinery (AREA)
Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Structure Of Printed Boards (AREA)

FI20070415A 2007-05-25 2007-05-25 Skyddsgrundläggning FI20070415L (sv)

Priority Applications (10)

Application Number	Priority Date	Filing Date	Title
FI20070415A FI20070415L (sv)	2007-05-25	2007-05-25	Skyddsgrundläggning
FI20070468U FIU20070468U0 (sv)	2007-05-25	2007-11-30	Störningsskydd och jordning för ett kretskort
JP2010509854A JP2010528482A (ja)	2007-05-25	2008-05-26	干渉シールド電子機器モジュール及び同モジュールを提供する方法
BRPI0810939-7A2A BRPI0810939A2 (pt)	2007-05-25	2008-05-26	Módulo eletrônico blindado contra interferências e método de seu fornecimento.
CA002688334A CA2688334A1 (en)	2007-05-25	2008-05-26	Interference shielded electronics module and method for providing the same
US12/601,716 US20100157545A1 (en)	2007-05-25	2008-05-26	Interference shielded electronics module and method for providing the same
PCT/FI2008/000059 WO2008145804A2 (en)	2007-05-25	2008-05-26	Interference shielded electronics module and method for providing the same
MX2009012821A MX2009012821A (es)	2007-05-25	2008-05-26	Modulo de aparatos electronicos protegidos contra interferencia y metodo para proporcionar el mismo.
RU2009145643/07A RU2009145643A (ru)	2007-05-25	2008-05-26	Экранированный от помех электронный модуль и способ создания такого модуля
CN200880020036A CN101755496A (zh)	2007-05-25	2008-05-26	干扰被屏蔽的电子模块及其制造方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
FI20070415A FI20070415L (sv)	2007-05-25	2007-05-25	Skyddsgrundläggning

Publications (2)

Publication Number	Publication Date
FI20070415A0 FI20070415A0 (sv)	2007-05-25
FI20070415L true FI20070415L (sv)	2008-11-26

Family

ID=38069455

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FI20070415A FI20070415L (sv)	2007-05-25	2007-05-25	Skyddsgrundläggning

Country Status (9)

Country	Link
US (1)	US20100157545A1 (sv)
JP (1)	JP2010528482A (sv)
CN (1)	CN101755496A (sv)
BR (1)	BRPI0810939A2 (sv)
CA (1)	CA2688334A1 (sv)
FI (1)	FI20070415L (sv)
MX (1)	MX2009012821A (sv)
RU (1)	RU2009145643A (sv)
WO (1)	WO2008145804A2 (sv)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP2451259A4 (en) *	2009-10-01	2013-07-03	Panasonic Corp	MODULE AND MANUFACTURING METHOD THEREFOR
JP5668627B2 (ja) *	2011-07-19	2015-02-12	株式会社村田製作所	回路モジュール
CN104602366B (zh) *	2013-10-30	2018-09-25	太阳诱电株式会社	通信模块
JP6163421B2 (ja) *	2013-12-13	2017-07-12	株式会社東芝	半導体装置、および、半導体装置の製造方法
CN105374925B (zh) *	2014-08-22	2018-07-13	无锡极目科技有限公司	一种基于无机物的led磊晶积层电路板及其制备方法
TWI572150B (zh) *	2014-10-20	2017-02-21	財團法人資訊工業策進會	信號發射裝置、訊息產生系統與信號功率調整方法
JP6443458B2 (ja) *	2015-01-30	2018-12-26	株式会社村田製作所	電子回路モジュール
CN106686932B (zh) *	2015-11-05	2019-12-13	精能医学股份有限公司	植入式电子装置的防水结构
CN115226385A (zh) *	2016-01-08	2022-10-21	北京大基康明医疗设备有限公司	一种整合机柜电场屏蔽设备
EP3232751B1 (de) *	2016-04-12	2018-07-18	MD Elektronik GmbH	Elektrische steckkupplungsvorrichtung
KR101896435B1 (ko) *	2016-11-09	2018-09-07	엔트리움 주식회사	전자파차폐용 전자부품 패키지 및 그의 제조방법
CN108976451A (zh) *	2017-06-01	2018-12-11	苏州国动环保节能科技有限公司	一种消除电器使用时产生的电磁辐射的涂料使用方法
DE102017210894A1 (de) *	2017-06-28	2019-01-03	Robert Bosch Gmbh	Elektronikmodul und Verfahren zur Herstellung eines Elektronikmoduls
RU2713650C1 (ru) *	2019-03-19	2020-02-06	Акционерное общество "Российская корпорация ракетно-космического приборостроения и информационных систем" (АО "Российские космические системы")	Устройство экранирования электронных узлов многослойной СВЧ платы от электромагнитного излучения
EP3817043A1 (en) *	2019-10-31	2021-05-05	Heraeus Deutschland GmbH & Co KG	Electromagnetic interference shielding in recesses of electronic modules
CN112867226B (zh) *	2019-11-27	2022-12-06	鹏鼎控股(深圳)股份有限公司	高频传输电路板及其制作方法
CN112770482B (zh) *	2020-12-04	2023-11-28	深圳国人无线通信有限公司	一种印制板组件及屏蔽结构
CN112908963B (zh) *	2021-01-19	2022-12-23	青岛歌尔智能传感器有限公司	基板结构、制备方法及电子产品
CN113766818A (zh) *	2021-08-06	2021-12-07	展讯通信（上海）有限公司	多层堆叠封装组件及多层组件的封装方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH073660Y2 (ja) *	1989-02-27	1995-01-30	任天堂株式会社	Ｅｍｉ対策用回路基板
JP2001339016A (ja) *	2000-05-30	2001-12-07	Alps Electric Co Ltd	面実装型電子回路ユニット
JP3718131B2 (ja) *	2001-03-16	2005-11-16	松下電器産業株式会社	高周波モジュールおよびその製造方法
US7187060B2 (en) *	2003-03-13	2007-03-06	Sanyo Electric Co., Ltd.	Semiconductor device with shield
JP2005276980A (ja)	2004-03-24	2005-10-06	Matsushita Electric Ind Co Ltd	回路部品内蔵モジュールの製造方法
WO2005099331A1 (ja) *	2004-03-30	2005-10-20	Matsushita Electric Industrial Co., Ltd.	モジュール部品およびその製造方法
JP2006286915A (ja)	2005-03-31	2006-10-19	Taiyo Yuden Co Ltd	回路モジュール
JP4614278B2 (ja) *	2005-05-25	2011-01-19	アルプス電気株式会社	電子回路ユニット、及びその製造方法

2007
- 2007-05-25 FI FI20070415A patent/FI20070415L/sv not_active Application Discontinuation
2008
- 2008-05-26 CA CA002688334A patent/CA2688334A1/en not_active Abandoned
- 2008-05-26 CN CN200880020036A patent/CN101755496A/zh active Pending
- 2008-05-26 US US12/601,716 patent/US20100157545A1/en not_active Abandoned
- 2008-05-26 WO PCT/FI2008/000059 patent/WO2008145804A2/en active Application Filing
- 2008-05-26 MX MX2009012821A patent/MX2009012821A/es not_active Application Discontinuation
- 2008-05-26 BR BRPI0810939-7A2A patent/BRPI0810939A2/pt not_active Application Discontinuation
- 2008-05-26 JP JP2010509854A patent/JP2010528482A/ja active Pending
- 2008-05-26 RU RU2009145643/07A patent/RU2009145643A/ru not_active Application Discontinuation

Also Published As

Publication number	Publication date
JP2010528482A (ja)	2010-08-19
CA2688334A1 (en)	2008-12-04
CN101755496A (zh)	2010-06-23
FI20070415A0 (sv)	2007-05-25
WO2008145804A3 (en)	2009-03-05
WO2008145804A9 (en)	2009-01-22
BRPI0810939A2 (pt)	2014-12-23
RU2009145643A (ru)	2011-06-27
WO2008145804A2 (en)	2008-12-04
US20100157545A1 (en)	2010-06-24
MX2009012821A (es)	2010-04-01

Publication	Publication Date	Title
FI20070415L (sv)	2008-11-26	Skyddsgrundläggning
DK2203462T4 (da)	2024-12-16	Nukleosid-phosphoramidat-prodrugs
DE602008006301D1 (de)	2011-06-01	Koaxialnadelanordnung
EP2161731A4 (en)	2013-11-06	PROTECTION ELEMENT
BRPI0908547A2 (pt)	2015-09-29	aparelho comutador
DE112008002196T8 (de)	2011-02-24	Abschirmleiter
DE502007001207D1 (de)	2009-09-10	Elektrosaugkopf
BRPI0910247A2 (pt)	2015-09-29	aparelho comutador
DE602008001680D1 (de)	2010-08-19	Schutzgeräte
DE602008000912D1 (de)	2010-05-20	Schaltanlage
DE502008001694D1 (de)	2010-12-16	Mitfahrhubwagen
ZA201009141B (en)	2013-05-29	Protective devices
ITBG20080007A1 (it)	2009-07-30	Dispositivo di protezione
DK2182161T3 (da)	2014-10-06	Afskærmningsindretning
DE602007013035D1 (de)	2011-04-21	Schutzschalter
FI20075024A0 (sv)	2007-01-16	Antiballistisk skyddsstruktur
ES1065400Y (es)	2008-04-01	Estructura de proteccion
SE0602365L (sv)	2008-05-08	Skyddsutrustning
ES1065873Y (es)	2008-02-16	Sabana pijama de proteccion adaptable
FI20075748A0 (sv)	2007-10-24	Skyddshöljesarrangemang
SE0700934L (sv)	2008-10-18	Skyddsanordning
FI8238U1 (sv)	2009-03-24	Droppskydd
FI8328U1 (sv)	2009-06-16	Skydd
GB0712990D0 (en)	2007-08-15	Protective devices
BRPI0814881A2 (pt)	2015-02-03	Cobertura de proteção

Legal Events

Date	Code	Title	Description
2011-04-05	FA	Application withdrawn [patent]