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FI20061165L - Cold working - Google Patents

Cold working Download PDF

Info

Publication number
FI20061165L
FI20061165L FI20061165A FI20061165A FI20061165L FI 20061165 L FI20061165 L FI 20061165L FI 20061165 A FI20061165 A FI 20061165A FI 20061165 A FI20061165 A FI 20061165A FI 20061165 L FI20061165 L FI 20061165L
Authority
FI
Finland
Prior art keywords
ablation
laser radiation
arrangement
radiation
source
Prior art date
Application number
FI20061165A
Other languages
Finnish (fi)
Swedish (sv)
Inventor
Jari Ruuttu
Reijo Lappalainen
Vesa Myllymaeki
Lasse Pulli
Juha Maekitalo
Original Assignee
Picodeon Ltd Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FI20060182A external-priority patent/FI20060182L/en
Application filed by Picodeon Ltd Oy filed Critical Picodeon Ltd Oy
Priority to FI20061165A priority Critical patent/FI20061165L/en
Priority to FI20070158A priority patent/FI20070158L/en
Priority to PCT/FI2007/000047 priority patent/WO2007096462A1/en
Publication of FI20061165L publication Critical patent/FI20061165L/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention relates to an ablation based cold work method, so that the method comprises ablating, along a predefined ablation path on an ablation target surface, to a predefined ablation depth by laser radiation having at least one characteristic wavelength and at least one pulse characteristic for each wavelength for the radiation to be used for ablation of said ablation target material, wherein the radiation from the source is directable via an optical path onto the working spot on said ablation target via a turbine scanner. The invention also relates to an ablation based cold work arrangement, so that the arrangement comprises a laser radiation source to provide the laser radiation be used in the ablation, and at least one turbine scanner arranged into the optical path arranged to lead laser radiation from said laser radiation source to the hit spot of the ablation target at the ablation path location. Such an arrangement can be used in manufacturing technology in automated systems, but also in weapon technology.
FI20061165A 2006-02-23 2006-12-29 Cold working FI20061165L (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20061165A FI20061165L (en) 2006-02-23 2006-12-29 Cold working
FI20070158A FI20070158L (en) 2006-02-23 2007-02-23 Arrangement
PCT/FI2007/000047 WO2007096462A1 (en) 2006-02-23 2007-02-23 A cold-work method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20060182A FI20060182L (en) 2005-07-13 2006-02-23 Surface treatment technology in connection with the ablation technique and surface treatment facility
FI20061165A FI20061165L (en) 2006-02-23 2006-12-29 Cold working

Publications (1)

Publication Number Publication Date
FI20061165L true FI20061165L (en) 2007-08-24

Family

ID=38169520

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20061165A FI20061165L (en) 2006-02-23 2006-12-29 Cold working

Country Status (2)

Country Link
FI (1) FI20061165L (en)
WO (1) WO2007096462A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102658076B (en) * 2012-05-11 2015-06-03 中山大学 Micro-nanometer material as well as preparation method, device and application thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4099830A (en) * 1976-12-15 1978-07-11 A. J. Bingley Limited Optical systems including polygonal mirrors rotatable about two axes
IT1179293B (en) * 1984-03-22 1987-09-16 Gd Spa DEVICE FOR DRILLING PERFORATIONS IN BAR-SHAPED ITEMS
US5736709A (en) * 1996-08-12 1998-04-07 Armco Inc. Descaling metal with a laser having a very short pulse width and high average power
KR20000026066A (en) * 1998-10-17 2000-05-06 윤종용 Rotation reflective mirror and printing device using thereof
KR100565051B1 (en) * 2002-09-16 2006-03-30 삼성전자주식회사 Optical scanning unit and electrophotographic image forming apparatus employing the same
US6852946B2 (en) * 2002-12-20 2005-02-08 Caterpillar Inc Laser-induced plasma micromachining

Also Published As

Publication number Publication date
WO2007096462A1 (en) 2007-08-30

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