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FI20045370L - Embossing device and method for determining the microstructure area produced by embossing - Google Patents

Embossing device and method for determining the microstructure area produced by embossing Download PDF

Info

Publication number
FI20045370L
FI20045370L FI20045370A FI20045370A FI20045370L FI 20045370 L FI20045370 L FI 20045370L FI 20045370 A FI20045370 A FI 20045370A FI 20045370 A FI20045370 A FI 20045370A FI 20045370 L FI20045370 L FI 20045370L
Authority
FI
Finland
Prior art keywords
embossing
produced
substrate
determining
microstructured area
Prior art date
Application number
FI20045370A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20045370A7 (en
FI20045370A0 (en
Inventor
Pekka Koivukunnas
Jarno Vehmas
Original Assignee
Avantone Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avantone Oy filed Critical Avantone Oy
Priority to FI20045370A priority Critical patent/FI20045370L/en
Publication of FI20045370A0 publication Critical patent/FI20045370A0/en
Priority to PCT/FI2005/050330 priority patent/WO2006037851A1/en
Publication of FI20045370A7 publication Critical patent/FI20045370A7/en
Publication of FI20045370L publication Critical patent/FI20045370L/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
    • G03H1/0276—Replicating a master hologram without interference recording
    • G03H1/028—Replicating a master hologram without interference recording by embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B29C59/046—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts for layered or coated substantially flat surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
    • G03H1/0236—Form or shape of the hologram when not registered to the substrate, e.g. trimming the hologram to alphanumerical shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/04—Processes or apparatus for producing holograms
    • G03H1/18—Particular processing of hologram record carriers, e.g. for obtaining blazed holograms
    • G03H2001/187—Trimming process, i.e. macroscopically patterning the hologram
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H2240/00—Hologram nature or properties
    • G03H2240/50—Parameters or numerical values associated with holography, e.g. peel strength
    • G03H2240/55—Thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

Diffractive microstructured areas (41) are produced on the surface layer (40) of a substrate (30) by pressing the substrate (30) and its surface layer (40) between an embossing member (10) and a backing member (20) to process the surface (40) of the substrate, wherein the surface of the embossing member (10) is provided with a microstructured area (11) corresponding to the microstructured area (41 ) to be produced. According to the invention, the microstructured area (11) of the embossing member (10) is, in at least one direction, wider than the microstructured area (41 ) to be produced. In an embodiment, the width (W2) of the microstructured area (41) to be produced is defined by a bulge (51) located between the substrate (30) and the backing means (20), for example by a metal sheet whose shape corresponds to the shape of the microstructured area (41) to be produced.
FI20045370A 2004-10-01 2004-10-01 Embossing device and method for determining the microstructure area produced by embossing FI20045370L (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20045370A FI20045370L (en) 2004-10-01 2004-10-01 Embossing device and method for determining the microstructure area produced by embossing
PCT/FI2005/050330 WO2006037851A1 (en) 2004-10-01 2005-09-28 Embossing device and a method for defining a micro-structured area produced by embossing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20045370A FI20045370L (en) 2004-10-01 2004-10-01 Embossing device and method for determining the microstructure area produced by embossing

Publications (3)

Publication Number Publication Date
FI20045370A0 FI20045370A0 (en) 2004-10-01
FI20045370A7 FI20045370A7 (en) 2006-04-02
FI20045370L true FI20045370L (en) 2006-04-02

Family

ID=33306092

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20045370A FI20045370L (en) 2004-10-01 2004-10-01 Embossing device and method for determining the microstructure area produced by embossing

Country Status (2)

Country Link
FI (1) FI20045370L (en)
WO (1) WO2006037851A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI122671B (en) 2005-03-09 2012-05-15 M Real Oyj Method of manufacturing a visually identifiable pattern on a substrate
ITBO20060340A1 (en) * 2006-05-09 2007-11-10 Scriba Nanotecnologie Srl DEVICE AND METHOD FOR THE CONSTRUCTION OF A STRUCTURED SUBSTRATE ON A MICROMETRIC OR NANOMETRIC SCALE
FI20065408A0 (en) * 2006-06-14 2006-06-14 Avantone Oy Embossing member for producing diffractive microstructures
FI20065407A0 (en) * 2006-06-14 2006-06-14 Avantone Oy Hard forgery hologram
US8241479B2 (en) 2008-07-10 2012-08-14 Illinois Tool Works Inc. Imaging of deep structures of reliefs for shallow relief embossing
DE102009053498A1 (en) 2009-11-16 2011-05-19 Giesecke & Devrient Gmbh laminate body
FI20126040A7 (en) * 2012-10-05 2014-04-06 Iscent Oy A method for producing micro- or nanostructures in polymeric film materials
DE102015213236A1 (en) * 2015-07-15 2017-01-19 Heidelberger Druckmaschinen Ag Plate for making holograms and method for producing the plate
DE102023102291A1 (en) * 2023-01-31 2024-08-01 Lpkf Laser & Electronics Se Forming process for producing nanostructures and a device intended for carrying out the process

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2250237B (en) * 1990-11-30 1995-02-08 Folders Galore Ltd A sheet of clear plastics material bearing an image
JPH08101630A (en) * 1994-09-30 1996-04-16 Toppan Printing Co Ltd Duplicate manufacturing method
JPH10217695A (en) * 1997-01-31 1998-08-18 Dainippon Printing Co Ltd Sheet with embossed hologram
DE10126342C1 (en) * 2001-05-30 2003-01-30 Hsm Gmbh Optical element and method for its production
EP1331084B1 (en) * 2002-01-25 2004-03-10 Leister Process Technologies Process for shaping micro and nano structures
JP2004268552A (en) * 2003-03-12 2004-09-30 Osamu Miyake Finely embossing method and device

Also Published As

Publication number Publication date
FI20045370A7 (en) 2006-04-02
WO2006037851A1 (en) 2006-04-13
FI20045370A0 (en) 2004-10-01

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