[go: up one dir, main page]

ES448545A1 - Perfeccionamientos en componentes semiconductores goberna- bles. - Google Patents

Perfeccionamientos en componentes semiconductores goberna- bles.

Info

Publication number
ES448545A1
ES448545A1 ES448545A ES448545A ES448545A1 ES 448545 A1 ES448545 A1 ES 448545A1 ES 448545 A ES448545 A ES 448545A ES 448545 A ES448545 A ES 448545A ES 448545 A1 ES448545 A1 ES 448545A1
Authority
ES
Spain
Prior art keywords
metal bodies
conically shaped
semiconductor component
lead
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES448545A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of ES448545A1 publication Critical patent/ES448545A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Thyristors (AREA)
ES448545A 1975-06-06 1976-06-04 Perfeccionamientos en componentes semiconductores goberna- bles. Expired ES448545A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752525390 DE2525390A1 (de) 1975-06-06 1975-06-06 Steuerbares halbleiterbauelement

Publications (1)

Publication Number Publication Date
ES448545A1 true ES448545A1 (es) 1977-07-01

Family

ID=5948506

Family Applications (1)

Application Number Title Priority Date Filing Date
ES448545A Expired ES448545A1 (es) 1975-06-06 1976-06-04 Perfeccionamientos en componentes semiconductores goberna- bles.

Country Status (7)

Country Link
US (1) US4041523A (es)
JP (1) JPS5231678A (es)
DE (1) DE2525390A1 (es)
ES (1) ES448545A1 (es)
FR (1) FR2313776A1 (es)
GB (1) GB1502066A (es)
IT (1) IT1060796B (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5563650A (en) * 1978-11-02 1980-05-13 Nitsupi Kousan Kk Full automatic sterilizer
US4263607A (en) * 1979-03-06 1981-04-21 Alsthom-Atlantique Snap fit support housing for a semiconductor power wafer
JPS55160437A (en) * 1979-05-31 1980-12-13 Hitachi Ltd Semiconductor device
DE3221794A1 (de) * 1982-06-09 1983-12-15 Brown, Boveri & Cie Ag, 6800 Mannheim Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente
JPS5951852A (ja) * 1982-09-17 1984-03-26 三洋電機株式会社 蒸気式滅菌器
US4587377A (en) * 1984-09-21 1986-05-06 Illinois Tool Works Inc. Electrically insulating fastener for heat sinks of different thicknesses
JP2988589B2 (ja) * 1995-12-14 1999-12-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 比較的高い電圧に適した表面実装用半導体装置及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3513361A (en) * 1968-05-09 1970-05-19 Westinghouse Electric Corp Flat package electrical device
US3525910A (en) * 1968-05-31 1970-08-25 Westinghouse Electric Corp Contact system for intricate geometry devices
US3636419A (en) * 1969-07-11 1972-01-18 Siemens Ag Pressure-biased semiconductor component free from damage to semiconductor body
BE790502A (fr) * 1971-10-26 1973-04-25 Westinghouse Electric Corp Dispositif semiconducteur encapsule a l'aide d'un elastomere
US3962719A (en) * 1974-12-05 1976-06-08 Plastronics, Inc. Mounting pad and semiconductor encapsulation device combination

Also Published As

Publication number Publication date
US4041523A (en) 1977-08-09
DE2525390A1 (de) 1976-12-16
JPS5750073B2 (es) 1982-10-25
IT1060796B (it) 1982-09-30
FR2313776A1 (fr) 1976-12-31
JPS5231678A (en) 1977-03-10
GB1502066A (en) 1978-02-22

Similar Documents

Publication Publication Date Title
US2432513A (en) Ionic discharge device
GB1526510A (en) Output power semiconductor device
GB1200206A (en) Capacitor
GB1191890A (en) Semiconductor Controlled Rectifier Devices
ES448545A1 (es) Perfeccionamientos en componentes semiconductores goberna- bles.
JPH01501049A (ja) 溶接
GB1272498A (en) X-ray tube having a metal envelope
US5569972A (en) Gas-filled lightning arrester having copper electrodes
US3876894A (en) Button overvoltage arrester with cup-shaped electrodes with different side and end wall thicknesses
GB1320989A (en) Disc cell
US2819421A (en) Electrode spacing adjustment
JPS5411487A (en) Lead conductor welding
GB1439775A (en) Gas-filled discharge tubes annular elem
GB917416A (en) Improvements in and relating to methods of securing together parts of ceramic material
US3242390A (en) Housing for controlled rectifiers
GB989977A (en) Improvements relating to closure members for semiconductor devices
GB926916A (en) Improvements in high-frequency valves
JPS54161272A (en) Flat semiconductor device
GB1039414A (en) Semiconductor devices
JPS5412496A (en) Electrically insulated terminal and method of manufacturing the same
GB980558A (en) A semi-conductor device
GB1053612A (es)
JPS55148357A (en) Electric field emission type electrode gun
JPS5637423A (en) Manufacture of glow plug
JPS57192050A (en) Package for semiconductor element