ES392536A1 - Un procedimiento para formar contactos ohmicos sobre una superficie de un dispositivo semiconductor. - Google Patents
Un procedimiento para formar contactos ohmicos sobre una superficie de un dispositivo semiconductor.Info
- Publication number
- ES392536A1 ES392536A1 ES392536A ES392536A ES392536A1 ES 392536 A1 ES392536 A1 ES 392536A1 ES 392536 A ES392536 A ES 392536A ES 392536 A ES392536 A ES 392536A ES 392536 A1 ES392536 A1 ES 392536A1
- Authority
- ES
- Spain
- Prior art keywords
- metal
- ohmic contacts
- forming ohmic
- field effect
- effect transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title abstract 2
- 230000005669 field effect Effects 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 5
- 239000004065 semiconductor Substances 0.000 abstract 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 2
- 239000012212 insulator Substances 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 1
- 239000012266 salt solution Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5050670A | 1970-06-29 | 1970-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES392536A1 true ES392536A1 (es) | 1973-10-01 |
Family
ID=21965622
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES392536A Expired ES392536A1 (es) | 1970-06-29 | 1971-06-22 | Un procedimiento para formar contactos ohmicos sobre una superficie de un dispositivo semiconductor. |
ES396549A Expired ES396549A1 (es) | 1970-06-29 | 1971-10-30 | Un procedimiento para formar conductores de haz sobre una superficie de un dispositivo semiconductor de metal y aisla-dor. |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES396549A Expired ES396549A1 (es) | 1970-06-29 | 1971-10-30 | Un procedimiento para formar conductores de haz sobre una superficie de un dispositivo semiconductor de metal y aisla-dor. |
Country Status (9)
Country | Link |
---|---|
JP (1) | JPS516502B1 (es) |
BE (1) | BE769169A (es) |
CH (1) | CH540568A (es) |
DE (1) | DE2128360A1 (es) |
ES (2) | ES392536A1 (es) |
FR (1) | FR2096553B1 (es) |
GB (1) | GB1307667A (es) |
NL (1) | NL7108904A (es) |
SE (1) | SE370144B (es) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5371802U (es) * | 1976-11-17 | 1978-06-15 | ||
DE3011660A1 (de) * | 1980-03-26 | 1981-10-01 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Mehrschichtiger ohmscher anschlusskontakt |
DE19828846C2 (de) | 1998-06-27 | 2001-01-18 | Micronas Gmbh | Verfahren zum Beschichten eines Substrats |
-
1971
- 1971-05-25 GB GB1687771A patent/GB1307667A/en not_active Expired
- 1971-06-08 DE DE19712128360 patent/DE2128360A1/de active Pending
- 1971-06-21 FR FR7122433A patent/FR2096553B1/fr not_active Expired
- 1971-06-22 ES ES392536A patent/ES392536A1/es not_active Expired
- 1971-06-24 CH CH927571A patent/CH540568A/de not_active IP Right Cessation
- 1971-06-28 BE BE769169A patent/BE769169A/xx unknown
- 1971-06-28 JP JP4709771A patent/JPS516502B1/ja active Pending
- 1971-06-28 NL NL7108904A patent/NL7108904A/xx not_active Application Discontinuation
- 1971-06-28 SE SE830771A patent/SE370144B/xx unknown
- 1971-10-30 ES ES396549A patent/ES396549A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS516502B1 (es) | 1976-02-28 |
CH540568A (de) | 1973-08-15 |
FR2096553B1 (es) | 1976-09-03 |
DE2128360A1 (de) | 1972-01-13 |
BE769169A (fr) | 1971-11-03 |
SE370144B (es) | 1974-09-30 |
NL7108904A (es) | 1971-12-31 |
GB1307667A (en) | 1973-02-21 |
FR2096553A1 (es) | 1972-02-18 |
ES396549A1 (es) | 1974-04-16 |
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