ES387979A1 - Novel precious metal sensitizing solutions - Google Patents
Novel precious metal sensitizing solutionsInfo
- Publication number
- ES387979A1 ES387979A1 ES387979A ES387979A ES387979A1 ES 387979 A1 ES387979 A1 ES 387979A1 ES 387979 A ES387979 A ES 387979A ES 387979 A ES387979 A ES 387979A ES 387979 A1 ES387979 A1 ES 387979A1
- Authority
- ES
- Spain
- Prior art keywords
- metal
- precious metal
- elements
- components
- periodic table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Procedure for the sensitization of metallic and non-metallic surfaces for the non-electrolytic deposition of metals, characterized in that the surfaces to be sensitized are exposed to a solution containing a composition of metal complexes consisting of three components, namely (a) a noble metal from the 5th or 6th periods of groups VII and IB of the periodic table of the elements or a mixture of said noble metals (b) a metal from group IV of the periodic table of the elements that is capable of having two states of valence, and (c) an anion that is capable of forming stable compositions with the group IC metal in each of its two valence states, Preferably the molar ratio of components (a), (b) and (c) being about 1: 1: 3 to 1: 6: 24. (Machine-translation by Google Translate, not legally binding)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US906070A | 1970-02-05 | 1970-02-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES387979A1 true ES387979A1 (en) | 1973-06-01 |
Family
ID=21735359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES387979A Expired ES387979A1 (en) | 1970-02-05 | 1971-02-05 | Novel precious metal sensitizing solutions |
Country Status (12)
Country | Link |
---|---|
US (1) | US3682671A (en) |
JP (3) | JPS5237971B1 (en) |
AT (1) | AT308487B (en) |
CA (1) | CA931301A (en) |
CH (1) | CH564094A5 (en) |
DE (1) | DE2105898C3 (en) |
DK (1) | DK144919C (en) |
ES (1) | ES387979A1 (en) |
FR (1) | FR2078132A5 (en) |
GB (1) | GB1306201A (en) |
NL (1) | NL165790C (en) |
SE (1) | SE427189B (en) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4662944A (en) * | 1972-07-11 | 1987-05-05 | Kollmorgen Technologies Corporation | Process and composition for sensitizing articles for metallization |
US3960573A (en) * | 1972-08-07 | 1976-06-01 | Photocircuits Division Of Kollmorgan Corporation | Novel precious metal sensitizing solutions |
CA1005808A (en) * | 1973-06-27 | 1977-02-22 | Shipley Company Inc. | Catalyst solution for electroless metal deposition on a substrate |
CA1021761A (en) * | 1973-08-01 | 1977-11-29 | Kollmorgen Corporation | Sensitizers for electroless metal deposition |
US3961109A (en) * | 1973-08-01 | 1976-06-01 | Photocircuits Division Of Kollmorgen Corporation | Sensitizers and process for electroless metal deposition |
US3993491A (en) * | 1973-12-07 | 1976-11-23 | Surface Technology, Inc. | Electroless plating |
US4004051A (en) * | 1974-02-15 | 1977-01-18 | Crown City Plating Company | Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating |
US3963841A (en) * | 1975-01-06 | 1976-06-15 | International Business Machines Corporation | Catalytic surface preparation for electroless plating |
US4239538A (en) * | 1976-03-30 | 1980-12-16 | Surface Technology, Inc. | Catalytic primer |
ZA77897B (en) * | 1976-04-13 | 1977-12-28 | Kollmorgen Corp | Liquid seeders and catalyzation processes for electroless metal deposition |
US4259113A (en) * | 1976-05-26 | 1981-03-31 | Kollmorgen Technologies Corporation | Composition for sensitizing articles for metallization |
US4066809A (en) * | 1976-06-28 | 1978-01-03 | International Business Machines Corporation | Method for preparing substrate surfaces for electroless deposition |
ZA774561B (en) * | 1976-09-20 | 1978-06-28 | Kollmorgen Tech Corp | Preparation of solid precious metal sensitizing compositions |
DE2659680C2 (en) * | 1976-12-30 | 1985-01-31 | Ibm Deutschland Gmbh, 7000 Stuttgart | Procedure for activating surfaces |
IT1107840B (en) * | 1978-07-25 | 1985-12-02 | Alfachimici Spa | CATALYTIC SOLUTION FOR ANELECTRIC METAL DEPOSITION |
JPS59500870A (en) * | 1982-05-26 | 1984-05-17 | マツクダ−ミツド インコ−ポレ−テツド | Non-conductive substrate activated catalyst solution and electroless plating method |
DE3323476A1 (en) * | 1982-07-01 | 1984-01-05 | Kollmorgen Technologies Corp., 75201 Dallas, Tex. | IMPROVED METHOD FOR GALVANIC METAL DEPOSITION ON NON-METALLIC SURFACES |
US4610895A (en) * | 1984-02-01 | 1986-09-09 | Shipley Company Inc. | Process for metallizing plastics |
US4592929A (en) * | 1984-02-01 | 1986-06-03 | Shipley Company Inc. | Process for metallizing plastics |
US4717421A (en) * | 1986-04-28 | 1988-01-05 | Mcgean-Rohco, Inc. | Solid tin-palladium catalyst for electroless deposition incorporating stannous salts of organic acids |
DE3843903C1 (en) * | 1988-12-24 | 1990-06-28 | Deutsche Automobilgesellschaft Mbh, 3000 Hannover, De | Activation solution for electrically non-conductive plastic substrate surfaces and process for the preparation thereof and the use thereof |
DE3928500A1 (en) * | 1989-08-29 | 1991-03-14 | Deutsche Automobilgesellsch | METHOD FOR WASHING AND RINSING CHEMICALLY METALLIZED SUBSTRATE RAILS |
US5292557A (en) * | 1992-11-16 | 1994-03-08 | Allied-Signal Inc. | Electroless plating of substrates |
US5418064A (en) * | 1992-11-16 | 1995-05-23 | Allied Signal Inc. | Electroless plating of substrates |
ES2155075T3 (en) * | 1993-03-18 | 2001-05-01 | Atotech Usa Inc | IMMERSION, SELF-ACCELERATING AND SELF-RENOVATING COATING METHOD, WITHOUT FORMALDEHYDE. |
US6261637B1 (en) * | 1995-12-15 | 2001-07-17 | Enthone-Omi, Inc. | Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication |
US5753304A (en) * | 1997-06-23 | 1998-05-19 | The Metal Arts Company, Inc. | Activation bath for electroless nickel plating |
PL1988192T3 (en) * | 2007-05-03 | 2013-04-30 | Atotech Deutschland Gmbh | Process for applying a metal coating to a non-conductive substrate |
JP5458758B2 (en) * | 2009-09-11 | 2014-04-02 | 上村工業株式会社 | Catalyst application solution and electroless plating method and direct plating method using the same |
EP2305856A1 (en) | 2009-09-28 | 2011-04-06 | ATOTECH Deutschland GmbH | Process for applying a metal coating to a non-conductive substrate |
EP2767614A1 (en) | 2013-02-13 | 2014-08-20 | ATOTECH Deutschland GmbH | Method for depositing a first metallic layer onto non-conductive polymers |
JP5649150B1 (en) * | 2014-07-17 | 2015-01-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Pretreatment liquid for electroless plating and electroless plating method |
CZ309565B6 (en) * | 2022-02-02 | 2023-04-12 | EGO 93 s.r.o | Sensitizing solution and preparing it |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
DE1446224B2 (en) * | 1960-09-01 | 1971-09-16 | Photocircuits Corp , Glen Cove, NY (V St A ) | ACID, Aqueous SOLUTION FOR SENSITIZING SURFACES FOR THE SUBSEQUENT ELECTRIC METAL DEPOSITION |
GB1174851A (en) * | 1967-07-05 | 1969-12-17 | Technograph Ltd | Sensitization Process for Electroless Plating |
-
1970
- 1970-02-05 US US3682671D patent/US3682671A/en not_active Expired - Lifetime
- 1970-09-02 CA CA092191A patent/CA931301A/en not_active Expired
- 1970-09-25 JP JP8458070A patent/JPS5237971B1/ja active Pending
-
1971
- 1971-01-18 GB GB232771A patent/GB1306201A/en not_active Expired
- 1971-02-01 CH CH142671A patent/CH564094A5/xx not_active IP Right Cessation
- 1971-02-01 SE SE119871A patent/SE427189B/en unknown
- 1971-02-01 AT AT81871A patent/AT308487B/en active
- 1971-02-03 FR FR7103580A patent/FR2078132A5/fr not_active Expired
- 1971-02-04 DK DK48471A patent/DK144919C/en not_active IP Right Cessation
- 1971-02-04 DE DE2105898A patent/DE2105898C3/en not_active Expired
- 1971-02-05 ES ES387979A patent/ES387979A1/en not_active Expired
- 1971-02-05 NL NL7101596A patent/NL165790C/en not_active IP Right Cessation
-
1974
- 1974-01-11 JP JP696174A patent/JPS5373429A/en active Pending
- 1974-01-11 JP JP696074A patent/JPS5426495B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE2105898B2 (en) | 1975-07-31 |
DK144919B (en) | 1982-07-05 |
NL165790B (en) | 1980-12-15 |
CH564094A5 (en) | 1975-07-15 |
DK144919C (en) | 1982-11-22 |
JPS5426495B1 (en) | 1979-09-04 |
FR2078132A5 (en) | 1971-11-05 |
CA931301A (en) | 1973-08-07 |
DE2105898A1 (en) | 1971-09-02 |
GB1306201A (en) | 1973-02-07 |
NL7101596A (en) | 1971-08-09 |
AT308487B (en) | 1973-07-10 |
NL165790C (en) | 1981-05-15 |
JPS5373429A (en) | 1978-06-29 |
DE2105898C3 (en) | 1982-08-19 |
JPS5237971B1 (en) | 1977-09-26 |
US3682671A (en) | 1972-08-08 |
SE427189B (en) | 1983-03-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19880316 |