ES328265A1 - Improvements in semiconductor elements. (Machine-translation by Google Translate, not legally binding) - Google Patents
Improvements in semiconductor elements. (Machine-translation by Google Translate, not legally binding)Info
- Publication number
- ES328265A1 ES328265A1 ES0328265A ES328265A ES328265A1 ES 328265 A1 ES328265 A1 ES 328265A1 ES 0328265 A ES0328265 A ES 0328265A ES 328265 A ES328265 A ES 328265A ES 328265 A1 ES328265 A1 ES 328265A1
- Authority
- ES
- Spain
- Prior art keywords
- translation
- machine
- legally binding
- google translate
- semiconductor elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000002184 metal Substances 0.000 abstract 3
- 229920003002 synthetic resin Polymers 0.000 abstract 3
- 239000000057 synthetic resin Substances 0.000 abstract 3
- 239000011888 foil Substances 0.000 abstract 1
- 238000012856 packing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Improvements in semiconducting elements provided with a metal-synthetic resin closure, which is composed of a metal casing open to one side and a filling or filling of synthetic resin that is cast on the open side of the metal casing, characterized because at least one packing foil is mounted on the inside of the metal casing and is surrounded on both sides with synthetic resin. (Machine-translation by Google Translate, not legally binding)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEB0082575 | 1965-06-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES328265A1 true ES328265A1 (en) | 1967-04-01 |
Family
ID=6981554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES0328265A Expired ES328265A1 (en) | 1965-06-26 | 1966-06-22 | Improvements in semiconductor elements. (Machine-translation by Google Translate, not legally binding) |
Country Status (10)
Country | Link |
---|---|
AT (1) | AT266218B (en) |
BE (1) | BE683139A (en) |
BR (1) | BR6680711D0 (en) |
CH (1) | CH437540A (en) |
DE (1) | DE1489688A1 (en) |
DK (1) | DK120030B (en) |
ES (1) | ES328265A1 (en) |
FR (1) | FR1482422A (en) |
GB (1) | GB1152493A (en) |
NL (1) | NL6608836A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2421465A1 (en) * | 1978-03-30 | 1979-10-26 | Sev Marchal | Power diode with cylindrical casing - enabling insertion into opening in plate acting as heat sink and self-centering device |
JPS61260657A (en) * | 1985-05-15 | 1986-11-18 | Mitsubishi Electric Corp | Semiconductor device |
-
1965
- 1965-06-26 DE DE19651489688 patent/DE1489688A1/en active Pending
-
1966
- 1966-06-06 FR FR64323A patent/FR1482422A/en not_active Expired
- 1966-06-07 CH CH821766A patent/CH437540A/en unknown
- 1966-06-15 AT AT572966A patent/AT266218B/en active
- 1966-06-15 GB GB26590/66A patent/GB1152493A/en not_active Expired
- 1966-06-22 ES ES0328265A patent/ES328265A1/en not_active Expired
- 1966-06-23 DK DK324666AA patent/DK120030B/en unknown
- 1966-06-24 BE BE683139D patent/BE683139A/en unknown
- 1966-06-24 BR BR180711/66A patent/BR6680711D0/en unknown
- 1966-06-24 NL NL6608836A patent/NL6608836A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
FR1482422A (en) | 1967-05-26 |
DK120030B (en) | 1971-03-29 |
CH437540A (en) | 1967-06-15 |
DE1489688A1 (en) | 1969-12-11 |
BE683139A (en) | 1966-12-01 |
AT266218B (en) | 1968-11-11 |
NL6608836A (en) | 1966-12-27 |
BR6680711D0 (en) | 1973-05-15 |
GB1152493A (en) | 1969-05-21 |
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